512Mb: x8, x16 Automotive DDR2 SDRAM
Features
Automotive DDR2 SDRAM
MT47H64M8 – 16 Meg x 8 x 4 banks
MT47H32M16 – 8 Meg x 16 x 4 banks
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
V
DD
= 1.8V ±0.1V, V
DDQ
= 1.8V ±0.1V
JEDEC-standard 1.8V I/O (SSTL_18-compatible)
Differential data strobe (DQS, DQS#) option
4n-bit prefetch architecture
Duplicate output strobe (RDQS) option for x8
DLL to align DQ and DQS transitions with CK
4 internal banks for concurrent operation
Programmable CAS latency (CL)
Posted CAS additive latency (AL)
WRITE latency = READ latency - 1
t
CK
Selectable burst lengths: 4 or 8
Adjustable data-output drive strength
64ms, 8192-cycle refresh
On-die termination (ODT)
RoHS-compliant
Supports JEDEC clock jitter specification
AEC-Q100
PPAP submission
8D response time
Options
1
• Configuration
– 64 Meg x 8 (16 Meg x 8 x 4 banks)
– 32 Meg x 16 (8 Meg x 16 x 4 banks)
• FBGA package (Pb-free) – x16
– 84-ball FBGA (8mm x 12.5mm) Rev. H
• FBGA package (Pb-free) – x8
– 60-ball FBGA (8mm x 10mm) Rev. H
• Timing – cycle time
– 2.5ns @ CL = 5 (DDR2-800)
– 2.5ns @ CL = 6 (DDR2-800)
– 3.0ns @ CL = 4 (DDR2-667)
– 3.0ns @ CL = 5 (DDR2-667)
• Special options
– Standard
– Automotive grade
• Operating temperature
– Industrial (–40°C
≤
T
C
≤
+95°C;
–40°C
≤
T
A
≤
+85°C)
– Automotive (–40°C
≤
T
C
≤
+105°C)
• Revision
Note:
Marking
64M8
32M16
NF
SH
-25E
-25
-3E
-3
None
A
IT
AT
:H
1. Not all options listed can be combined to
define an offered product. Use the Part
Catalog Search on
www.micron.com
for
product offerings and availability.
PDF: 09005aef859d78b5
512MbDDR2_automotive.pdf - Rev. C 06/18 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2014 Micron Technology, Inc. All rights reserved.
512Mb: x8, x16 Automotive DDR2 SDRAM
Features
Table 1: Key Timing Parameters
Data Rate (MT/s)
Speed Grade
-25E
-25
-3E
-3
CL = 3
400
400
400
400
CL = 4
533
533
667
533
CL = 5
800
667
667
667
CL = 6
800
800
n/a
n/a
CL = 7
n/a
n/a
n/a
n/a
t
RC
(ns)
55
55
54
55
Table 2: Addressing
Parameter
Configuration
Refresh count
Row address
Bank address
Column address
64 Meg x 8
16 Meg x 8 x 4 banks
8K
A[13:0] (16K)
BA[1:0] (4)
A[9:0] (1K)
32 Meg x 16
8 Meg x 16 x 4 banks
8K
A[12:0] (8K)
BA[1:0] (4)
A[9:0] (1K)
Figure 1: 512Mb DDR2 Part Numbers
MT 47
Micron Technology
Product Family
47 = DDR SDRAM
H
32M16 NF -25E
A
IT
:H
Design Revision
:H = Design generation
Operating Temperature
IT = Industrial (–40°C to +85°C)
AT = Automotive (–40°C to +105°C)
Operating Voltage
H = 1.8V V
DD
CMOS
Special Options
(Multiple processing codes are separated
by a space and are listed in hierarchical order.)
Configuration (depth, width)
64 Meg x 8 = 64M8
32 Meg x 16 = 32M16
Package Codes
1
Pb-free
NF = 84-ball 8mm x 12.5mm FBGA
SH = 60-ball 8mm x 10.00mm FBGA
Blank = None
A = Automotive
Speed Grade
-3 = 3ns
t
CK, CL = 5
-3E = 3ns
t
CK, CL = 4
-25 = 2.5ns
t
CK, CL = 6
-25E = 2.5ns
t
CK, CL = 5
Note:
1. Not all speeds and configurations are available in all packages.
PDF: 09005aef859d78b5
512MbDDR2_automotive.pdf - Rev. C 06/18 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2014 Micron Technology, Inc. All rights reserved.
512Mb: x8, x16 Automotive DDR2 SDRAM
Features
FBGA Part Number System
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. For a quick conversion of an FBGA code, see the FBGA Part Marking Decoder on Micron’s Web site:
http://www.micron.com.
PDF: 09005aef859d78b5
512MbDDR2_automotive.pdf - Rev. C 06/18 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2014 Micron Technology, Inc. All rights reserved.
