EEWORLDEEWORLDEEWORLD

Part Number

Search

C0805X201K3HACTU

Description
Ceramic Capacitor, Ceramic,
CategoryPassive components    capacitor   
File Size1MB,21 Pages
ManufacturerKEMET
Websitehttp://www.kemet.com
Environmental Compliance
Download Datasheet Parametric View All

C0805X201K3HACTU Online Shopping

Suppliers Part Number Price MOQ In stock  
C0805X201K3HACTU - - View Buy Now

C0805X201K3HACTU Overview

Ceramic Capacitor, Ceramic,

C0805X201K3HACTU Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid7176092642
package instructionCHIP
Reach Compliance Codecompliant
ECCN codeEAR99
YTEOL6.95
capacitance0.0002 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high0.78 mm
JESD-609 codee3
length2 mm
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance10%
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package formSMT
method of packingTR, EMBOSSED PLASTIC, 7 INCH
positive tolerance10%
Rated (DC) voltage (URdc)25 V
size code0805
surface mountYES
Temperature characteristic codeX8R
Temperature Coefficient15% ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
width1.25 mm
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), Ultra-Stable X8R
Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Overview
KEMET’s Flexible Termination (FT-CAP) Multilayer Ceramic
Capacitor in Ultra-Stable X8R dielectric incorporates a
unique, flexible termination system that is integrated with
KEMET’s standard termination materials. A conductive
silver epoxy is utilized between the base metal and nickel
barrier layers of KEMET’s standard termination system
in order to establish pliability, while maintaining terminal
strength, solderability and electrical performance.
This technology was developed in order to address the
primary failure mode of MLCCs– flex cracks, which are
typically the result of excessive tensile and shear stresses
produced during board flexure and thermal cycling. Flexible
termination technology inhibits the transfer of board stress
to the rigid ceramic body, therefore mitigating flex cracks
which can result in low IR or short circuit failures.
Although this technology does not eliminate the potential
for mechanical damage that may propagate during extreme
environmental and handling conditions, it does provide
superior flex performance over standard termination
systems. FT-CAP complements KEMET’s Open Mode,
Floating Electrode (FE-CAP), Floating Electrode with
Flexible Termination (FF-CAP), and KEMET Power Solutions
(KPS) product lines by providing a complete portfolio of flex
mitigation solutions.
Combined with the stability of KEMET’s Ultra-Stable high
temperature dielectric technology, these flex-robust devices
are RoHS Compliant, offer up to 5 mm of flex-bend capability
and feature a 150°C maximum operating temperature.
Ultra-Stable X8R dielectric offers the same temperature
capability as conventional X8R, but without the capacitance
loss due to applied DC voltage. These devices exhibit no
change in capacitance with respect to voltage and boast a
minimal change in capacitance with reference to ambient
temperature. They are also suitable replacements for higher
capacitance and larger footprint devices that fail to offer
capacitance stability. Capacitance change with respect to
temperature is limited to ±15% from −55°C to +150°C.
In addition to Commercial Grade, Automotive Grade devices
are available which meet the demanding Automotive
Electronics Council's AEC-Q200 qualification requirements.
Ordering Information
C
1206
X
104
J
3
H
Dielectric
Reated
Capacitance
Voltage
Tolerance
(VDC)
B = ±0.10 pF
C = ±0.25 pF
D = ±0.5 pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
8 = 10
4 = 16
3 = 25
5 = 50
1 = 100
Click image above for interactive 3D content
Open PDF in Adobe Reader for full functionality
A
Failure
Rate/
Design
A=
N/A
C
Termination Finish
1
AUTO
Packaging/
Grade
(C-Spec)
See
"Packaging
C-Spec
Ordering
Options Table"
below
Case Size
Specification/
Capacitance
Ceramic
(L" x W")
Series
Code (pF)
0603
0805
1206
1210
1812
X = Flexible
Termination
Two
significant
digits +
number of
zeros.
H = Ultra-
Stable X8R
C = 100% Matte Sn
L = SnPb (5% Pb minimum)
1
1
Additional termination finish options may be available. Contact KEMET for details.
SnPb termination finish option is not available on Automotive Grade product.
One world. One KEMET
C1063_X8R_FT-CAP_SMD • 10/2/2017
1
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
What is the principle of this negative pressure module in the circuit?
The picture below shows a typical driver chip IC. I want to know what the principle of the negative pressure module in the dotted box is?...
kal9623287 Power technology
[F7 development board hero post] Advertising machine based on F7-DISCO
[i=s]This post was last edited by netlhx on 2015-8-23 11:40[/i] The function of this solution is relatively simple. The specific peripherals and functions to be implemented are as follows: 1 LTDC conf...
netlhx stm32/stm8
WinCE Serial Bluetooth
Dear experts and friends, I have a Bluetooth module connected to the UART1 (COM2) interface. The module can work normally (I sent a specific character to the module through the serial port 1, and the ...
bluemoon Embedded System
Help! Which 51 MCU can send 8M pulses using the IO port?
What should I pay attention to when sending 8M? Is there a microcontroller with ordinary functions but high speed and execution rate?...
KISS77 51mcu
The motor suddenly becomes uncontrollable after running for a while.
The motor has been running for a while and then suddenly, out of control, accelerates and then decelerates and stops. What is the reason? EMI? [[i] This post was last edited by An_Ran on 2010-7-1 18:2...
安_然 Analog electronics
Types of defects in the EMC packaging forming process
This article mainly analyzes and studies the common problems (defects) in the process of EMC packaging forming, such as unfilled, pores, pits, punching, cracking, overflow, and sticking mold, and prop...
灞波儿奔 Analogue and Mixed Signal

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2159  134  1550  2524  791  44  3  32  51  16 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号