W25Q256JWFIM TR datasheet, PDF

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W25Q256JWFIM TR: DescriptionNOR flash memory spiFlash, 1.8V, 256M-bit, 4Kb Uniform Sector; Categorysemiconductor Memory IC NOR flash memory; File Size2MB，120 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw; Environmental Compliance

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W25Q256JWFIM TR Overview

NOR flash memory spiFlash, 1.8V, 256M-bit, 4Kb Uniform Sector

W25Q256JWFIM TR Parametric

Parameter Name	Attribute value
Maker	Winbond Electronics Corporation
Product Category	NOR flash memory
Installation style	SMD/SMT
Package/box	SOIC-16
series	W25Q256JW
storage	256 Mbit
maximum clock frequency	133 MHz
Interface Type	SPI
organize	32 M x 8
Timing type	Asynchronous
Data bus width	8 bit
Supply voltage - min.	1.7 V
Supply voltage - max.	1.95 V
Supply current—max.	20 mA
Minimum operating temperature	- 40 C
Maximum operating temperature	+ 85 C
Encapsulation	Reel
Factory packaging quantity	1000

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W25Q256JW_DTR

1.8V 256M-BIT

SERIAL FLASH MEMORY WITH

DUAL/QUAD SPI, QPI & DTR

Publication Release Date: September 04, 2018

- Revision E

W25Q256JW_DTR

Table of Contents

GENERAL DESCRIPTIONS ............................................................................................................. 5

FEATURES ....................................................................................................................................... 5

PACKAGE TYPES AND PIN CONFIGURATIONS........................................................................... 6

3.1

3.2

3.3

3.4

3.5

3.6

4.1

4.2

4.3

4.4

4.5

4.6

Pad Configuration 6x5-mm/ 8x6-mm.................................................................................... 6

Pad Description WSON 6x5-mm / 8x6-mm ......................................................................... 6

Pin Configuration SOIC 300-mil ........................................................................................... 7

Pin Description SOIC 300-mil ............................................................................................... 7

Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 8

Ball Description TFBGA 8x6-mm ......................................................................................... 8

Chip Select (/CS) .................................................................................................................. 9

Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ..................................... 9

Write Protect (/WP) .............................................................................................................. 9

HOLD (/HOLD) ..................................................................................................................... 9

Serial Clock (CLK) ................................................................................................................ 9

Reset (/RESET) .................................................................................................................... 9

PIN DESCRIPTIONS ........................................................................................................................ 9

BLOCK DIAGRAM .......................................................................................................................... 10

FUNCTIONAL DESCRIPTIONS ..................................................................................................... 11

6.1

SPI / QPI Operations .......................................................................................................... 11

6.1.1

6.1.2

6.1.3

6.1.4

6.1.5

6.1.6

6.1.7

6.1.8

Standard SPI Instructions ..................................................................................................... 11

Dual SPI Instructions ............................................................................................................ 11

Quad SPI Instructions ........................................................................................................... 12

QPI Instructions .................................................................................................................... 12

SPI / QPI DTR Read Instructions ......................................................................................... 12

3-Byte / 4-Byte Address Modes ............................................................................................ 12

Hold Function ....................................................................................................................... 13

Software Reset & Hardware /RESET pin .............................................................................. 13

6.2

7.1

Write Protection .................................................................................................................. 14

Status Registers ................................................................................................................. 15

7.1.1

7.1.2

7.1.3

7.1.4

7.1.5

7.1.6

7.1.7

Program/Erase/Write In Progress (BUSY)

–

Status Only

.................................................. 15

Write Enable Latch (WEL)

–

Status Only

.......................................................................... 15

Block Protect Bits (BP3, BP2, BP1, BP0)

–

Volatile/Non-Volatile Writable

....................... 16

Top/Bottom Block Protect (TB)

–

Volatile/Non-Volatile Writable

....................................... 16

Complement Protect (CMP)

–

Volatile/Non-Volatile Writable

............................................ 16

Status Register Protect (SRP, SRL)

–

Volatile/Non-Volatile Writable

............................... 16

Erase/Program Suspend Status (SUS)

–

Status Only.......................................................

