MT41K128M16JT-125 AIT:K TR datasheet, PDF

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MT41K128M16JT-125 AIT:K TR: DescriptionDynamic Random Access Memory DDR3 2G 128MX16 FBGA; Categorysemiconductor Memory IC Dynamic random access memory; File Size3MB，213 Pages; ManufacturerMicron; Websitehttp://www.micron.com/; Environmental Compliance

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MT41K128M16JT-125 AIT:K TR Overview

Dynamic Random Access Memory DDR3 2G 128MX16 FBGA

MT41K128M16JT-125 AIT:K TR Parametric

Parameter Name	Attribute value
Maker	Micron
Product Category	dynamic random access memory
type	SDRAM - DDR3L
Data bus width	16 bit
organize	128 M x 16
Package/box	FBGA-96
storage	2 Gbit
Supply voltage - max.	1.45 V
Supply voltage - min.	1.283 V
Minimum operating temperature	- 40 C
Maximum operating temperature	+ 95 C
series	MT41K
Encapsulation	Cut Tape
Encapsulation	MouseReel
Encapsulation	Reel
Installation style	SMD/SMT
Factory packaging quantity	2000

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2Gb: x8, x16 Automotive DDR3L SDRAM

Description

1.35V Automotive DDR3L SDRAM

MT41K256M8 – 32 Meg x 8 x 8 banks

MT41K128M16 – 16 Meg x 16 x 8 banks

Description

The 1.35V DDR3L SDRAM device is a low-voltage ver-

sion of the 1.5V DDR3 SDRAM device. Refer to the

DDR3 (1.5V) SDRAM data sheet specifications when

running in 1.5V compatible mode.

•

Output driver calibration

AEC-Q100

PPAP submission

8D response time

Options

• Configuration

– 256 Meg x 8

– 128 Meg x 16

• FBGA package (Pb-free)

– 78-ball FBGA (8mm x 10.5mm)

– x8

– 96-ball FBGA (8mm x 14mm)

– x16

• Timing – cycle time

– 1.07ns @ CL = 13 (DDR3-1866)

– 1.25ns @ CL = 11 (DDR3-1600)

– 1.5ns @ CL = 9 (DDR3-1333)

– 1.875ns @ CL = 7 (DDR3-1066)

• Product certification

– Automotive

• Operating temperature

– Industrial (–40°C T

+95°C)

– Automotive (–40°C T

+105°C)

– Ultra-high (–40°C T

+125°C)

• Revision

Notes:

Marking

256M8

128M16

Features

•

= V

DDQ

= 1.35V (1.283–1.45V)

Backward-compatible to V

= V

DDQ

= 1.5V ±0.075V

Differential bidirectional data strobe

8n-bit prefetch architecture

Differential clock inputs (CK, CK#)

8 internal banks

Nominal and dynamic on-die termination (ODT)

for data, strobe, and mask signals

Programmable CAS (READ) latency (CL)

Programmable posted CAS additive latency (AL)

Programmable CAS (WRITE) latency (CWL)

Fixed burst length (BL) of 8 and burst chop (BC) of 4

(via the mode register set [MRS])

Selectable BC4 or BL8 on-the-fly (OTF)

Self refresh mode

Refresh maximum interval time at T

temperature

range

– 64ms at –40°C to +85°C

– 32ms at +85°C to +105°C

– 16ms at +105°C to +115°C

– 8ms at +115°C to +125°C

Self refresh temperature (SRT)

Automatic self refresh (ASR)

Write leveling

Multipurpose register

-107

-125

-15E

-187E

•

1. Not all options listed can be combined to

define an offered product. Use the part cat-

alog search on

http://www.micron.com for available offer-

ings.

2. Contact Micron sales for AEC-Q100 gap re-

port.

3. The UT option use based on automotive us-

age model. Please contact Micron sales rep-

resentative if you have questions. The UT

option is not available for -107 speed grade.

Table 1: Key Timing Parameters

Speed Grade

-107

1, 2, 3

-125

1, 2

Data Rate (MT/s)

1866

1600

Target

RCD-

RP-CL

13-13-13

11-11-11

RCD

(ns)

CL (ns)

13.91

13.75

13.91

13.75

13.91

13.75

09005aef85741711

2Gb_auto_DDR3L.pdf - Rev. C 3/18 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Products and specifications discussed herein are subject to change by Micron without notice.

2Gb: x8, x16 Automotive DDR3L SDRAM

Description

Contents

Important Notes and Warnings ....................................................................................................................... 12

State Diagram ................................................................................................................................................ 13

Functional Description ................................................................................................................................... 14

Industrial Temperature ............................................................................................................................... 14

Automotive Temperature ............................................................................................................................ 14

Ultra-high Temperature .............................................................................................................................. 15

General Notes ............................................................................................................................................ 15

Functional Block Diagrams ............................................................................................................................. 16

Ball Assignments and Descriptions ................................................................................................................. 18

Package Dimensions ....................................................................................................................................... 24

Electrical Specifications .................................................................................................................................. 26

Absolute Ratings ......................................................................................................................................... 26

Input/Output Capacitance .......................................................................................................................... 27

Thermal Characteristics .................................................................................................................................. 28

Electrical Specifications – I

Specifications and Conditions ............................................................................ 30

Electrical Characteristics – I

Specifications .................................................................................................. 41

Electrical Specifications – DC and AC .............................................................................................................. 43

DC Operating Conditions ........................................................................................................................... 43

