Preliminary Data Sheet
ISP1807
Bluetooth 5, NFC, ANT & THREAD Module
Long Range Low Energy
with MCU & Antenna
This ultra-small LGA module, 8 x 8 x 1 mm, is based on
the nRF52840 Chip. Its powerful Cortex™ M4 CPU,
flash and RAM memory combined with an optimized
antenna offers the perfect solution for Bluetooth
connectivity. The solution is best in class for RF
performance and low power consumption. Long range
and multiple digital and analogue interfaces give
optimum flexibility for sensor integration.
Key Features
2.4GHz Ultra Low Power RF Transceiver
Full Bluetooth 5 – long range stack
ANT/ANT+ stack
2.4 GHz proprietary stack
Mesh and Thread available
NFC-A Tag for OOB pairing
Fully integrated RF matching and Antenna
Integrated 32 MHz& 32kHZ Clock
DC/DC converter with loading circuit
Based on Nordic Semiconductor nRF52
32-bit ARM Cortex M4F CPU
ARM CryptoCell 310
1 MB Flash / 256 kB SRAM
Configurable 46 GPIOs including 8 ADC
Many interfaces USB, SPI, UART, PDM, I2C
Single 1.7 to 5.5 V supply
Very small size 8.0 x 8.0 x 1.0 mm
Temperature -40 to +85 °C
Pin to Pin compatible with ISP1507
Applications
Advanced Wearables: watches, fitness
devices, wireless payment wearables,
connected health, augmented reality
applications …
Smart Homesensors and controllers
Industrial IoT sensors and controllers
Advanced remote controls
Remote &Gaming controllers
Beacons
Certifications
FCC certification pending
CE certification pending
IC certification pending
TELEC certification pending
Bluetooth SIG certification pending
RoHS compliant
December 12, 2018
Document Ref:isp_ble_DS1807_R4.docx
Page 1/23
Insight SiP–
Green Side – 400 aven ueR ou ma nille – B P 309 – 06906 Sop hia - Antipo lis Ced ex – Fran ce –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third partywithout written permission.
Specification subject to change without notice.
BLE MODULE
ISP1807
Preliminary Data Sheet
Contents
1.
2.
2.1.
2.2.
2.3.
2.4.
2.5.
2.6.
2.7.
3.
4.
4.1.
4.2.
4.3.
5.
5.1.
5.2.
5.3.
6.
6.1.
6.2.
6.3.
6.4.
6.5.
7.
7.1.
7.2.
7.3.
8.
8.1.
8.2.
8.3.
8.4.
8.5.
8.6.
8.7.
Block Diagram ....................................................................................................................................................... 3
Specifications ........................................................................................................................................................ 4
Important Notice .........................................................................................................................................4
Absolute Maximum Ratings ........................................................................................................................4
Operating Conditions ..................................................................................................................................4
Power Consumption ...................................................................................................................................5
Clock Sources ............................................................................................................................................5
Radio Specifications ...................................................................................................................................5
Electrical Schematic ...................................................................................................................................8
Pin Description ...................................................................................................................................................... 9
Mechanical Outlines ............................................................................................................................................ 12
Mechanical Dimensions ............................................................................................................................ 12
SMT Assembly Guidelines ........................................................................................................................ 13
Antenna Keep-Out Zone ........................................................................................................................... 13
Product Development Tools............................................................................................................................... 14
Hardware ................................................................................................................................................. 14
Firmware .................................................................................................................................................. 14
Development Tools................................................................................................................................... 15
Packaging & Ordering information.................................................................................................................... 16
Marking .................................................................................................................................................... 16
Prototype Packaging ................................................................................................................................ 16
Jedec Trays.............................................................................................................................................. 16
Tape and Reel .......................................................................................................................................... 17
Ordering Information................................................................................................................................. 18
Storage & Soldering information ....................................................................................................................... 19
Storage and Handling ............................................................................................................................... 19
Moisture Sensitivity................................................................................................................................... 19
Soldering information................................................................................................................................ 20
Quality & User information ................................................................................................................................. 21
Certifications ............................................................................................................................................ 21
USA – User information ............................................................................................................................ 21
Canada – User information ....................................................................................................................... 21
RF Exposure Information .......................................................................................................................... 22
Informations concernant l'exposition aux fréquences radio (RF) ................................................................ 22
Discontinuity ............................................................................................................................................. 22
Disclaimer ................................................................................................................................................ 23
December 12, 2018
Document Ref:isp_ble_DS1807_R4.docx
Page 2/23
Insight SiP–
Green Side – 400 aven ueR ou ma nille – B P 309 – 06906 Sop hia- Antipo lis Ced ex – Fran ce –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third partywithout written permission.
Specification subject to change without notice.
BLE MODULE
ISP1807
Preliminary Data Sheet
1. Block Diagram
This module is based on nRF52840 Nordic Semiconductor 2.4GHz wireless System on Chip (SoC)
integrating a 2.4 GHz transceiver, a 32-bit ARM Cortex™-M4F CPU, a1 MB flash memory, a 256 kB
RAM and analog and digital peripherals.
It can support BLE, ANT/ANT+ and a range of proprietary 2.4 GHz protocols, such as Gazell from Nordic
Semiconductor.