STATUS AND CONFIGURATION REGISTERS ............................................................................ 15

-1-

W25Q256JW_DTR

7.1.8

7.1.9

7.1.10

7.1.11

7.1.12

7.1.13

7.1.14

7.1.15

7.1.16

7.1.17

7.1.18

Security Register Lock Bits (LB3, LB2, LB1)

–

Volatile/Non-Volatile OTP Writable

.......... 17

Quad Enable (QE)

–

Volatile/Non-Volatile Writable

.......................................................... 17

Current Address Mode (ADS)

–

Status Only

................................................................... 18

Power-Up Address Mode (ADP)

–

Non-Volatile Writable

................................................ 18

Write Protect Selection (WPS)

–

Volatile/Non-Volatile Writable

..................................... 18

Output Driver Strength (DRV1, DRV0)

–

Volatile/Non-Volatile Writable

......................... 19

/HOLD or /RESET Pin Function (HOLD/RST)

–

Volatile/Non-Volatile Writable

.............. 19

Reserved Bits

–

Non Functional

...................................................................................... 19

W25Q256JW Status Register Memory Protection (WPS = 0, CMP = 0) ........................... 20

W25Q256JW Status Register Memory Protection (WPS = 0, CMP = 1) ........................... 21

W25Q256JW Individual Block Memory Protection (WPS=1) ............................................. 22

7.2

Extended Address Register

–

Volatile Writable Only

...................................................... 23

INSTRUCTIONS ............................................................................................................................. 24

8.1

Device ID and Instruction Set Tables ................................................................................. 24

8.1.1

8.1.2

8.1.3

8.1.4

8.1.5

8.1.6

8.1.7

8.1.8

8.1.9

8.1.10

8.1.11

Manufacturer and Device Identification ................................................................................ 24

Instruction Set Table 1 (Standard/Dual/Quad SPI, 3-Byte Address Mode ADS=0)

(1)

........... 25

Instruction Set Table 2 (Dual/Quad SPI Instructions,3-Byte Address Mode ADS=0) ........... 26

Instruction Set Table 3 (Standard SPI, 4-Byte Address Mode ADS=1)

(1)

............................. 27

Instruction Set Table 4 (Dual/Quad SPI Instructions, 4-Byte Address Mode ADS=1) .......... 28

Instruction Set Table 5 (QPI Instructions, 3-Byte Address Mode) ........................................ 29

Instruction Set Table 6 (QPI Instructions, 4-Byte Address Mode) ........................................ 30

Instruction Set Table 7 (DTR with SPI Instructions, 3-Byte Address Mode) ......................... 31

Instruction Set Table 8 (DTR with SPI Instructions, 4-Byte Address Mode) ......................... 31

Instruction Set Table 9 (DTR with QPI Instructions, 3-Byte Address Mode)....................... 31

Instruction Set Table 10 (DTR with QPI Instructions, 4-Byte Address Mode)..................... 31

Notes:................................................................................................................................................ 32

8.2

Instruction Descriptions ...................................................................................................... 33

8.2.1

8.2.2

8.2.3

8.2.4

8.2.5

8.2.6

8.2.7

8.2.8

8.2.9

8.2.10

8.2.11

8.2.12

8.2.13

8.2.14

Write Enable (06h) ............................................................................................................... 33

Write Enable for Volatile Status Register (50h) .................................................................... 33

Write Disable (04h) ............................................................................................................... 34

Read Status Register-1 (05h), Status Register-2 (35h) & Status Register-3 (15h) .............. 34

Write Status Register-1 (01h), Status Register-2 (31h) & Status Register-3 (11h) .............. 35

Read Extended Address Register (C8h) .............................................................................. 38

Write Extended Address Register (C5h) .............................................................................. 39

Enter 4-Byte Address Mode (B7h) ........................................................................................ 40

Exit 4-Byte Address Mode (E9h) .......................................................................................... 40

Read Data (03h) ................................................................................................................. 41

Read Data with 4-Byte Address (13h) ................................................................................ 42

Fast Read (0Bh) ................................................................................................................. 43

DTR Fast Read (0Dh) ......................................................................................................... 45

Fast Read with 4-Byte Address (0Ch) ................................................................................ 47

-2-

Publication Release Date: September 04, 2018

- Revision E

W25Q256JW_DTR

8.2.15

8.2.16

8.2.17

8.2.18

8.2.19

8.2.20

8.2.21

8.2.22

8.2.23

8.2.24

8.2.25

8.2.26

8.2.27

8.2.28

8.2.29

8.2.30

8.2.31

8.2.32

8.2.33

8.2.34

8.2.35

8.2.36

8.2.37

8.2.38

8.2.39

8.2.40

8.2.41

8.2.42

8.2.43

8.2.44

8.2.45

8.2.46

8.2.47

8.2.48

8.2.49

8.2.50

8.2.51

8.2.52

8.2.53

8.2.54

8.2.55

8.2.56

8.2.57

Fast Read Dual Output (3Bh) ............................................................................................. 48

