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R1WV6416RBG-5SI#S0

Description
Static random access memory 64M MCP (2x32M) adv.Sram 3V FBGA 55NS WTR
Categorystorage    storage   
File Size150KB,21 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Environmental Compliance
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R1WV6416RBG-5SI#S0 Overview

Static random access memory 64M MCP (2x32M) adv.Sram 3V FBGA 55NS WTR

R1WV6416RBG-5SI#S0 Parametric

Parameter NameAttribute value
Brand NameRenesas
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerRenesas Electronics Corporation
Parts packaging codeTFBGA
package instructionTFBGA, BGA48,6X8,30
Contacts48
Manufacturer packaging codePTBG0048HG-A48
Reach Compliance Codecompliant
Maximum access time55 ns
Spare memory width8
I/O typeCOMMON
JESD-30 codeR-PBGA-B48
length11 mm
memory density67108864 bit
Memory IC TypeSTANDARD SRAM
memory width16
Number of functions1
Number of terminals48
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize4MX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Encapsulate equivalent codeBGA48,6X8,30
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
power supply3/3.3 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum standby current0.000024 A
Minimum standby current2 V
Maximum slew rate0.06 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.75 mm
Terminal locationBOTTOM
width8.5 mm
R1WV6416R Series
64Mb Advanced LPSRAM (4M word x 16bit / 8M word x 8bit)
REJ03C0368-0100
Rev.1.00
2009.05.07
Description
The R1WV6416R Series is a family of low voltage 64-Mbit static RAMs organized as 4,194,304-word by
16-bit, fabricated by Renesas’s high-performance 0.15um CMOS and TFT technologies.
The R1WV6416R Series is suitable for memory applications where a simple interfacing, battery operating
and battery backup are the important design objectives.
The R1WV6416R Series is provided in 48-pin thin small outline package [TSOP (I): 12mm x 20mm with
pin pitch of 0.5mm], 52-pin micro thin small outline package [
µ
TSOP (II): 10.79mm x 10.49mm with pin pitch
of 0.4mm] and 48-ball fine pitch ball grid array [f-BGA] package. It gives the best solution for compaction of
mounting area as well as flexibility of wiring pattern of printed circuit boards.
Features
Single 2.7~3.6V power supply
Small stand-by current: 8 µA (3.0V, typical)
No clocks, No refresh
All inputs and outputs are TTL compatible.
Easy memory expansion by CS1#, CS2, LB# and UB#
Common Data I/O
Three-state outputs: OR-tie Capability
OE# prevents data contention on the I/O bus
Ordering Information
Type No.
R1WV6416RSA-5S%
R1WV6416RSA-7S%
R1WV6416RSD-5S%
R1WV6416RSD-7S%
R1WV6416RBG-5S%
R1WV6416RBG-7S%
Access time
55 ns
70 ns
55 ns
70 ns
55 ns
70 ns
Package
12mm x 20mm 48-pin plastic TSOP (I)
(normal-bend type) (48P3R)
350 mil 52-pin plastic
μ-TSOP
(II)
(normal-bend type) (52PTG)
f-BGA 0.75mm pitch 48-ball
%
R
I
% - Temperature version; see table below
Temperature Range
0 ~ +70 °C
-40 ~ +85 °C
REJ03C0368-0100, Rev.1.00, 2009.05.07
Page 1 of 16

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