W25X40CLSSIG TR datasheet, PDF

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W25X40CLSSIG TR: DescriptionNOR flash memory spiFlash, 4M-bit, 4Kb Uniform Sector; Categorysemiconductor Memory IC NOR flash memory; File Size1MB，54 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw; Environmental Compliance

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W25X40CLSSIG TR Overview

NOR flash memory spiFlash, 4M-bit, 4Kb Uniform Sector

W25X40CLSSIG TR Parametric

Parameter Name	Attribute value
Maker	Winbond Electronics Corporation
Product Category	NOR flash memory
Installation style	SMD/SMT
Package/box	SOIC-8
series	W25X40CL
storage	4 Mbit
maximum clock frequency	104 MHz
Interface Type	SPI
organize	512 k x 8
Data bus width	8 bit
Supply voltage - min.	2.3 V
Supply voltage - max.	3.6 V
Supply current—max.	15 mA
Minimum operating temperature	- 40 C
Maximum operating temperature	+ 85 C
Encapsulation	Cut Tape
Encapsulation	Reel
Factory packaging quantity	2000

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W25X40CL

2.5/3/3.3 V 4M-BIT

SERIAL FLASH MEMORY WITH

4KB SECTORS AND DUAL I/O SPI

-1-

Publication Release Date: March 25, 2014

Revision F

W25X40CL

Table of Contents

GENERAL DESCRIPTION ......................................................................................................... 4

FEATURES ................................................................................................................................. 4

PIN CONFIGURATION SOIC 208-MIL, SOIC 150-MIL AND VSOP 150-MIL ............................ 5

PAD CONFIGURATION WSON 6X5-MM AND USON 2X3-MM ................................................ 5

PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 6

PIN DESCRIPTION SOIC, VSOP, WSON, USON AND PDIP ................................................... 6

6.1

Package Types ............................................................................................................... 7

6.2

Chip Select (/CS) ............................................................................................................ 7

6.3

Serial Data Input, Output and IOs (DI, DO, IO0 and IO1) .............................................. 7

6.4

Write Protect (/WP) ......................................................................................................... 7

6.5

HOLD (/HOLD)................................................................................................................ 7

6.6

Serial Clock (CLK) .......................................................................................................... 7

BLOCK DIAGRAM ...................................................................................................................... 8

7.1

SPI OPERATIONS.......................................................................................................... 9

7.1.1

7.1.2

7.1.3

Standard SPI Instructions ................................................................................................. 9

Dual SPI Instructions ........................................................................................................ 9

Hold Function ................................................................................................................... 9

Write Protect Features.................................................................................................... 10

7.2

WRITE PROTECTION .................................................................................................. 10

7.2.1

CONTROL AND STATUS REGISTERS ................................................................................... 11

8.1

STATUS REGISTER .................................................................................................... 11

8.1.1

8.1.2

8.1.3

8.1.4

8.1.5

8.1.6

8.1.7

BUSY.............................................................................................................................. 11

Write Enable Latch (WEL) .............................................................................................. 11

Block Protect Bits (BP2, BP1, BP0) ................................................................................ 11

Top/Bottom Block Protect (TB) ....................................................................................... 11

Reserved Bits ................................................................................................................. 12

Status Register Protect (SRP) ........................................................................................ 12

Status Register Memory Protection ................................................................................ 13

Manufacturer and Device Identification .......................................................................... 14

Instruction Set

(1)

............................................................................................................. 15

Write Enable (06h).......................................................................................................... 16

Write Enable for Volatile Status Register (50h) .............................................................. 16

Write Disable (04h) ......................................................................................................... 17

Read Status Register (05h) ............................................................................................ 17

Write Status Register (01h) ............................................................................................ 18

Read Data (03h) ............................................................................................................. 19

Fast Read (0Bh) ............................................................................................................. 20

Fast Read Dual Output (3Bh) ....................................................................................... 21

Fast Read Dual I/O (BBh) ............................................................................................. 22