Fast Read Dual Output with 4-Byte Address (3Ch) ............................................................ 49

Fast Read Quad Output (6Bh) ............................................................................................ 50

Fast Read Quad Output with 4-Byte Address (6Ch) ........................................................... 51

Fast Read Dual I/O (BBh) ................................................................................................... 52

DTR Fast Read Dual I/O (BDh) .......................................................................................... 54

Fast Read Dual I/O with 4-Byte Address (BCh) .................................................................. 56

Fast Read Quad I/O (EBh) ................................................................................................. 58

DTR Fast Read Quad I/O (EDh) ......................................................................................... 61

Fast Read Quad I/O with 4-Byte Address (ECh) ................................................................ 64

Set Burst with Wrap (77h) .................................................................................................. 66

Page Program (02h) ........................................................................................................... 67

Page Program with 4-Byte Address (12h) .......................................................................... 69

Quad Input Page Program (32h) ........................................................................................ 70

Quad Input Page Program with 4-Byte Address (34h) ....................................................... 71

Sector Erase (20h) ............................................................................................................. 72

Sector Erase with 4-Byte Address (21h)............................................................................. 73

32KB Block Erase (52h) ..................................................................................................... 74

64KB Block Erase (D8h) ..................................................................................................... 75

64KB Block Erase with 4-Byte Address (DCh) ................................................................... 76

Chip Erase (C7h / 60h) ....................................................................................................... 77

Erase / Program Suspend (75h) ......................................................................................... 78

Erase / Program Resume (7Ah) ......................................................................................... 80

Power-down (B9h) .............................................................................................................. 81

Release Power-down / Device ID (ABh) ............................................................................. 82

Read Manufacturer / Device ID (90h) ................................................................................. 84

Read Manufacturer / Device ID Dual I/O (92h) ................................................................... 85

Read Manufacturer / Device ID Quad I/O (94h) ................................................................. 86

Read Unique ID Number (4Bh)........................................................................................... 87

Read JEDEC ID (9Fh) ........................................................................................................ 88

Read SFDP Register (5Ah) ................................................................................................ 89

Erase Security Registers (44h) ........................................................................................... 90

Program Security Registers (42h) ...................................................................................... 91

Read Security Registers (48h) ........................................................................................... 92

Set Read Parameters (C0h) ............................................................................................... 93

Burst Read with Wrap (0Ch)............................................................................................... 94

DTR Burst Read with Wrap (0Eh) ...................................................................................... 95

Enter QPI Mode (38h)......................................................................................................... 96

Exit QPI Mode (FFh) ........................................................................................................... 97

Individual Block/Sector Lock (36h) ..................................................................................... 98

Individual Block/Sector Unlock (39h) .................................................................................. 99

Read Block/Sector Lock (3Dh) ......................................................................................... 100

Global Block/Sector Lock (7Eh) ........................................................................................ 101

-3-

W25Q256JW_DTR

8.2.58

8.2.59

Global Block/Sector Unlock (98h) ..................................................................................... 101

Enable Reset (66h) and Reset Device (99h) .................................................................... 102

ELECTRICAL CHARACTERISTICS ............................................................................................. 103

9.1

Absolute Maximum Ratings (1) ........................................................................................ 103

9.2

9.3

9.4

9.5

9.6

9.7

9.8

9.9

9.10

9.11

Operating Ranges............................................................................................................. 103

Power-up Power-down Timing and Requirements ........................................................... 104

DC Electrical Characteristics ............................................................................................ 106

AC Measurement Conditions ............................................................................................ 107

AC Electrical Characteristics

(6)

......................................................................................... 108

AC Electrical Characteristics (cont’d) ............................................................................ 109

Serial Output Timing ......................................................................................................... 110

Serial Input Timing ............................................................................................................ 110

/HOLD Timing ................................................................................................................... 110

/WP Timing ....................................................................................................................... 110

8-Pad WSON 6x5-mm (Package Code P) ....................................................................... 111

8-Pad WSON 8x6-mm (Package Code E) ....................................................................... 112

16-Pin SOIC 300-mil (Package Code F) .......................................................................... 113

24-Ball TFBGA 8x6-mm (Package Code B, 5x5-1 Ball Array) ......................................... 114

24-Ball TFBGA 8x6-mm (Package Code C, 6x4 Ball Array) ............................................ 115

Valid Part Numbers and Top Side Marking ...................................................................... 117

10.

