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ZA1-10-1-1.00-Z-10-1

Description
Board-to-Board and Mezzanine Connectors 1.00 mm Ultra Low Profile Micro Array
CategoryThe connector    Surface plate and sandwich connector   
File Size2MB,2 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Environmental Compliance
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ZA1-10-1-1.00-Z-10-1 Overview

Board-to-Board and Mezzanine Connectors 1.00 mm Ultra Low Profile Micro Array

ZA1-10-1-1.00-Z-10-1 Parametric

Parameter NameAttribute value
MakerSAMTEC
Product CategoryBoard-to-Board and Mezzanine Connectors
Shipping restrictionsMouser does not currently sell this product.
seriesZA1
EncapsulationBulk
Factory packaging quantity1
F-219
ZA1–30–2–1.00–Z–10
ZA1–40–2–1.00–Z–10
®
ZA1–10–2–1.00–Z–10
ZA1–20–1–1.00–Z–10–2
(1.00 mm) .0394"
ZA1 SERIES
ULTRA-LOW PROFILE MICRO ARRAYS
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?ZA1
Insulator Material:
FR4
Contact Material:
BeCu
Plating:
Au over 50 µ" (1.27 µm) Ni
Current Rating:
1 A per pin
(10 pins powered)
Operating Temp Range:
-55 °C to +105 °C
RoHS Compliant:
Yes
APPLICATION
25 g normal force
with (0.20 mm) .008"
contact deflection
Dual compression
or single compression
with solder balls
BeCu
contacts
Up to 1,024
contacts/
square inch
HIGH-SPEED CHANNEL PERFORMANCE
Note:
Solder ball parts will come
with a pick & place pad.
1 mm Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
APPLICATION
14
G b p s
Solder ball
option
(1.00 mm) .040"
height
ZA1
POSITIONS
PER ROW
TERMINATION
HEIGHT
PLATING
ROWS
SOLDER
TYPE
Dual compression or single
compression with solder balls
–10, –20,
–30, –40
= Single Compression
with Solder Balls
(–10 & –20 positions only)
–1
–2
= (1.00 mm)
.040"
Height
–1.00
= 6 µ"
(0.15 µm)
Gold in
contact
area
–Z
–10
= Ten
Rows
(Termination
–1 only)
= Lead
–1
–2
DESIGN FLEXIBILITY
The Z-Ray
®
platform is
highly-customizable:
PITCH
STACK HEIGHT
DENSITY
RUGGEDIZING
CONSTRUCTION
0.65 mm
0.50 mm to
4.00 mm
Up to 1,024
contacts/square inch
Latches, Thermal
Spreaders,
Quick-release
Spring Constraints
Multi-layer FR4
(e.g., Pitch Spreaders)
(1.07)
.042
DIA
= Dual Compression
(–10, –20, –30
& –40 positions only)
A
(5.00)
.197
(1.00)
.0394
(1.25)
.049
DIA
(11.00)
.433
= Lead-Free
A
(1.00)
.039
(2.00) .079 DIA
40 X 10 DUAL COMPRESSION
(0.20) .008 TYP
BOTH SIDES
B
(11.00)
.433
20 x 10 DUAL COMPRESSION
(1.09)
.043
B
POSITIONS
PER ROW
–10
–20
–30
A
(14.30)
.563
(24.30)
.957
(38.30)
1.508
(48.30)
1.902
B
(11.40)
.449
(21.40)
.843
N/A
N/A
(1.00)
.0394
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
20 X 10 COMPRESSION
WITH SOLDER BALLS
10 x 10 COMPRESSION
WITH SOLDER BALLS
–40
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM

ZA1-10-1-1.00-Z-10-1 Related Products

ZA1-10-1-1.00-Z-10-1 ZA1-10-1-1.00-Z-10-2 ZA1-20-1-1.00-Z-10-1
Description Board-to-Board and Mezzanine Connectors 1.00 mm Ultra Low Profile Micro Array Board-to-Board and Mezzanine Connectors 1.00 mm Ultra Low Profile Micro Array Board-to-Board and Mezzanine Connectors 1.00 mm Ultra Low Profile Micro Array
Maker SAMTEC SAMTEC SAMTEC
Product Category Board-to-Board and Mezzanine Connectors Board-to-Board and Mezzanine Connectors -
Shipping restrictions Mouser does not currently sell this product. Mouser does not currently sell this product. -
series ZA1 ZA1 -
Encapsulation Bulk Tray -
Factory packaging quantity 1 40 -

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