ISM43362-L36 Product Specification
Table of Contents
General Description ................................................................................................................ 3
Part Number Description ........................................................................................................ 4
General Features ..................................................................................................................... 4
Specifications .......................................................................................................................... 5
4.1
Module Architecture / Block Diagram ........................................................................... 5
5
Limitations .............................................................................................................................. 6
5.1
Regulatory Compliance .................................................................................................. 6
5.2
FCC and IC User’s Manual Statements: ......................................................................... 6
5.3
Industry Canada User’s Manual Statements: .................................................................. 8
6
Complementary Documentation ............................................................................................. 9
6.1
Inventek Systems ............................................................................................................ 9
6.2
Environmental Specifications ......................................................................................... 9
7
Electrical Specifications.......................................................................................................... 9
7.1
Recommended Operating Ratings .................................................................................. 9
8
Power Consumption .............................................................................................................. 10
9
Wi-Fi RF Specification ......................................................................................................... 10
9.1
RF Specification............................................................................................................ 10
9.2
802.11b Transmit .......................................................................................................... 12
9.3
802.11g Transmit .......................................................................................................... 13
9.4
802.11n Transmit .......................................................................................................... 13
9.5
802.11b Receiver .......................................................................................................... 14
9.6
802.11g Receiver ......................................................................................................... 14
9.7
802.11n Receiver .......................................................................................................... 15
10 Footprint ................................................................................................................................ 18
11 PCB Layout (Top View) ....................................................................................................... 19
12 Boot Sequence ...................................................................................................................... 20
13 Communications Interfaces .................................................................................................. 21
13.1 SDIO and gSPI CONFIGURATION ............................................................................ 21
13.2 SDIO Timing (Default Mode) ...................................................................................... 22
13.3 SDIO Timing (High Speed Mode) ................................................................................ 23
13.4 gSPI Interface Characteristics ....................................................................................... 24
13.5 PCB Etch Antenna Gain on the Evaluation Board ........................................................... 25
13. 6 Farfield Directivity........................................................................................................... 26
14................................................................................................................................................... 27
14.1 External Antenna Option .............................................................................................. 27
15 Product Compliance Considerations ..................................................................................... 28
16 Reflow Profile ....................................................................................................................... 29
17 Packaging Information .......................................................................................................... 30
17.1 MSL Level / Storage Condition .................................................................................... 30
17.2 Device baking requirements prior to assembly............................................................. 31
Module’s Assembly Instructions .............................................................................................. 31
18 Contact Information .............................................................................................................. 32
DOC-DS-20079-1.1
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Inventek Systems
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ISM43362-L36 Product Specification
1 General Description
The Inventek ISM43362-L36 is an 802.11 b/g/n WiFi Radio SiP with on board antenna
or optional external antenna with a U.FL connector, which is designed for embedded
wireless solutions and offers a cost-effective high performance Broadcom radio device
(BCM43362) packaged in an 36 pin LGA (24.4mm x 15.3 mm). It includes standards-
based wired and wireless technologies to enable IP infrastructures for smart grid, smart
home, security, building automation, toys, robots, remote health and wellness
monitoring and other IoT and M2M applications.
The module is based on IEEE802.11 b/g/n antenna single-stream align technology.
The solution is FCC/IC/CE certified and helps to reduce development time, lower
manufacturing costs, save board space, and ease certification.
Summary of Key Features:
802.11 b/g/n compliant based on Broadcom MAC/Baseband/Radio device.
SDIO v2.0
On-chip functionality Single-chip: MAC/BB/RF
Frequency Band:
2.4 GHz
Network Standard:
802.11b, 802.11g, 802.11n (single stream)
Modulation Modes:
CCK and OFDM with BPSK, QPSK, 16 QAM,
64QAM
Hardware Encryption:
WEP, WPA/WPA2
Supported Data Rates:
IEEE 802.11b 1 – 11 Mbps
IEEE 802.11g 6 – 54 Mbps
IEEE 802.11n (2.4 GHz) 7.2 – 72.2 Mbps
Advanced 1x1 802.11n features:
Full/Half Guard Interval
Operating Temperature:
-40℃ to 85℃
Typical Applications:
PDA, Pocket PC, computing devices.
Building automation and smart energy control.
Industrial sensing and remote equipment monitoring.
Warehousing, logistics and freight management.
PC and gaming peripherals.
Printers, scanners, alarm and video systems.
Medical applications including patient monitoring and remote diagnostics.
Inventek Systems
DOC-DS-20079-1.1
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ISM43362-L36 Product Specification
2 Part Number Description
Device
ISM43362-L36-E
Description
802.11 SiP Module based on
Broadcom BCM43362 with on
board etch antenna
802.11 SiP Module based on
Broadcom BCM43362 with
U.FL connector for external
antenna
SDIO Evaluation Board
Ordering Number
ISM43362-L36-E
ISM43362-L36-U
ISM43362-L36-U
ISM43362-L36-EVB
ISM43362-L36-EVB
3 General Features
Based on the Broadcom BCM43362 MAC/Baseband/Radio device.
Supports Broadcom WICED SDK.
IEEE 802.11n D7.0 -OFDM-72.2 Mbps -single stream w/20 MHz, Short GI
IEEE 802.11g (OFDM 54 Mbps)
IEEE 802.11b (DSSS 11Mbps)
IEEE 802.11i (Security)
o
o
WPA (Wi-Fi Protected Access) –PSK/TKIP
WPA2 (Wi-Fi Protected Access 2)- AES/CCMP/802.1x Authentication
Inputs +3.3 V tolerant
Lead Free Design which is compliant with ROHS requirements.
EMI/EMC Metal Shield recommended for best RF performance in noisy
environments and to accommodate for lower RF emissions/signature for easier
FCC compliance.
DOC-DS-20079-1.1
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Inventek Systems