EEWORLDEEWORLDEEWORLD

Part Number

Search

FLE-125-01-GF-DV-K-TR

Description
Board-to-Board & Mezzanine Connectors.050" Tiger Beam Cost-effective Single Beam Socket Strip
CategoryThe connector    Surface plate and sandwich connector   
File Size733KB,2 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Environmental Compliance
Download Datasheet Parametric View All

FLE-125-01-GF-DV-K-TR Online Shopping

Suppliers Part Number Price MOQ In stock  
FLE-125-01-GF-DV-K-TR - - View Buy Now

FLE-125-01-GF-DV-K-TR Overview

Board-to-Board & Mezzanine Connectors.050" Tiger Beam Cost-effective Single Beam Socket Strip

FLE-125-01-GF-DV-K-TR Parametric

Parameter NameAttribute value
MakerSAMTEC
Product CategoryBoard-to-Board and Mezzanine Connectors
Shipping restrictionsMouser does not currently sell this product.
productSockets
Number of locations50 Position
Pitch1.27 mm
Number of rows2 Row
Termination typeSMD/SMT
Installation angleStraight
Current rating2.9 A
seriesFLE
EncapsulationReel
Contact platingGold
Shell materialLiquid Crystal Polymer (LCP)
Contact materialPhosphor Bronze
Flammability ratingUL 94 V-0
Installation styleSMD
Maximum operating temperature+ 125 C
Minimum operating temperature- 55 C
Factory packaging quantity850
F-219
FLE–110–01–G–DV
10 YEAR MFG
WITH 30 µ" GOLD
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
FLE–120–01–G–DV
FLE–150–01–G–DV
(1.27 mm) .050"
FLE SERIES
COST-EFFECTIVE RELIABLE SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts
see www.samtec.com?FLE
Insulator Material:
Black Liquid
Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au over 50 µ" (1.27 µm) Ni
Current Rating:
2.9 A per pin
(2 pins powered)
Operating Temp Range:
-55 °C to +125 °C
Insertion Depth:
(1.83 mm) .072" to
(4.37 mm) .172" or
pass-through
Normal Force:
100 grams (0.98 N)
Max Cycles:
100+
RoHS Compliant:
Yes
Board Mates:
FTSH, FTS, FW
Cable Mates:
FFMD
*
, FMTP
Tiger Beam
contact
Ideal for
pass-through
applications
Surface
mount
*
Note:
Standard FFMD callout
Available with optional
pick & place pads
(1.27 mm) .050"
micro pitch
will not mate with FLE, SFMC.
Must use gold plated callouts.
(See drawing on web.)
PROCESSING
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max
FLE
1
NO. PINS
PER ROW
01
PLATING
OPTION
DV
OPTIONS
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
02 thru 50
= 10 µ" (0.25 µm) Gold
–G
= Alignment Pin
(Metal or plastic at
Samtec discretion)
(3 positions minimum)
–A
FILE NO. E111594
= (4.25 mm) .167" DIA
Polyimide film
Pick & Place Pad
(5 positions minimum)
–K
ALSO AVAILABLE
(MOQ Required)
• Other platings
(3.33)
.131
(0.51)
.020
No. of Positions x (1.27) .050 + (0.11) .0045
(1.27)
.050
(1.27)
.050
(4.74)
.187
(6.35)
.250
x
(4.17)
.164
= Metal Pick &
Place Pad
(5 positions minimum)
–P
= Tape & Reel
–TR
–P OPTION
(4.55) (4.36)
.179 .172
(4.60)
.181
Note:
Some lengths, styles
and options are non-standard,
non-returnable.
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
Vibration information authentication
[i=s]This post was last edited by lcdi on 2020-7-6 11:53[/i]Project BackgroundAny feature can be used as an authentication factor , so vibration can certainly be used. This design will design an authe...
lcdi ST MEMS Sensor Creative Design Competition
Introduction to semiconductor packaging
[b]Abstract[/b]: There are many types of semiconductor packaging, from DIP, SOP, QFP, PGA, BGA to CSP and then SIP, with technical indicators more advanced than the previous generation. These are all ...
songbo PCB Design
Looking for part-time electronic technology developers
I have a small medical project that collects weak electrical signals from the human body, amplifies and filters interference signals, and analyzes and feeds back the collected signals. Anyone with exp...
benin Recruitment
How to use a tflash card, a nand flash, and a usb slave device controller to create a two-drive usb disk
Previously, I used a tflash card and a USB slave device controller to implement a USB flash drive. Now I want to use a tflash card, a nand flash, and a USB slave device controller to implement a USB f...
watersondf Embedded System
Share DSP281x read and write EEPROM 24C02 programming routines
The source program is as follows: /*******************************************************************/ / */ /* Module Name : GPIO */ /* File Name : main.c */ /* Function : Read and write EEPROM 24C02...
Aguilera DSP and ARM Processors
This is a soap that can't be used for bathing~~
This is a piece of soap that can't be used for bathing, a lamp design that will make you feel incredible. This soap lamp uses electromagnetic induction charging, no plug socket, no metal contact, just...
绿茶 Energy Infrastructure?

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2538  718  1194  1628  2507  52  15  25  33  51 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号