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C1812X393J2GALTU

Description
Multilayer Ceramic Capacitor MLCC - SMD/SMT 200volts 39nF 5% C0G
CategoryPassive components    capacitor    Ceramic capacitor    MLCC, multilayer ceramic capacitors    Multilayer ceramic capacitor MLCC - SMD/SMT   
File Size1MB,21 Pages
ManufacturerKEMET
Websitehttp://www.kemet.com
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Multilayer Ceramic Capacitor MLCC - SMD/SMT 200volts 39nF 5% C0G

C1812X393J2GALTU Parametric

Parameter NameAttribute value
MakerKEMET
Product CategoryMultilayer Ceramic Capacitor MLCC - SMD/SMT
RoHSN
terminalFlexible (Soft)
capacitance0.039 uF
Voltage ratingDC200 VDC
DielectricC0G (NP0)
Tolerance5 %
shell code - in1812
Shell code - mm4532
high1 mm
Minimum operating temperature- 55 C
Maximum operating temperature+ 125 C
productGeneral Type MLCCs
Termination typeSMD/SMT
seriesSMD Comm C0G Flex
EncapsulationReel
length4.5 mm
Package/box1812 (4532 metric)
typeCommercial and Automotive Grade Flexible Termiantion SMD MLCC
Voltage ratingAC-
width3.2 mm
Capacitance-nF39 nF
Capacitance-pF39000 pF
kindClass 1
Factory packaging quantity1000
unit weight27 mg
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), C0G Dielectric,
10 – 250 VDC (Commercial & Automotive Grade)
Overview
KEMET’s Flexible Termination (FT-CAP) Multilayer Ceramic
Capacitor in C0G dielectric incorporates a unique, flexible
termination system that is integrated with KEMET’s
standard termination materials. A conductive silver epoxy
is utilized between the base metal and nickel barrier
layers of KEMET’s standard termination system in order
to establish pliability while maintaining terminal strength,
solderability and electrical performance. This technology
was developed in order to address the primary failure
mode of MLCCs– flex cracks, which are typically the result
of excessive tensile and shear stresses produced during
board flexure and thermal cycling. Flexible termination
technology inhibits the transfer of board stress to the rigid
ceramic body, therefore mitigating flex cracks which can
result in low IR or short circuit failures.
Although this technology does not eliminate the potential
for mechanical damage that may propagate during extreme
environmental and handling conditions, it does provide
superior flex performance over standard termination
systems. FT-CAP complements KEMET’s Open Mode,
Floating Electrode (FE-CAP), Floating Electrode with
Flexible Termination (FF-CAP), and KEMET Power Solutions
(KPS) product lines by providing a complete portfolio of
flex mitigation solutions.
Combined with the stability of C0G dielectric and designed to
accommodate all capacitance requirements, these flex-robust
devices are RoHS Compliant, offer up to 5 mm of flex-bend
capability and exhibit no change in capacitance with respect
to time and voltage. Capacitance change with reference to
ambient temperature is limited to ±30 ppm/ºC from −55°C to
+125°C.
In addition to Commercial Grade, Automotive Grade devices
are available which meet the demanding Automotive
Electronics Council's AEC–Q200 qualification requirements.
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Ordering Information
C
Ceramic
1206
X
563
Capacitance
Code (pF)
Two significant digits
and number of zeros.
Use 9 for 1.0 – 9.9 pF
Use 8 for 0.5 – .99 pF
e.g., 2.2 pF = 229
e.g., 0.5 pF = 508
J
Capacitance
Tolerance
1
B = ±0.10 pF
C = ±0.25 pF
D = ±0.5 pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
3
Rated
Voltage
(VDC)
8 = 10
4 = 16
3 = 25
5 = 50
1 = 100
2 = 200
A = 250
G
Dielectric
G = C0G
A
Failure
Rate/
Design
A = N/A
C
Termination Finish
2
C = 100% Matte Sn
L = SnPb (5% Pb minimum)
TU
Packaging/
Grade (C-Spec)
See
"Packaging
C-Spec
Ordering
Options
Table"
Case Size
Specification/
(L" x W")
Series
0603
0805
1206
1210
1812
1825
2220
2225
X = Flexible
Termination
1
2
Additional capacitance tolerance offerings may be available. Contact KEMET for details.
Additional termination finish options may be available. Contact KEMET for details.
One world. One KEMET
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1062_C0G_FT-CAP_SMD • 4/15/2019
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