MB81C4256A-70LPSZ datasheet, PDF

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MB81C4256A-70LPSZ: DescriptionFast Page DRAM, 256KX4, 70ns, CMOS, PZIP20, PLASTIC, ZIP-20; Categorystorage storage; File Size931KB，25 Pages; ManufacturerFUJITSU; Websitehttp://edevice.fujitsu.com/fmd/en/index.html

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MB81C4256A-70LPSZ Overview

Fast Page DRAM, 256KX4, 70ns, CMOS, PZIP20, PLASTIC, ZIP-20

MB81C4256A-70LPSZ Parametric

Parameter Name	Attribute value
Objectid	1400770422
package instruction	ZIP,
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FAST PAGE
Maximum access time	70 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; LOW POWER VERSION
JESD-30 code	R-PZIP-T20
length	25.88 mm
memory density	1048576 bit
Memory IC Type	FAST PAGE DRAM
memory width	4
Number of functions	1
Number of ports	1
Number of terminals	20
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX4
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	ZIP
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
refresh cycle	512
Maximum seat height	10.16 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	1.27 mm
Terminal location	ZIG-ZAG
width	2.85 mm

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MB81C4256A-70LPSZ Related Products

	MB81C4256A-70LPSZ	MB81C4256A-70LC	MB81C4256A-80LPFTN	MB81C4256A-80LP	MB81C4256A-80LPJ	MB81C4256A-70LPFTR	MB81C4256A-10LPJ	MB81C4256A-10LC	MB81C4256A-70LPFTN	MB81C4256A-80LPSZ
Description	Fast Page DRAM, 256KX4, 70ns, CMOS, PZIP20, PLASTIC, ZIP-20	Fast Page DRAM, 256KX4, 70ns, CMOS, CDIP20	Fast Page DRAM, 256KX4, 80ns, CMOS, PDSO20	Fast Page DRAM, 256KX4, 80ns, CMOS, PDIP20	Fast Page DRAM, 256KX4, 80ns, CMOS, PDSO20	Fast Page DRAM, 256KX4, 70ns, CMOS, PDSO20	Fast Page DRAM, 256KX4, 100ns, CMOS, PDSO20	Fast Page DRAM, 256KX4, 100ns, CMOS, CDIP20	Fast Page DRAM, 256KX4, 70ns, CMOS, PDSO20	Fast Page DRAM, 256KX4, 80ns, CMOS, PZIP20
package instruction	ZIP,	DIP, DIP20,.3	TSSOP, TSSOP20/24,.63,20	DIP, DIP20,.3	SOJ, SOJ20/26,.34	TSSOP, TSSOP20/24,.63,20	SOJ, SOJ20/26,.34	DIP, DIP20,.3	TSSOP, TSSOP20/24,.63,20	ZIP, ZIP20,.1
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow
Maximum access time	70 ns	70 ns	80 ns	80 ns	80 ns	70 ns	100 ns	100 ns	70 ns	80 ns
JESD-30 code	R-PZIP-T20	R-XDIP-T20	R-PDSO-G20	R-PDIP-T20	R-PDSO-J20	R-PDSO-G20	R-PDSO-J20	R-XDIP-T20	R-PDSO-G20	R-PZIP-T20
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bi
Memory IC Type	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM
memory width	4	4	4	4	4	4	4	4	4	4
Number of terminals	20	20	20	20	20	20	20	20	20	20
word count	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000	256000	256000	256000	256000	256000	256000
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	256KX4	256KX4	256KX4	256KX4	256KX4	256KX4	256KX4	256KX4	256KX4	256KX4
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	ZIP	DIP	TSSOP	DIP	SOJ	TSSOP	SOJ	DIP	TSSOP	ZIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	IN-LINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	512	512	512	512	512	512	512	512	512	512
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	NO	YES	YES	YES	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING	THROUGH-HOLE	J BEND	GULL WING	J BEND	THROUGH-HOLE	GULL WING	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	0.5 mm	2.54 mm	1.27 mm	0.5 mm	1.27 mm	2.54 mm	0.5 mm	1.27 mm
Terminal location	ZIG-ZAG	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	ZIG-ZAG
Is it Rohs certified?	-	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	-	FUJITSU	-	FUJITSU	FUJITSU	-	FUJITSU	FUJITSU	FUJITSU	FUJITSU
Parts packaging code	-	DIP	SOIC	DIP	LCC	SOIC	LCC	DIP	SOIC	ZIP
Contacts	-	20	20	20	26/20	20	26/20	20	20	20
I/O type	-	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-609 code	-	e0	e0	e0	e0	e0	e0	e0	e0	e0
Encapsulate equivalent code	-	DIP20,.3	TSSOP20/24,.63,20	DIP20,.3	SOJ20/26,.34	TSSOP20/24,.63,20	SOJ20/26,.34	DIP20,.3	TSSOP20/24,.63,20	ZIP20,.1
power supply	-	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Maximum standby current	-	0.00025 A	0.00025 A	0.00025 A	0.00025 A	0.00025 A	0.00025 A	0.00025 A	0.00025 A	0.00025 A
Maximum slew rate	-	0.068 mA	0.062 mA	0.062 mA	0.062 mA	0.068 mA	0.054 mA	0.054 mA	0.068 mA	0.062 mA
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)

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