Input Operating Conditions ........................................................................................................................ 44

DDR3L 1.35V AC Overshoot/Undershoot Specification ................................................................................ 48

DDR3L 1.35V Slew Rate Definitions for Single-Ended Input Signals .............................................................. 52

DDR3L 1.35V Slew Rate Definitions for Differential Input Signals ................................................................. 54

ODT Characteristics ....................................................................................................................................... 55

1.35V ODT Resistors ................................................................................................................................... 56

ODT Sensitivity .......................................................................................................................................... 57

ODT Timing Definitions ............................................................................................................................. 57

Output Driver Impedance ............................................................................................................................... 61

34 Ohm Output Driver Impedance .............................................................................................................. 62

DDR3L 34 Ohm Driver ................................................................................................................................ 63

DDR3L 34 Ohm Output Driver Sensitivity .................................................................................................... 64

DDR3L Alternative 40 Ohm Driver ............................................................................................................... 65

DDR3L 40 Ohm Output Driver Sensitivity .................................................................................................... 65

Output Characteristics and Operating Conditions ............................................................................................ 67

Reference Output Load ............................................................................................................................... 70

Slew Rate Definitions for Single-Ended Output Signals ................................................................................. 70

Slew Rate Definitions for Differential Output Signals .................................................................................... 72

Speed Bin Tables ............................................................................................................................................ 73

Electrical Characteristics and AC Operating Conditions ................................................................................... 77

Command and Address Setup, Hold, and Derating ........................................................................................... 96

Data Setup, Hold, and Derating ...................................................................................................................... 103

Commands – Truth Tables ............................................................................................................................. 112

Commands ................................................................................................................................................... 115

DESELECT ................................................................................................................................................ 115

NO OPERATION ........................................................................................................................................ 115

ZQ CALIBRATION LONG ........................................................................................................................... 115

ZQ CALIBRATION SHORT .......................................................................................................................... 115

ACTIVATE ................................................................................................................................................. 115

READ ........................................................................................................................................................ 115

WRITE ...................................................................................................................................................... 116

PRECHARGE ............................................................................................................................................. 117

09005aef85741711

2Gb_auto_DDR3L.pdf - Rev. C 3/18 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

2Gb: x8, x16 Automotive DDR3L SDRAM

Description

REFRESH .................................................................................................................................................. 117

SELF REFRESH .......................................................................................................................................... 118

DLL Disable Mode ..................................................................................................................................... 119

Input Clock Frequency Change ...................................................................................................................... 123

Write Leveling ............................................................................................................................................... 125

Write Leveling Procedure ........................................................................................................................... 127

Write Leveling Mode Exit Procedure ........................................................................................................... 129

Initialization ................................................................................................................................................. 130

Voltage Initialization/Change ........................................................................................................................ 132

Voltage Switching ............................................................................................................................... 133

Mode Registers .............................................................................................................................................. 134

Mode Register 0 (MR0) ................................................................................................................................... 135

Burst Length ............................................................................................................................................. 135

Burst Type ................................................................................................................................................. 136

DLL RESET ................................................................................................................................................ 137

Write Recovery .......................................................................................................................................... 138

Precharge Power-Down (Precharge PD) ...................................................................................................... 138

CAS Latency (CL) ....................................................................................................................................... 138

Mode Register 1 (MR1) ................................................................................................................................... 140

DLL Enable/DLL Disable ........................................................................................................................... 140

Output Drive Strength ............................................................................................................................... 141

OUTPUT ENABLE/DISABLE ...................................................................................................................... 141

TDQS Enable ............................................................................................................................................. 141

On-Die Termination .................................................................................................................................. 142

WRITE LEVELING ..................................................................................................................................... 142

POSTED CAS ADDITIVE Latency ................................................................................................................ 142

Mode Register 2 (MR2) ................................................................................................................................... 143

CAS Write Latency (CWL) ........................................................................................................................... 144

AUTO SELF REFRESH (ASR) ....................................................................................................................... 144

SELF REFRESH TEMPERATURE (SRT) ........................................................................................................ 145

SRT vs. ASR ............................................................................................................................................... 145

DYNAMIC ODT ......................................................................................................................................... 145

Mode Register 3 (MR3) ................................................................................................................................... 146

MULTIPURPOSE REGISTER (MPR) ............................................................................................................ 146

MPR Functional Description ...................................................................................................................... 147

MPR Register Address Definitions and Bursting Order ................................................................................. 148

MPR Read Predefined Pattern .................................................................................................................... 153

MODE REGISTER SET (MRS) Command ........................................................................................................ 153

ZQ CALIBRATION Operation ......................................................................................................................... 154

ACTIVATE Operation ..................................................................................................................................... 155

READ Operation ............................................................................................................................................ 157

WRITE Operation .......................................................................................................................................... 168

DQ Input Timing ....................................................................................................................................... 176

PRECHARGE Operation ................................................................................................................................. 178

SELF REFRESH Operation .............................................................................................................................. 178

Extended Temperature Usage ........................................................................................................................ 180

Power-Down Mode ........................................................................................................................................ 181

RESET Operation ........................................................................................................................................... 189

On-Die Termination (ODT) ............................................................................................................................ 191

Functional Representation of ODT ............................................................................................................. 191

Nominal ODT ............................................................................................................................................ 191

Dynamic ODT ............................................................................................................................................... 193

09005aef85741711

2Gb_auto_DDR3L.pdf - Rev. C 3/18 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

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