VIPER
®
Hi-Speed, High Density
Modular Interconnects
VITA 46, VITA 48 & VITA 60 FOOTPRINT COMPATIBLE
The VIPER
®
Connector is a shielded, high-density,
hi-speed modular interconnect with
press-fit termination.
Amphenol Backplane Systems* developed the
VIPER interconnect platform to meet or exceed
future avionic high-level requirements such as:
•
High-level vibration and mechanical shock
protection
•
Condensing moisture resistance
•
Ruggedization in packaging that can scale to
higher bandwidths without costly and time-
consuming chassis redesigns. The VIPER
connector platform offers the ability to scale from 80
Mbps to over 10 Gb/s while retaining the same Vita 46
platform slot pitch at 20.3mm to 25.4mm.
Amphenol
Backplane Systems
VIPER
®
Module Connector on a Board
Key Features of VIPER
®
•
Fully footprint-compatible with VITA 60, VITA 46 and
VITA 48 standards
•
Hi-Speed: the VIPER is designed for 10 + Gb/s data
rate performance
• 100 ohm impedance for differential pair configuration
•
The daughtercard assembly is optimized for
differential pair architecture on a 1.8mm x 1.35mm grid.
•
The daughtercard is waferized, and provides single-ended and
power wafer options integrated onto a stainless steel stiffener
with stainless steel frame** and keying elements
•
The backplane has signal contacts that incorporate a highly
reliable 4-point-of-contact beam design, and ground contacts
which are robust compliant pin & contact fork design
•
±0.52mm nom. translation in fully mated condition
•
ESD protection supports 2-level maintenance designs
•
Flexible modular design is ideal for standard 3U and 6U
applications, as well as unique custom configurations
incorporating RF and fiber optic MT solutions
VIPER
®
Backplane Closeup
Amphenol’s VIPER
®
Interconnect is Designed in
accordance with the VPX Technology Roadmap
VIPER
®
Module Closeup
Overmolded Wafers that Populate the Module
Note: VPX Tecnology Roadmap, VPX and Open VPX Logos are copywrite of VITA
* Consult Amphenol Backplane Systems for more information on VIPER
®
Interconnects:
Amphenol Backplane Systems, 18 Celina Avenue, Nashua, NH 03063
Phone: 603-883-5100. Website: www.amphenol-abs.com
** Light-weight alternative available; consult Amphenol-Backplane Systems.
Compliant Pin
Contacts
Fork & Blade
Contacts
VIPER
®
Hi-Speed, High Density
Modular Interconnects (VITA 60)
SPECIFICATIONS
VIPER
®
Electrical Specifications
•
Data Rate: 10 Gbps
•
Differential Impedance: 100 ohms
•
Differential Insertion Loss: –5 dB up to 5 GHz
(10 Gbps)
•
Differential Return Loss: – 5 dB up to 5 GHz
(10 Gbps)
•
Far End Crosstalk: –35 dB up to 8 GHz
•
Near End Crosstalk: –33 dB up to 8 GHz
•
Signal Contacts: 1 amp
•
Power Wafer: 12 amps per wafer at 30° C T-Rise
•
Compliant Pin to Plated Through Hole
Resistance: 1 milliohm max
•
Dielectric Withstanding Voltage:
500 volts RMS
•
Insulation Resistance: 1000
megohms
Amphenol
Backplane Systems
Backplane Assembly
with VIPER
®
Backplane Connectors (also has a
Brush Rack & Panel Connector Pair on left side)
One VIPER
®
Backplane
on a Board
VIPER
®
Mechanical
Specifications
•
Signal and Ground Contact:
• Normal Force: 85 grams per
beam
• Engagement force: 45 grams max, 35 grams typical
• Separation force: 30 grams max, 25 grams typical
• Durability: 500 cycles minimum
•
Backplane Signal and Ground Compliant Pin:
• Insertion Force: 4.9 kilograms maximum; 1.5 kilograms
to 4.9 kilograms depending on the surface finish of PCB
• Retention Force: 1.4 kilograms minimum
•
Daughtercard Wafer Compliant Pin:
• Insertion Force: 1.8 kilograms to 3.6 kilograms depending
on the surface finish of PCB
• Retention Force: 1.6 kilograms minimum
•
Radial hole wall deformation: 0.04mm per side measured
from drilled hole
•
Axial hole wall deformation: 0.03mm measured in the
vertical plane
•
Translation: ±0.52mm nom. fully mated
•
Slot Pitch: 20.30mm
Six VIPER
®
Backplane Connectors on a Board and one Mating
Viper
®
Module above
VIPER
®
Materials and Finishes
VIPER
®
Environmental Specifications
•
Temperature: ›55°C to 125°C
• Random Vibration: 90 minutes per X, Y and Z axis at
0.6 G
2
/Hz
• Mechanical Shock: 50 G’rms in Y axis, 80 G’rms in X
and Z axis, 11 milliseconds, half sine
•
Temperature Life: 1000 hours at 125°C
Printed Circuit Board Specifications
•
Minimum Backplane and Daughtercard thickness:
1.85mm and 1.53mm
•
Daughtercard pattern primary drilled hole size: 0.55mm
• Daughtercard pattern finished hole size: 0.46 ±0.05mm
•
Backplane pattern primary drilled hole size: 0.65mm
• Backplane pattern finished hole size: 0.56 ±0.05mm
Rev. 2. Printed Jan. 2011
Backplane Signal and Ground Contacts:
C7025 copper
alloy, 0.23mm. Finish is 0.00127mm nickel minimum all over
per SAE-AMS-QQ-N-290, Class I. Selective 0.00127mm gold
minimum per ASTM-B488, Type II, Grade C, Class 1.27 in
the mating area. 0.0076mm 60/40 reflowed tin/lead minimum
selectively plated in the compliant pin area.
Differential, Power, and Single-ended Daughtercard
Wafer Leadframes:
C7025 copper alloy, 0.38mm. Finish is
0.00127mm nickel minimum all over per SAEAMS-QQ-N-290,
class I. Selective 0.00127 gold minimum per ASTM-B488,
Type II, Grade C, Class 1.27 in the mating area. 0.0076mm
60/40 reflowed tin/lead minimum selectively plated in the com-
pliant pin area.
Backplane Insulators and Daughtercard Wafer Insert Mold
Material:
Glass reinforced polyester (Liquid Crystal Polymer),
UL 94V-0, color black.
Front and Rear Stiffeners:
Stainless steel, 0.6mm, Type 301,
1/2 Hard. finish per Mill 2B.
Backplane Guide Pin:
Stainless steel, Type 303, passivated.
Daughtercard Connector Header* and Keying Compo-
nents:
Stainless steel, Type 440, passivated.
* Light-weight aluminum header version available; consult Amphenol
Backplane Systems
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