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SEAF8-10-05.0-L-04-2-K

Description
Board-to-Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed ​​High-Density Open-Pin-Field Array Socket
CategoryThe connector    The connector   
File Size1MB,2 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Environmental Compliance
Download Datasheet Parametric View All

SEAF8-10-05.0-L-04-2-K Overview

Board-to-Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed ​​High-Density Open-Pin-Field Array Socket

SEAF8-10-05.0-L-04-2-K Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSAMTEC
Reach Compliance Codecompliant
Factory Lead Time3 weeks
body width0.169 inch
body length0.545 inch
Body/casing typeSOCKET
Connector typeBOARD STACKING CONNECTOR
Contact to complete cooperationGOLD (10)
Contact completed and terminatedMatte Tin (Sn) - with Nickel (Ni) barrier
Contact point genderFEMALE
Contact materialCOPPER ALLOY
contact modeRECTANGULAR
Contact styleBELLOWED TYPE
DIN complianceNO
Filter functionNO
IEC complianceNO
Insulator colorBLACK
insulator materialLIQUID CRYSTAL POLYMER (LCP)
JESD-609 codee3
MIL complianceNO
Plug contact pitch0.032 inch
Plug informationMULTIPLE MATING PARTS AVAILABLE
Mixed contactsNO
Installation methodSTRAIGHT
Installation typeBOARD
Number of connectorsONE
PCB row number4
Number of rows loaded4
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
OptionsGENERAL PURPOSE
PCB contact patternRECTANGULAR
Plating thickness10u inch
Rated current (signal)1.3 A
reliabilityCOMMERCIAL
Terminal pitch0.8 mm
Termination typeSURFACE MOUNT
Total number of contacts40
Base Number Matches1
F-219
SEAF8–50–05.0–S–10–2–K
SEAF8–30–05.0–S–04–2–K
(0.80 mm) .0315"
SEAF8 SERIES
ULTRA-HIGH DENSITY OPEN-PIN-FIELD
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAF8
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Operating Temp Range:
-55 °C to +125 °C
Current Rating:
1.3 A per pin
(10 adjacent pins powered)
Working Voltage:
220 VAC
RoHS Compliant:
Yes
Lead-Free Solderable:
Yes
Board Mates:
SEAM8
Cable Mates:
ESCA
Standoffs:
JSO
Signal Integrity optimized
Edge Rate
®
contact
Lead-Free
solder charge
terminations
POWER/SIGNAL
APPLICATION
7 mm and 10 mm
stack heights
4, 6, 8 and
10 rows
Up to 500 I/Os
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
HIGH-SPEED CHANNEL PERFORMANCE
SEAM8/SEAF8 @ 7 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data
visit Samtec.com or contact
SIG@samtec.com
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
SEAF8
NO. PINS
PER ROW
05.0
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
K
= Polyimide
film Pick &
Place Pad
FILE NO. E111594
ALSO AVAILABLE
(MOQ Required)
• Other pin counts
–10, – 20, – 30, –40, –50
(Standard sizes)
= 10 µ"
(0.25 µm)
Gold on
contact area,
Matte Tin on
solder tail
–L
=Four Rows
– 04
– 06
– 08
– 10
= Lead-Free
Solder Charge
–2
–K
=Six Rows
MATED HEIGHT*
SEAF8
LEAD
STYLE
SEAM8 LEAD STYLE
–S02.0
–S05.0
(10.00) .394
–05.0
(7.00) .276
= 30 µ"
(0.76 µm)
Gold on
contact area,
Matte Tin on
solder tail
–S
=Eight Rows
=Ten Rows
*Processing conditions will affect
mated height.
NO. OF
ROWS
–04
A
(4.30)
.169
(6.30)
.248
(8.30)
.327
(10.30)
.406
No. of positions x
(0.80) .0315 + (5.84) .230
(0.75)
.029
06
–06
–08
A
01
–10
(1.27)
.050
Notes:
Patent Pending
Tape & Reel packaging
is standard.
Some sizes, styles and
options are non-standard,
non-returnable.
(4.57)
.180
(1.10) (1.32)
(1.32)
.043 x .052
.052 DIA
No. of positions x
(0.80) .0315 + (2.56) .101
(2.87)
.113
(0.80)
.0315
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM

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