Fully qualified BLE stacks for nRF52840 are implemented in the S140 SoftDevices which can be freely
downloaded. ISP1807 can then be used in Bluetooth Central, Peripheral, Observer or Broadcaster role
with up to 20 connectionsand for both ends of other proprietary protocols. nRF52840platform also
provides extensive software support for ANT and THREAD applications.
Ultra-low power consumption and advanced power management enables battery lifetimes up to several
years on a coin cell battery. Even though its very small size 8 x 8 x 1.0 mm, the module integrates
decoupling capacitors, 32 MHz and 32.768 kHz crystals, load capacitors, DC-DC converter, RF matching
circuit and antenna in addition to the wireless SoC.
Only the addition of a suitable DC power source is necessary for BLE / ANT / THREAD connectivity.
Sensor applications require the further addition of appropriate sensors. The antenna was designed to be
optimized with several standard ground plane sizes. The NFC tag antenna can be connected externally.
December 12, 2018
Document Ref:isp_ble_DS1807_R4.docx
Page 3/23
Insight SiP–
Green Side – 400 aven ueR ou ma nille – B P 309 – 06906 Sop hia- Antipo lis Ced ex – Fran ce –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third partywithout written permission.
Specification subject to change without notice.
BLE MODULE
ISP1807
Preliminary Data Sheet
2. Specifications
2.1. Important Notice
The electrical specifications of the module are directly related to the Nordic Semiconductor specifications
for the nRF52840 chipset. Bellow information is only a summary of the main parameters. For more
detailed information, especially about current consumption, please refer to the up-to-date specification of
the chipset available on Nordic Semi website.
2.2. Absolute Maximum Ratings
Parameter
Main Supply Voltage respect to ground– VCC
High Supply Voltage respect to ground – VCCH
USB Supply Voltage respect to ground – VUSB
IO Pin Voltage
RF Input Level
NFC Antenna pin current
Storage Temperature
Moisture Sensitivity Level
ESD Human Body Model
ESD Charged Device Model
Flash Endurance
-40
Min
-0.3
-0.3
-0.3
-0.3
Typ
Max
3.9
5.8
5.8
3.9
10
80
+125
5
4000
750
10000
Unit
V
V
V
V
dBm
mA
°C
-
V
V
cycles
ATTENTION
CONSERVE PRECAUTIONFOR HANDLING
ELECTROSTATIC SENSITIVE DEVICES
Human Body Model Class 3A
2.3. Operating Conditions
Parameter
VCC Supply Voltage, independent of DCDC enable
VCCH Supply Voltage, independent of DCDC enable
VUSBSupply Voltage
Extended Industrial Operating Temperature Range
Min
1.75
2.5
4.35
-40
Typ
3.0
3.7
5.0
+25
Max
3.6
5.5
5.5
+85
Unit
V
V
V
°C
December 12, 2018
Document Ref:isp_ble_DS1807_R4.docx
Page 4/23
Insight SiP–
Green Side – 400 aven ueR ou ma nille – B P 309 – 06906 Sop hia- Antipo lis Ced ex – Fran ce –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third partywithout written permission.
Specification subject to change without notice.
BLE MODULE
ISP1807
Preliminary Data Sheet
2.4. PowerConsumption
Parameter
Peak Current, Transmitter +8 dBm, VCC 3V + DCDC
Peak Current, Transmitter 0 dBm, VCC 3V + DCDC
Peak Current, Transmitter 0 dBm, VCCH 5V + DCDC
Peak Current, Receiver 1 Mbps, VCC 3V + DCDC
Peak Current, Receiver 2 Mbps, VCC 3V + DCDC
System OFF, no RAM retention
System ON, no RAM retention, wake on RTC
Additional RAM retention current per 4 KB block
Min
Typ
14.1
4.9
6.0
4.8
5.4
0.4
1.3
30
N
Max
Unit
mA
mA
mA
mA
mA
µA
µA
nA
2.5. Clock Sources
Parameter
Internal High Frequency Clock for RF Stability:
32 MHz Crystal Frequency Tolerance
(1)
Internal Low Frequency Clock for BLE Synchronization:
32.768 kHz Crystal Frequency Tolerance
(1)
Internal Low Frequency Clock for BLE Synchronization:
RC Oscillator
(2)
RF Frequency Tolerance for BLE Operation
(1)
(2)
including initial tolerance, drift, aging, and frequency pulling
Frequency tolerance after calibration
Min
Typ
Max
+/- 40
+/- 40
+/- 250
+/- 40
Unit
ppm
ppm
ppm
ppm
2.6. Radio Specifications
Parameter
Frequency Range
Maximum Output Power
Rx Sensitivity Level, BLE1 Mbps
Rx Sensitivity Level, BLE Long Range 125 kbps
Antenna Gain
EIRP
Range Open field @1m height
Data Rate
125
-19.4
100
2000
Min
2360
8
-95
-103
0.6
8.6
Typ
Max
2500
Unit
Mhz
dBm
dBm
dBm
dBi
dBm
M
kbps
December 12, 2018
Document Ref:isp_ble_DS1807_R4.docx
Page 5/23
Insight SiP–
Green Side – 400 aven ueR ou ma nille – B P 309 – 06906 Sop hia- Antipo lis Ced ex – Fran ce –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third partywithout written permission.
Specification subject to change without notice.
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