ArrayJ Series
Silicon Photomultiplier
(SiPM) High Fill-Factor
Arrays
ON Semiconductor’s range of J−Series SiPM sensors have been
used to create high fill−factor, scaleable arrays. The sensors are
mounted onto PCB boards with minimal dead space, forming arrays
with industry−leading fill factor of up to 90%.
The back of each ArrayJ has either one or more multi−way
connectors, or a BGA (ball grid array). These allow access to the fast
output* and standard I/O from each pixel in the array, and a common
I/O from the summed substrates of the pixels.
The ArrayJ products with connectors can be used to interface with
the user ’s own readout via a mating connector, or to a
ON Semiconductor Breakout Board (BOB). The BOBs allow for easy
access to the pixel signals and performance evaluation of the arrays.
ArrayJ products with the BGA can be reflow soldered to the user’s
readout boards, or purchased ready−mounted on a pinned PCB
evaluation board for easy testing. A BGA ArrayJ cannot be removed
from it’s PCB evaluation board. This contrasts with an ArrayJ with
connectors, as multiple arrays can be evaluated with a single BOB.
ArrayJ Inputs and Outputs (I/O)
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S1
F1
S2
F2
Common
Figure 1 summarizes the array schematic for a portion of an ArrayJ.
Each SiPM sensor in the array has three electrical connections: fast
output, standard output and common.
The substrates (cathodes) of all sensors are summed together to
form the common I/O.
Each individual fast output and standard I/O (anode) are routed to its
own output pin.
The pixel−level performance of the sensors in the array can be found
in the
J−Series datasheet.
Table of Contents
ARRAYJ-60035-64P-PCB
(8 X 8 Array of 6 mm Pixels) . . . . . . . . . . . . . . . . . . . . 2
ARRAYX-BOB6-64P
(Breakout Board for the ARRAYJ-60035-64P) . . . . . . . . . 5
ARRAYX-BOB6-64S
(Summed Breakout Board for the ARRAYJ-60035-64P) . . . 7
ARRAYJ-60035-4P-BGA
(2 X 2 Array of 6 mm Pixels) . . . . . . . . . . . . . . . . . . . . 9
ARRAYJ-60035-4P-PCB
(2 X 2 Array of 6 mm Pixels) . . . . . . . . . . . . . . . . . . . . 12
ARRAYJ-300XX-16P-PCB
(4 X 4 Array of 3 mm Pixels) . . . . . . . . . . . . . . . . . . 17
ARRAYJ-BOB3-16P
(ARRAYJ-300XX-16P Breakout Board) . . . . . . . . . . . . . . 19
ARRAYJ-300XX-64P-PCB
(8 X 8 Array of 3 mm Pixels) . . . . . . . . . . . . . . . . . . 21
ARRAYJ-BOB3-64P
(ARRAYJ-300XX-64P & ARRAYJ-40035-64P
Breakout Board) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Biasing and Readout from the Standard Breakout Boards . . . . . . . . . . . . . . . . . 27
Appendix A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Appendix B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Appendix C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Sn+1
Fn+1
Sn+2
Fn+2
Figure 1. Signal connections at the pixel
level on the ArrayJ products.
ATTENTION!
Great care should be taken when disconnecting the
ArrayJ PCBs from the mating connectors, either on one
of the BOBs, or the user’s own boards.
The board should be gently levered up, working
progressively around the board to lever the PCB from the
connector a little on all sides, and then repeating the
process until the connectors are free from each other.
Use of Scintillators with the ArrayJ
Products
Please consult the
Application Note
on the use of
scintillators with the TSV arrays.
* The fast output is not available on the 2x2 array (ARRAYJ−60035−4P).
©
Semiconductor Components Industries, LLC, 2018
November, 2018
−
Rev. 4
1
Publication Order Number:
ARRAYJ−SERIES/D
ArrayJ Series
ARRAYJ−60035−64P−PCB (8 X 8 Array of 6 mm Pixels)
Array Size
8x8
Sensor Type
60035
Readout
Pixel
Board Size
50.44 x 50.44 mm
2
Pixel Pitch
6.33 mm
No. Connections
160
No. Connectors
2 x 80−way
The ARRAYJ−60035−64P is comprised of 64 individual
6 mm J−Series sensors arranged in a 8 x 8 array.
The performance of the individual pixels and details of the
bias to apply can be found in the
J−Series datasheet.
The connections to each array are provided by two Samtec
80−way connectors, type QTE−040−03−F−D−A. These
connectors mate with the Samtec QSE−040−01−F−D−A
board−to−board connector and the Samtec EQCD High
Speed Cable Assemblies. The 64 SiPM pixels all have
substrate connections (cathode) summed to form a common
I/O. The 80−way connectors provide connections as
follows:
•
64 x fast output
•
64 x standard I/O
•
32 x common I/O
•
16 x shield contacts to the Common
ARRAYJ−60035−64P Board Drawing
8
1
J1
J2
64
57
The complete ARRAYJ−60035−64P−PCB CAD is available to
download.
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2
ArrayJ Series
ARRAYX−BOB6−64P (Breakout Board for the
ARRAYJ−60035−64P)
The ARRAYX−BOB6−64P is an evaluation board
allowing easy access to all the signals of a
ON Semiconductor ARRAYJ−60035−64P, 6 mm 8 x 8 TSV
SiPM array.
The Breakout Board features two Samtec 80−way
connectors, type QSE−040−01−F−D−A. These connectors
mate with the Samtec QTE−040−03−F−D−A board−to−
board connector on the array. Since the connectors are
keyed, orientating the array on the BOB is straight−forward.
All signals on the array are routed via the mating
connectors to header pins. These pins are formed of four
50−way (25 x 2 row) 2.54 mm pitch headers; J3, J4, J5 and
J6. Each of the four headers also has 8 pins left unconnected
to allow prototyping for evaluation purposes.
The three SMA connectors on the board can be connected
via the supplied jumper cable to any of the array header pins
and used for accessing signals or suppling bias voltage. Four
7 mm holes are aligned on a 25 mm grid to allow mounting
of the board on an optical breadboard.
See Appendices A and B for examples of Breakout Board
usage.
Figure 3. Layout of the ARRAYX−BOB6−64P. The dimensions of the board are 112 mm x 112 mm.
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