EEWORLDEEWORLDEEWORLD

Part Number

Search

SEAF-10-05.0-S-04-2-A-K-TR

Description
Board-to-Board & Mezzanine Connectors .050" SEARAY High-Speed ​​High-Density Open-Pin-Field Array Socket
CategoryThe connector    The connector   
File Size1MB,2 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Environmental Compliance
Download Datasheet Parametric View All

SEAF-10-05.0-S-04-2-A-K-TR Overview

Board-to-Board & Mezzanine Connectors .050" SEARAY High-Speed ​​High-Density Open-Pin-Field Array Socket

SEAF-10-05.0-S-04-2-A-K-TR Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerSAMTEC
package instructionROHS COMPLIANT
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time8 weeks
Samacsys Description40 Position, .050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socke
Body/casing typeSOCKET
Connector typeBOARD STACKING CONNECTOR
Contact to complete cooperationGOLD
Contact completed and terminatedMatte Tin (Sn)
Contact point genderFEMALE
Contact materialCOPPER ALLOY
DIN complianceNO
Filter functionNO
IEC complianceNO
JESD-609 codee3
MIL complianceNO
Mixed contactsNO
Installation methodSTRAIGHT
Installation typeBOARD
Number of rows loaded4
OptionsGENERAL PURPOSE
Terminal pitch1.27 mm
Termination typeSURFACE MOUNT
Total number of contacts40
F-219
SEAF–20–05.0–S–10–2–A–K–TR
SEAF–30–05.0–S–08–2–A–K–TR
(1.27 mm) .050"
SEAF–30–05.0–S–08–2–A–LP–K–TR
SEAF SERIES
HIGH-SPEED/HIGH-DENSITY OPEN-PIN-FIELD
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAF
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Operating Temp Range:
-55 °C to +125 °C
Current Rating
(7 mm stack height):
2.7 A per pin
(10 adjacent pins powered)
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Working Voltage:
240 VAC
RoHS Compliant:
Yes
Lead-Free Solderable:
Yes
Board Mates:
SEAM, SEAMP,
SEAR, SEAMI
Cable Mates:
SEAC
Standoffs:
JSO
(1.12 mm)
.044"
NOMINAL
WIPE
Up to
500 pins
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
10 YEAR MFG
WITH 30 µ" GOLD
Low
insertion/
extraction
forces
HIGH-SPEED CHANNEL PERFORMANCE
SEAF/SEAM @ 10 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
Solder
charges
SEAF
NO. PINS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
LEAD
STYLE
–05.0
–06.0
–06.5
–07.5
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
A
OPTION
K
TR
–K
STANDARDS
• VITA 47
• VITA 57.1 FMC
• VITA 57.4 FMC+
• VITA 74 VNX
• PISMO
2
Visit www.samtec.com/standards
for more information.
–10, –15, – 20,
– 30, –40, –50
(–10 only available
in 04 row)
(–15 only available
in 04 or 10 row with
–05.0 lead style)
= 10 µ"
(0.25 µm)
Gold on
contact
area,
Matte Tin on
solder tail
–L
– 04
=Four
Rows
– 05
=Five
Rows
= Tin/Lead
Alloy
Solder Charge
–1
–2
A
(5.05)
.199
(6.05)
.238
(6.55)
.258
(7.54)
.297
DIFFERENTIAL
SIGNAL ROUTING
(1.27) .050
(1.27)
.050
NO. OF
B
ROWS
(5.66) .223
–04
–05, –06
(8.20) .323
(10.74) .423
–08
(13.28) .523
–10
= 30 µ"
(0.76 µm)
Gold on
contact
area,
Matte Tin on
solder tail
–S
– 06
=Six
Rows
= Lead-Free
Solder Charge
= Polyimide
= Latch Post
film Pick &
(–LP required
Place Pad
for SEAC
(Not
mate only)
available
(Available with
with –10 and
–05.0 lead style
–15 pins
and –04, –06, –08
with –LP
& –10 rows only) Latch post)
– LP
=Eight
Rows
– 08
– 10
=Ten
Rows
POWER/SIGNAL
APPLICATION
(1.27) .050
The above signal routing
configuration allows for
the use of 25 to 125
differential pair counts.
Contact sig@samtec.com
for specific details.
08
B
(1.27)
.050
No. of positions x
01
(1.27) .050 + (5.82) .229
(15.49)
.610
Notes:
Patented
IPC-A-610F and
IPC J-STD-001F Class 3
solder joint.
Some sizes, styles and
options are non-standard,
non-returnable.
(1.27)
.050
(1.12) .044 DIA
No. of positions x
(1.27) .050 + (3.58) .141
A
–LP
(1.78)
.070
(0.20)
.008
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
Where can I download the MSP430FR series BSL software?
Where can I download the MSP430FR series BSL software?...
clls2080000 Microcontroller MCU
I have no experience to share
If I already have the TI M3 experience to share, I wouldn't need to buy this development version. What do you think? Haha...
lonlmjs Microcontroller MCU
STM32F107 crystal oscillator problem when using Ethernet
I saw on the internet that ST's 107 tutorial said that 107 is used to provide the clock for the Ethernet controller. The crystal connected to 107 is 25MHz. Does the crystal have to be 25MHz? Or can I ...
liguangemail stm32/stm8
Address mapping problem
What is the function of MapCallerPtr and why should I use it? I still don't understand! Please give me some advice!...
tt181003 Embedded System
NXP presents new car-to-x communication platform
NXP presents new car-to-x communication platform A major milestone towards safer roadsNXP Semiconductors NV ( Nasdaq : NXPI ) recently demonstrated car-to-x (C2X) communications live on a public road ...
恩智浦半导体 Automotive Electronics

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1547  276  2522  1668  1299  32  6  51  34  27 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号