(1) Stresses above these ratings may cause permanent damage. Exposure
to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those specified is not
implied.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
(1)
PRODUCT
REF3212
REF3220
REF3225
REF3230
REF3233
REF3240
OUTPUT VOLTAGE
1.25V
2.048V
2.5V
3.0V
3.30V
4.096V
PACKAGE-LEAD
SOT23-6
SOT23-6
SOT23-6
SOT23-6
SOT23-6
SOT23-6
PACKAGE DESIGNATOR
DBV
DBV
DBV
DBV
DBV
DBV
PACKAGE MARKING
R32A
R32B
R32C
R32D
R32E
R32F
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com.
PIN CONFIGURATION
Top View
SOT23
R32x
GND_F
GND_S
ENABLE
1
2
3
6
5
4
OUT_F
OUT_S
IN
NOTE:
The location of pin 1 on the REF32xx is determined by orienting the package marking as shown in the diagram above.
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