512Mb: x8, x16 Automotive DDR2 SDRAM
Features
Contents
Important Notes and Warnings ......................................................................................................................... 9
State Diagram .................................................................................................................................................. 9
Functional Description ................................................................................................................................... 10
Industrial Temperature ............................................................................................................................... 11
Automotive Temperature ............................................................................................................................ 11
General Notes ............................................................................................................................................ 12
Functional Block Diagrams ............................................................................................................................. 13
Ball Assignments and Descriptions ................................................................................................................. 15
Packaging ...................................................................................................................................................... 19
Package Dimensions ................................................................................................................................... 19
FBGA Package Capacitance ......................................................................................................................... 21
Electrical Specifications – Absolute Ratings ..................................................................................................... 22
Temperature and Thermal Impedance ........................................................................................................ 22
Electrical Specifications – I
DD
Parameters ........................................................................................................ 25
I
DD
Specifications and Conditions ............................................................................................................... 25
I
DD7
Conditions .......................................................................................................................................... 25
AC Timing Operating Specifications ................................................................................................................ 28
AC and DC Operating Conditions .................................................................................................................... 38
ODT DC Electrical Characteristics ................................................................................................................... 38
Input Electrical Characteristics and Operating Conditions ............................................................................... 39
Output Electrical Characteristics and Operating Conditions ............................................................................. 42
Output Driver Characteristics ......................................................................................................................... 44
Power and Ground Clamp Characteristics ....................................................................................................... 48
AC Overshoot/Undershoot Specification ......................................................................................................... 49
Input Slew Rate Derating ................................................................................................................................ 51
Commands .................................................................................................................................................... 64
Truth Tables ............................................................................................................................................... 64
DESELECT ................................................................................................................................................. 68
NO OPERATION (NOP) ............................................................................................................................... 69
LOAD MODE (LM) ...................................................................................................................................... 69
ACTIVATE .................................................................................................................................................. 69
READ ......................................................................................................................................................... 69
WRITE ....................................................................................................................................................... 69
PRECHARGE .............................................................................................................................................. 70
REFRESH ................................................................................................................................................... 70
SELF REFRESH ........................................................................................................................................... 70
Mode Register (MR) ........................................................................................................................................ 70
Burst Length .............................................................................................................................................. 71
Burst Type .................................................................................................................................................. 72
Operating Mode ......................................................................................................................................... 72
DLL RESET ................................................................................................................................................. 72
Write Recovery ........................................................................................................................................... 73
Power-Down Mode ..................................................................................................................................... 73
CAS Latency (CL) ........................................................................................................................................ 74
Extended Mode Register (EMR) ....................................................................................................................... 75
DLL Enable/Disable ................................................................................................................................... 76
Output Drive Strength ................................................................................................................................ 76
DQS# Enable/Disable ................................................................................................................................. 76
RDQS Enable/Disable ................................................................................................................................. 76
Output Enable/Disable ............................................................................................................................... 76
PDF: 09005aef859d78b5
512MbDDR2_automotive.pdf - Rev. C 06/18 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2014 Micron Technology, Inc. All rights reserved.
512Mb: x8, x16 Automotive DDR2 SDRAM
Features
On-Die Termination (ODT) ......................................................................................................................... 77
Off-Chip Driver (OCD) Impedance Calibration ............................................................................................ 77
Posted CAS Additive Latency (AL) ................................................................................................................ 77
Extended Mode Register 2 (EMR2) ................................................................................................................... 79
Extended Mode Register 3 (EMR3) ................................................................................................................... 80
Initialization .................................................................................................................................................. 81
ACTIVATE ...................................................................................................................................................... 84
READ ............................................................................................................................................................. 86
READ with Precharge .................................................................................................................................. 90
READ with Auto Precharge .......................................................................................................................... 92
WRITE ........................................................................................................................................................... 97
PRECHARGE ................................................................................................................................................. 107
REFRESH ...................................................................................................................................................... 108
SELF REFRESH .............................................................................................................................................. 109
Power-Down Mode ........................................................................................................................................ 111
Precharge Power-Down Clock Frequency Change ........................................................................................... 118
Reset ............................................................................................................................................................. 119
CKE Low Anytime ...................................................................................................................................... 119
ODT Timing .................................................................................................................................................. 121
MRS Command to ODT Update Delay ........................................................................................................ 123
Revision History ............................................................................................................................................ 128
Rev. C – 06/18 ............................................................................................................................................ 128
Rev. B – 11/14 ............................................................................................................................................ 128
Rev. A – 04/14 ............................................................................................................................................ 128
PDF: 09005aef859d78b5
512MbDDR2_automotive.pdf - Rev. C 06/18 EN
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2014 Micron Technology, Inc. All rights reserved.
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