BYG23M
Taiwan Semiconductor
CREAT BY ART
FEATURES
- Glass passivated junction chip.
- Ideal for automated placement
- Fast switching for high efficiency
- High surge current capability
- Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
- AEC-Q101 available
High Efficient Surface Mount Rectifiers
TYPICAL APPLICATION
The superior avalanche capability of BYG23M is specially
suited for free-wheeling, clamping, snubbering,
demagnetization in power supplies and other power switching applications.
DO-214AC (SMA)
MECHANICAL DATA
Case:
DO-214AC (SMA)
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - green compound (halogen-free)
Terminal:
Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 2 whisker test
Polarity:
Indicated by cathode band
Weight:
0.064 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERSTICS
(T
A
=25°C unless otherwise noted)
PARAMETER
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current (@T
A
=65°C)
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
Maximum instantaneous forward voltage (Note 1)
@1A
Maximum reverse current @ rated VR
T
J
=25°C
T
J
=100°C
T
J
=125°C
SYMBOL
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
V
F
BYG23M
1000
700
1000
1.5
50
1.7
1
I
R
15
50
E
RSM
t
rr
C
J
R
θJA
T
J
T
STG
30
65
15
70
- 55 to +150
- 55 to +150
O
UNIT
V
V
V
A
A
V
μA
Pulse energy in avalanche mode, non repetitive
(Inductive load switch off ) T
A
=25℃, I
(BR)R
=1.23A
Maximum reverse recovery time (Note 2)
Typical junction capacitance (Note 3)
Typical thermal resistance
Operating junction temperature range
Storage temperature range
Note 1: Pulse Test with PW=300μs, 1% Duty Cycle
Note 2: Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0Volts.
mJ
ns
pF
C/W
O
O
C
C
Document Number: DS_D1411087
Version: B14
BYG23M
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
PACKING CODE
R3
R2
M2
BYG23M
F3
F2
F4
E3
E2
G
PACKING CODE
SUFFIX
PACKAGE
(Note 1)
SMA
SMA
SMA
Folded SMA
Folded SMA
Folded SMA
Clip SMA
Clip SMA
PACKING
1,800 / 7" Plastic reel
7,500 / 13" Paper reel
7,500 / 13" Plastic reel
1,800 / 7" Plastic reel
7,500 / 13" Paper reel
7,500 / 13" Plastic reel
1,800 / 7" Plastic reel
7,500 / 13" Plastic reel
Note 1: Package "SMA" and "Folded SMA" are AEC-Q101 qualified, Clip SMA doesn't.
EXAMPLE
PREFERRED
PART NO.
BYG23M R3
BYG23M R3G
PART NO.
BYG23M
BYG23M
PACKING CODE
R3
R3
G
PACKING CODE
SUFFIX
DESCRIPTION
AEC-Q101 qualified
AEC-Q101 qualified
Green compound
RATINGS AND CHARACTERISTICS CURVES
(T
A
=25°C unless otherwise noted)
FIG.1 MAXIMUM AVERAGE FORWARD CURRENT
DERATING
INSTANTANEOUS REVERSE CURRENT(μA)
FIG. 2 TYPICAL REVERSE CHARACTERISTICS
100
2
AVERAGE FORWARD CURRENT (A)
1.5
10
T
J
=125°C
1
0.5
1
0
0
25
50
75
100
125
150
T
J
=25°C
0.1
0
20
40
60
80
100
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
AMBIENT TEMPERATURE (
o
C)
FIG. 3 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
PEAK FORWARD SURGE URRENT (A)
50
40
30
20
10
0
1
10
100
8.3ms Single Half Sine Wave
JUNCTION CAPACITANCE (pF)
70
60
50
40
30
20
10
0
0.1
FIG. 4 TYPICAL JUNCTION CAPACITANCE
f=1.0MHz
Vslg=50mVp-p
1
10
100
NUMBER OF CYCLES AT 60 Hz
REVERSE VOLTAGE (V)
Document Number: DS_D1411087
Version: B14
BYG23M
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1411087
Version: B14
51mcu
京公网安备 11010802033920号
EEWORLD
