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HDWM-20-57-L-D-413-SM

Description
Board-to-Board & Mezzanine Connectors .050" X .100" Flex Stack, High-Temp Micro Board Stacker
CategoryThe connector    Surface plate and sandwich connector   
File Size896KB,2 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Environmental Compliance
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HDWM-20-57-L-D-413-SM Overview

Board-to-Board & Mezzanine Connectors .050" X .100" Flex Stack, High-Temp Micro Board Stacker

HDWM-20-57-L-D-413-SM Parametric

Parameter NameAttribute value
MakerSAMTEC
Product CategoryBoard-to-Board and Mezzanine Connectors
Shipping restrictionsMouser does not currently sell this product.
productHeaders
Number of locations40 Position
Pitch1.27 mm
Number of rows2 Row
Termination typeSMD/SMT
Installation angleStraight
seriesHDWM
EncapsulationBulk
applicationOptical Polarization
Contact platingGold
Shell materialLiquid Crystal Polymer (LCP)
Contact materialPhosphor Bronze
Installation styleSMD
Maximum operating temperature+ 125 C
Minimum operating temperature- 55 C
stacking height10.4902 mm
Factory packaging quantity1
F-219
DWM–20–58–G–S–427
HDWM–24–59–L–S–300–SM
DWM–06–54–G–D–360
(1.27 mm) .050"
HDWM–08–56–L–D–312-SM
DWM, HDWM SERIES
MICRO BOARD STACKER
SPECIFICATIONS
For complete specifications
see www.samtec.com?DWM
or www.samtec.com?HDWM
Insulator Material:
LCP
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Operating Temp Range:
-55 °C to +105 °C with Tin
-55 °C to +125 °C with Gold
RoHS Compliant:
Yes
Mates with:
SMS, SLM, RSM
Variable
stacker
height
PROCESSING
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0.15 mm) .006" max*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
Choice of
surface
mount or
through-hole
Ideal for high-density
“skyscraper”
board stacking
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
TYPE
STRIP
NO. PINS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
PLATING
OPTION
ROW
OPTION
STACKER
HEIGHT
OTHER
OPTION
FILE NO. E111594
01
thru
50
DWM
= 10 µ"
(0.25 µm)
Gold contact,
Matte Tin
on tail
–L
= Single
Row
–S
–“XXX”
= Stacker
Height
Example:
–250 =
(6.35 mm)
.250"
= Standard Board Spacer
= High Temp Board Spacer
HDWM
= 10 µ"
(0.25 µm)
Gold on post,
Gold flash
on tail
–G
= Double
Row
LEAD
STYLE THROUGH-
HOLE
(11.43) .450
–01
(10.41) .410
–51
(10.80) .425
–52
(12.83) .505
–53
(14.10) .555
–54
(15.49) .610
–55
(15.88) .625
–56
(16.51) .650
–57
(17.91) .705
–58
(19.18) .755
–59
(20.96) .825
–60
–61
(26.67) 1.050
–D
= Polarized
Position
(Specify position
of omitted pin)
= Surface Mount
(Requires HDWM.
02 thru 40
positions only.)
= Alignment Pin
(Requires HDWM.
6 positions min
–D only.)
Metal or plastic at
Samtec discretion
(N/A with –LC)
= Locking Clip
(Requires HDWM.
(5 positions min.
–D only)
(N/A with –A)
(Manual placement
required)
= Pick & Place Pad
(Requires HDWM)
– “XXX”
OAL
SURFACE
MOUNT
(8.38) .330
(9.78) .385
(11.05) .435
(12.45) .490
(12.83) .505
(13.46) .530
(14.86) .585
(15.62) .615
– SM
ALSO AVAILABLE
(MOQ Required)
• Other platings
(2.54)
.100
50
(1.27) .050 X
No. of Positions
–A
01
(2.48)
.098
(1.27) .050 TYP
02
100
(4.98)
.196
01
99
– LC
(0.46) .018 SQ
(0.00)
.000
MIN
Notes:
For added mechanical stability,
Samtec recommends
mechanical board spacers be
used in applications with gold or
selective gold plated connectors.
Contact ipg@samtec.com for
more information.
This Series is non-standard,
non-returnable.
(0.51)
.020
(2.54)
.100
(3.05)
.120
STACKER
HEIGHT
OAL
(5.08)
.200
MIN
(1.27)
.050
TYP
STACKER
HEIGHT
OAL
(6.35)
(1.27) .250
MIN
.050
–P
(0.51) .020 DIA
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
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