Continuous Read Mode Bits (M7-0) ............................................................................. 24

Continuous Read Mode Reset (FFFFh) ....................................................................... 24

Page Program (02h) ..................................................................................................... 25

Sector Erase (20h) ....................................................................................................... 26

8.2

INSTRUCTIONS ........................................................................................................... 14

8.2.1

8.2.2

8.2.3

8.2.4

8.2.5

8.2.6

8.2.7

8.2.8

8.2.9

8.2.10

8.2.11

8.2.12

8.2.13

8.2.14

8.2.15

-2-

Publication Release Date: March 25, 2014

Revision F

W25X40CL

8.2.16

8.2.17

8.2.18

8.2.19

8.2.20

8.2.21

8.2.22

8.2.23

8.2.24

32KB Block Erase (52h) ............................................................................................... 27

Block Erase (D8h) ........................................................................................................ 28

Chip Erase (C7h or 60h) ............................................................................................... 29

Power-down (B9h) ........................................................................................................ 30

Release Power-down / Device ID (ABh) ....................................................................... 31

Read Manufacturer / Device ID (90h) ........................................................................... 33

Read Manufacturer / Device ID Dual I/O (92h) ............................................................. 34

Read Unique ID Number (4Bh) .................................................................................... 35

JEDEC ID (9Fh)............................................................................................................ 36

ELECTRICAL CHARACTERISTICS ......................................................................................... 37

9.1

Absolute Maximum Rating (1) ...................................................................................... 37

9.2

Operating Ranges ......................................................................................................... 37

9.3

Power-up Timing and Write Inhibit Threshold .............................................................. 38

9.4

DC Electrical Characteristics ........................................................................................ 39

9.5

AC Measurement Conditions ........................................................................................ 40

9.6

AC Electrical Characteristics ........................................................................................ 41

AC Electrical Characteristics (cont’d) ........................................................................................ 42

9.7

Serial Output Timing ..................................................................................................... 43

9.8

Serial Input Timing ........................................................................................................ 43

9.9

HOLD Timing ................................................................................................................ 43

9.10 WP Timing .................................................................................................................... 43

PACKAGE SPECIFICATION .................................................................................................... 44

10.1 8-Pin SOIC 150-mil (Package Code SN) ...................................................................... 44

10.2 8-Pin VSOP8 150-mil (Package Code SV) ................................................................... 45

10.3 8-Pin SOIC 208-mil (Package Code SS) ...................................................................... 46

10.4 8-Pad 6x5mm WSON (Package Code ZP) .................................................................. 47

10.5 8-Pad WSON 6x5mm Cont’d. ....................................................................................... 48

10.6 8-Pad USON 2x3-mm (Package Code UX) .................................................................. 49

10.7 8-pin PDIP 300-mil (Package Code DA) ...................................................................... 50

ORDERING INFORMATION

(1)

.................................................................................................. 51

11.1 Valid Part Numbers and Top Side Marking .................................................................. 52

REVISION HISTORY ................................................................................................................ 53

10.

11.

12.

-3-

Publication Release Date: March 25, 2014

Revision F

W25X40CL

GENERAL DESCRIPTION

The W25X40CL (4M-bit) Serial Flash memories provides a storage solution for systems with limited

space, pins and power. The 25X series offers flexibility and performance well beyond ordinary Serial

Flash devices. They are ideal for code download applications as well as storing voice, text and data.

The devices operate on a single 2.3V to 3.6V power supply with current consumption as low as 1mA

active and 1µA for power-down. All devices are offered in space-saving packages.

The W25X40CL arrays are organized into 2048 programmable pages of 256-bytes each. Up to 256

bytes can be programmed at a time. The W25X40CL have 128 erasable sectors, 16 erasable 32KB

blocks and 8 erasable 64KB blocks respectively. The small 4KB sectors allow for greater flexibility in

applications that require data and parameter storage. (See figure 2.)