PACKAGE SPECIFICATIONS ...................................................................................................... 111

10.1

10.2

10.3

10.4

10.5

11.

12.

ORDERING INFORMATION ........................................................................................................ 116

11.1

REVISION HISTORY .................................................................................................................... 118

-4-

Publication Release Date: September 04, 2018

- Revision E

W25Q256JWFIM TR Related Products

	W25Q256JWFIM TR	W25Q256JWPIM TR	W25Q256JWEIM TR	W25Q256JWBIM TR	W25Q256JWCIM TR	W25Q256JWCIM	W25Q256JWBIM	W25Q256JWPIM	W25Q256JWFIM	W25Q256JWEIM
Description	NOR flash memory spiFlash, 1.8V, 256M-bit, 4Kb Uniform Sector	NOR flash memory spiFlash, 1.8V, 256M-bit, 4Kb Uniform Sector	NOR flash memory spiFlash, 1.8V, 256M-bit, 4Kb Uniform Sector	NOR flash memory spiFlash, 1.8V, 256M-bit, 4Kb Uniform Sector	NOR flash memory spiFlash, 1.8V, 256M-bit, 4Kb Uniform Sector	Flash, 32MX8, PBGA24, TFBGA-24	NOR flash memory spiFlash, 1.8V, 256M-bit, 4Kb Uniform Sector	NOR flash memory spiFlash, 1.8V, 256M-bit, 4Kb Uniform Sector	Flash, 32MX8, PDSO16, SOIC-16	Flash, 32MX8, PDSO8, WSON-8
organize	32 M x 8	32 M x 8	32 M x 8	32 M x 8	32 M x 8	32MX8	32 M x 8	32 M x 8	32MX8	32MX8
Minimum operating temperature	- 40 C	- 40 C	- 40 C	- 40 C	- 40 C	-40 °C	- 40 C	- 40 C	-40 °C	-40 °C
Maximum operating temperature	+ 85 C	+ 85 C	+ 85 C	+ 85 C	+ 85 C	85 °C	+ 85 C	+ 85 C	85 °C	85 °C
Maker	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	-	Winbond Electronics Corporation	Winbond Electronics Corporation	-	-
Product Category	NOR flash memory	NOR flash memory	NOR flash memory	NOR flash memory	NOR flash memory	-	NOR flash memory	NOR flash memory	-	-
Installation style	SMD/SMT	SMD/SMT	SMD/SMT	SMD/SMT	SMD/SMT	-	SMD/SMT	SMD/SMT	-	-
Package/box	SOIC-16	WSON-8	WSON-8	TFBGA-24	TFBGA-24	-	TFBGA-24	WSON-8	-	-
series	W25Q256JW	W25Q256JW	W25Q256JW	W25Q256JW	W25Q256JW	-	W25Q256JW	W25Q256JW	-	-
storage	256 Mbit	256 Mbit	256 Mbit	256 Mbit	256 Mbit	-	256 Mbit	256 Mbit	-	-
maximum clock frequency	133 MHz	133 MHz	133 MHz	133 MHz	133 MHz	-	133 MHz	133 MHz	-	-
Interface Type	SPI	SPI	SPI	SPI	SPI	-	SPI	SPI	-	-
Timing type	Asynchronous	Asynchronous	Asynchronous	Asynchronous	Asynchronous	-	Asynchronous	Asynchronous	-	-
Data bus width	8 bit	8 bit	8 bit	8 bit	8 bit	-	8 bit	8 bit	-	-
Supply voltage - min.	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	-	1.7 V	1.7 V	-	-
Supply voltage - max.	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	-	1.95 V	1.95 V	-	-
Supply current—max.	20 mA	20 mA	20 mA	20 mA	20 mA	-	20 mA	20 mA	-	-
Encapsulation	Reel	Reel	Reel	Reel	Reel	-	Tube	Tube	-	-
Factory packaging quantity	1000	5000	4000	2000	2000	-	480	100	-	-

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