MOTG MP3 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Embedded solution> Audio module> MOTG MP3

MOTG MP3: DescriptionAudio module MP3 mod MOTG; CategoryEmbedded solution Audio module; File Size5MB，75 Pages; Manufacturer4D Systems; Websitehttps://www.4dsystems.com.au/; Environmental Compliance

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MOTG MP3 Overview

Audio module MP3 mod MOTG

MOTG MP3 Parametric

Parameter Name	Attribute value
Maker	4D Systems
Product Category	audio module
product	MP3 Players
Output Power	3 W
Interface Type	UART
Working power voltage	5 V
Maximum operating temperature	+ 70 C
series	Modules On The Go
Minimum operating temperature	0 C
Factory packaging quantity	1
unit weight	5 g

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MOTG

Modules On The Go Series

MOTG-WiFi-ESP

MOTG-MP3

MOTG-RS232

MOTG-RS485

MOTG-BLUETOOTH

Gen4-MOTG-AC1

Gen4-MOTG-AC2

Gen4-MOTG-AC3

MOTG-BREADTOOTH

DATASHEET

Document Date: 22

March 2017

Document Revision: 1.0

Uncontrolled Copy when printed or downloaded.

Please refer to the 4D Systems website for the latest Revision of this document

www.4dsystems.com.au

4D Systems

MOTG – Modules On The Go

MOTG Introduction ........................................................................................................6

Universal MOTG Interface (UMI) ....................................................................................6

Pin Description ..................................................................................................................6

Board Dimension ...............................................................................................................7

Hardware Support ..........................................................................................................7

MOTG-BREADTOOTH ........................................................................................................7

gen4-MOTG-AC1 ...............................................................................................................8

gen4-MOTG-AC2 ...............................................................................................................8

gen4-MOTG-AC3 ...............................................................................................................8

Software Support ...........................................................................................................9

1. MOTG-WiFi-ESP ..........................................................................................................9

1.1. Description .................................................................................................................9

1.2. Features......................................................................................................................9

1.3. Before Getting Started ...............................................................................................9

1.4. Chipset Features...................................................................................................... 10

1.4.1. The ESP8266 Wi-Fi Module ..................................................................................... 10

1.5. Pins, Buttons and Solder Bridges ............................................................................ 10

1.5.1. Pin Description ........................................................................................................ 10

1.5.2. Button Description .................................................................................................. 10

1.5.3. Solder Bridge Description ........................................................................................ 10

1.6. Firmware Programming .......................................................................................... 11

1.7. Mechanical Views.................................................................................................... 14

1.8. Schematic Details .................................................................................................... 15

1.9. Specifications .......................................................................................................... 16

1.10. Hardware Revision History .................................................................................... 17

2. MOTG-MP3 .............................................................................................................. 18

2.1. Description .............................................................................................................. 18

2.2. Features................................................................................................................... 18

2.3. Before Getting Started ............................................................................................ 18

2.4. Pin and Solder Bridges ............................................................................................ 19

2.4.1. Pin Description ........................................................................................................ 19

2.4.2. Solder Bridge Description ........................................................................................ 19

2.5. Serial Commands..................................................................................................... 20

2.6. Media – micro-SD card ............................................................................................ 23

2017 4D SYSTEMS

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4D Systems

MOTG – Modules On The Go

2.7. File & Folder Structure ............................................................................................ 23

2.8. Mechanical Views.................................................................................................... 24

2.9. Schematic Details .................................................................................................... 25

2.10. Specifications ........................................................................................................ 26

2.11. Hardware Revision History .................................................................................... 27

3. MOTG-RS232 ............................................................................................................ 28

3.1. Description .............................................................................................................. 28

3.2. Features................................................................................................................... 28

3.3. Before Getting Started ............................................................................................ 28

3.4. Chipset Features...................................................................................................... 28

3.5. Pins and Solder Bridges ........................................................................................... 29

3.5.1. Pin Description ........................................................................................................ 29

3.5.2. Solder Bridge Description ........................................................................................ 29

3.6. Mechanical Views.................................................................................................... 30

3.7. Schematic Details .................................................................................................... 31

3.8. Specifications .......................................................................................................... 32

3.9. Hardware Revision History ...................................................................................... 33

4. MOTG-RS485 ............................................................................................................ 34

4.1. Description .............................................................................................................. 34

4.2. Features................................................................................................................... 34

4.3. Before Getting Started ............................................................................................ 34

4.4. Chipset Features...................................................................................................... 34

4.5. Pins and Solder Bridges ........................................................................................... 35

4.5.1. Pin Description ........................................................................................................ 35

4.5.2. Solder Bridge Description ........................................................................................ 35

4.6. Mechanical Views.................................................................................................... 36

4.7. Schematic Details .................................................................................................... 37

4.8. Specifications .......................................................................................................... 38

4.9. Hardware Revision History ...................................................................................... 39

5. MOTG-BLUETOOTH .................................................................................................. 40

5.1. Description .............................................................................................................. 40

5.2. Features................................................................................................................... 40

5.3. Before Getting Started ............................................................................................ 40

5.4. Chipset Features...................................................................................................... 40

5.4.1. The RN4870 Bluetooth Module............................................................................... 40

2017 4D SYSTEMS

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4D Systems

MOTG – Modules On The Go

5.5. Pins and Solder Bridges ........................................................................................... 41

5.5.1. Pin Description ........................................................................................................ 41

5.5.2. Solder Bridge Description ........................................................................................ 41

5.6. Firmware Programming .......................................................................................... 42

5.7. Mechanical Views.................................................................................................... 48

5.8. Schematic Details .................................................................................................... 49

5.9. Specifications .......................................................................................................... 50

5.10. Hardware Revision History .................................................................................... 51

6. gen4-MOTG-AC1....................................................................................................... 52

6.1. Description .............................................................................................................. 52

6.2. Hardware Overview ................................................................................................ 52

6.3. Pin Description ........................................................................................................ 52

6.4. Accessing pins of MOTG via gen4-PA ...................................................................... 53

6.5. Mechanical Views.................................................................................................... 54

6.6. Schematic Details .................................................................................................... 55

6.7. Hardware Revision History ...................................................................................... 56

7. gen4–MOTG–AC2 ..................................................................................................... 57

7.1. Description .............................................................................................................. 57

7.2. Hardware Overview ................................................................................................ 57

7.3. Pin Description ........................................................................................................ 57

7.3.1. MOTG Slot #1 Pin Description ................................................................................. 57

7.3.2. MOTG Slot #2 Pin Description ................................................................................. 58

7.4. Communication ....................................................................................................... 58

7.4.1. UART ....................................................................................................................... 58

7.4.2. SPI ........................................................................................................................... 58

7.4.3. I2C ........................................................................................................................... 58

7.5. Accessing MOTG pins via gen4-PA .......................................................................... 59

7.6. Mechanical Views.................................................................................................... 60

7.7. Schematic Details .................................................................................................... 61

7.8. Specifications .......................................................................................................... 62

7.9. Hardware Revision History ...................................................................................... 63

8. gen4–MOTG–AC3 ..................................................................................................... 64

8.1. Description .............................................................................................................. 64

8.2. Hardware Overview ................................................................................................ 64

8.3. Pin Description ........................................................................................................ 64

2017 4D SYSTEMS

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