The W25X40CL support the standard Serial Peripheral Interface (SPI), and a high performance dual

output as well as Dual I/O SPI: Serial Clock, Chip Select, Serial Data DI (I/O0), DO (I/O1). SPI clock

frequencies up to 104MHz are supported allowing equivalent clock rates of 208MHz when using the

Fast Read Dual Output instruction. These transfer rates are comparable to those of 8 and 16-bit

Parallel Flash memories. The Continuous Read Mode allows for efficient memory access with as few

as 16-clocks of instruction-overhead to read a 24-bit address, allowing true XIP (execute in place)

operation.

A Hold pin, Write Protect pin and programmable write protect, with top or bottom array control

features, provide further control flexibility. Additionally, the device supports JEDEC standard

manufacturer and device identification with a 64-bit Unique Serial Number.

FEATURES



Flexible Architecture with 4KB sectors

– Uniform Sector/Block Erase (4/32/64-kbytes)

– Page program up to 256 bytes <1ms

– More than 100,000 erase/write cycles

– More than 20-year data retention



Low Power, Wide Temperature Range

– Single 2.3V to 3.6V supply

– 1mA active current, <1µA Power-down(typ.)

– -40° to +85°C operating range



Space Efficient Packaging

– 8-pin SOIC 150-mil / VSOP 150-mil

– 8-pin SOIC 208-mil

– 8-pin PDIP 300-mil

– 8-pad WSON 6x5-mm

– 8-pad USON 2x3-mm

– 8-pin PDIP 300-mil

– Contact Winbond for KGD and other options



Family of Serial Flash Memories

– W25X40CL: 4M-bit/512K-byte (524,288)

– 256-bytes per programmable page

– Uniform erasable 4KB, 32KB & 64KB regions.



SPI with Single / Dual Outputs / I/O

– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold

– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold



Data Transfer up to 208M-bits / second

– Clock operation to 104MHz

–208MHz equivalent Dual SPI

– Auto-increment Read capability



Efficient “Continuous Read Mode”

– Low Instruction overhead

– Continuous Read

– As few as 16 clocks to address memory

– Allows true XIP (execute in place) operation

-4-

Publication Release Date: March 25, 2014

Revision F

W25X40CLSSIG TR Related Products

	W25X40CLSSIG TR	W25X40CLSNIG TR	W25X40CLZPIG TR	W25X40CLSVIG TR
Description	NOR flash memory spiFlash, 4M-bit, 4Kb Uniform Sector	NOR flash memory spiFlash, 4M-bit, 4Kb Uniform Sector	NOR flash memory spiFlash, 4M-bit, 4Kb Uniform Sector	NOR flash memory spiFlash, 4M-bit, 4Kb Uniform Sector
Maker	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation
Product Category	NOR flash memory	NOR flash memory	NOR flash memory	NOR flash memory
Installation style	SMD/SMT	SMD/SMT	SMD/SMT	SMD/SMT
Package/box	SOIC-8	SOIC-8	WSON-8	VSOP-8
series	W25X40CL	W25X40CL	W25X40CL	W25X40CL
storage	4 Mbit	4 Mbit	4 Mbit	4 Mbit
maximum clock frequency	104 MHz	104 MHz	104 MHz	104 MHz
Interface Type	SPI	SPI	SPI	SPI
organize	512 k x 8	512 k x 8	512 k x 8	512 k x 8
Data bus width	8 bit	8 bit	8 bit	8 bit
Supply voltage - min.	2.3 V	2.3 V	2.3 V	2.3 V
Supply voltage - max.	3.6 V	3.6 V	3.6 V	3.6 V
Supply current—max.	15 mA	15 mA	15 mA	15 mA
Minimum operating temperature	- 40 C	- 40 C	- 40 C	- 40 C
Maximum operating temperature	+ 85 C	+ 85 C	+ 85 C	+ 85 C
Factory packaging quantity	2000	2500	5000	5000
Encapsulation	Reel	Reel	Reel	Reel

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