PL360
PL360 Datasheet
Description
The PL360 is a programmable modem for narrow-band Power Line Communication (PLC), able to run
any PLC protocol in the frequency band below 500 kHz.
This device has been designed to comply with FCC, ARIB, KN60 and CENELEC EN50065 regulations
matching requirements of Internet of Things and Smart Energy applications. It supports state-of-the-art
narrow-band PLC standards such as ITU G.9903 (G3-PLC
®
), ITU G.9904 (PRIME) as well as any other
narrowband PLC protocols, being at the same time a future-proof platform able to support the evolution of
these standards.
The PL360 has been conceived to be driven by external Microchip host devices, thus providing an
additional level of flexibility on the host side. The Microchip host device loads the proper PLC-protocol
firmware before modem operation and controls the PL360 modem.
Features
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Programmable Narrow-Band Power Line Communication (PLC) Modem
Integrated PLC Front End:
– PGA with automatic gain control and ADC
– DAC and transmission driver supports direct line driving or external Class-D amplifier driving
– Digital transmission level control
– Supports two independent transmission branches for the PLC signal
– Up to 500 kHz PLC signal bandwidth
Architecture
– High performance architecture combining CPU, specific co-processors for digital signal
processing and dedicated hardware accelerators for common narrow-band PLC tasks
– Dedicated SRAM memories for code and data
®
®
ARM 32-bit Cortex -M7 Core Managing PL360 System: Co-Processors, Hardware Accelerators
and Peripherals
– 216 MHz maximum frequency
– 192 kB of SRAM for data and code
– Bootloader allows loading plain programs or authenticated and encrypted programs
– 12 multiplexed GPIOs
– 1 SPI, 1 UART, 2 PWM
– Serial wire debug port
– Zero-Crossing Detection on the mains
Cryptographic Engine and Secure Boot
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•
©
2018 Microchip Technology Inc.
Datasheet
70005364A-page 1
PL360
– AES 128, 192, 256 supported
– Secure boot: supports AES-128 CMAC for authentication, AES-128 CBC for decryption
– Fuse programming control for decryption and authentication 128-bit keys
Clock Management
– 24 MHz external crystal for system clock
Power Management
– 3.3 V external supply voltage for I/O, digital and analog
– 1.25 V internal voltage regulator for the core
– Optimized power modes for specific operation profiles, including Low Power mode
Available in TQFP-48 and QFN-48 Packages
-40ºC to +85ºC Temperature Range
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•
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©
2018 Microchip Technology Inc.
Datasheet
70005364A-page 2
Table of Contents
Description.......................................................................................................................1
Features.......................................................................................................................... 1
1. PL360 Application Block Diagram............................................................................. 6
2. Block Diagram........................................................................................................... 7
3. Signal Description......................................................................................................8
4. Package and Pinout.................................................................................................11
4.1.
4.2.
4.3.
4.4.
4.5.
48–Lead TQFP Package Outline................................................................................................11
48–Lead TQFP Pinout................................................................................................................11
48–Lead QFN Package Outline..................................................................................................11
48–Lead QFN Pinout..................................................................................................................12
Pinout Specification....................................................................................................................12
5. Analog Front-End.................................................................................................... 15
5.1.
5.2.
PLC Coupling Circuitry Description............................................................................................ 15
Coupling Reference Designs......................................................................................................17
6. Power Considerations............................................................................................. 18
6.1.
6.2.
Power Supplies.......................................................................................................................... 18
Power Constraints...................................................................................................................... 18
7. Input/Output Lines................................................................................................... 20
7.1.
7.2.
General-Purpose I/O Lines.........................................................................................................20
System I/O Lines........................................................................................................................ 20
8. Bootloader............................................................................................................... 21
8.1.
8.2.
8.3.
8.4.
Description................................................................................................................................. 21
Embedded Characteristics......................................................................................................... 21
Block Diagram............................................................................................................................ 22
Functional Description................................................................................................................22
9. Serial Peripheral Interface (SPI)..............................................................................30
9.1.
9.2.
9.3.
9.4.
Description................................................................................................................................. 30
Embedded Characteristics......................................................................................................... 30
Signal Description...................................................................................................................... 30
Functional Description................................................................................................................30
10. Transmission Path................................................................................................... 33
10.1. Description................................................................................................................................. 33
10.2. Embedded Characteristics......................................................................................................... 33
10.3. Block Diagram............................................................................................................................ 33
©
2018 Microchip Technology Inc.
Datasheet
70005364A-page 3
PL360
10.4. Product Dependencies............................................................................................................... 33
11. Reception Path........................................................................................................ 35
11.1.
11.2.
11.3.
11.4.
Description................................................................................................................................. 35
Embedded Characteristics......................................................................................................... 35
Block Diagram............................................................................................................................ 35
Functional Description................................................................................................................35
12. Advanced Encryption Standard (AES).................................................................... 39
12.1. Description................................................................................................................................. 39
13. Electrical Characteristics......................................................................................... 40
13.1.
13.2.
13.3.
13.4.
13.5.
13.6.
13.7.
13.8.
Absolute Maximum Ratings........................................................................................................40
Recommended Operating Conditions........................................................................................ 40
Electrical Pinout..........................................................................................................................41
DC Characteristics..................................................................................................................... 42
Power Consumption................................................................................................................... 43
Crystal Oscillator........................................................................................................................ 44
PGA and ADC............................................................................................................................ 45
Power On Considerations.......................................................................................................... 45
14. Mechanical Characteristics......................................................................................47
14.1. TQFP48 Mechanical Characteristics..........................................................................................47
14.2. QFN48 Mechanical Characteristics............................................................................................48
15. Recommended Mounting Conditions...................................................................... 49
15.1. Conditions of Standard Reflow...................................................................................................49
15.2. Manual Soldering....................................................................................................................... 50
16. Marking....................................................................................................................51
17. Ordering Information................................................................................................52
18. Revision History.......................................................................................................53
18.1. Rev A - 06/2018......................................................................................................................... 53
The Microchip Web Site................................................................................................ 54
Customer Change Notification Service..........................................................................54
Customer Support......................................................................................................... 54
Microchip Devices Code Protection Feature................................................................. 54
Legal Notice...................................................................................................................55
Trademarks................................................................................................................... 55
Quality Management System Certified by DNV.............................................................56
©
2018 Microchip Technology Inc.
Datasheet
70005364A-page 4
PL360
Worldwide Sales and Service........................................................................................57
©
2018 Microchip Technology Inc.
Datasheet
70005364A-page 5
PCB Design
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