NXP Semiconductors
User’s guide
Document Number: KTFRDMHB2000EVMUG
Rev. 1.0, 3/2016
FRDM-HB2000-EVM evaluation board
Figure 1. FRDM-HB2000-EVM
© 2016 NXP B.V.
Contents
1
2
3
4
5
6
7
8
9
10
11
Important notice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Getting started . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Getting to know the hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
FRDM-KL25Z Freedom SPI dongle. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Installing the software and setting up the hardware. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Board layout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Board bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Accessory item bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
FRDM-HB2000-EVM evaluation board,
Rev. 1.0
2
NXP Semiconductors
Important notice
1
Important notice
NXP provides the enclosed product(s) under the following conditions:
This evaluation kit is intended for use of ENGINEERING DEVELOPMENT OR EVALUATION PURPOSES ONLY.
It is provided as a sample IC pre-soldered to a printed circuit board to make it easier to access inputs, outputs, and
supply terminals. This evaluation board may be used with any development system or other source of I/O signals
by simply connecting it to the host MCU or computer board via off-the-shelf cables. This evaluation board is not a
Reference Design and is not intended to represent a final design recommendation for any particular application.
Final device in an application will be heavily dependent on proper printed circuit board layout and heat sinking
design as well as attention to supply filtering, transient suppression, and I/O signal quality.
The goods provided may not be complete in terms of required design, marketing and or manufacturing related
protective considerations, including product safety measures typically found in the end product incorporating the
goods. Due to the open construction of the product, it is the user's responsibility to take any and all appropriate
precautions with regard to electrostatic discharge. In order to minimize risks associated with the customers
applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or
procedural hazards. For any safety concerns, contact NXP sales and technical support services.
Should this evaluation kit not meet the specifications indicated in the kit, it may be returned within 30 days from the
date of delivery and will be replaced by a new kit.
NXP reserves the right to make changes without further notice to any products herein. NXP makes no warranty,
representation or guarantee regarding the suitability of its products for any particular purpose, nor does NXP
assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and
all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary
in different applications and actual performance may vary over time. All operating parameters, including “Typical”,
must be validated for each customer application by customer’s technical experts.
NXP does not convey any license under its patent rights nor the rights of others. NXP products are not designed,
intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the NXP product
could create a situation where personal injury or death may occur.
Should the Buyer purchase or use NXP products for any such unintended or unauthorized application, the Buyer
shall indemnify and hold NXP and its officers, employees, subsidiaries, affiliates, and distributors harmless against
all claims, costs, damages and expenses, and reasonable attorney fees arising out of, directly or indirectly, any
claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges
NXP was negligent regarding the design or manufacture of the part. NXP™ and the NXP logo are trademarks of
NXP Semiconductor, Inc. All other product or service names are the property of their respective owners.
© 2016 NXP B.V.
FRDM-HB2000-EVM evaluation board,
Rev. 1.0
NXP Semiconductors
3
Getting started
2
2.1
Getting started
Kit contents/packing list
The FRDM-HB2000-EVM contents includes:
• Assembled and tested evaluation board/module in anti-static bag
• FRDM-KL25Z
• Warranty card
2.2
Jump start
NXP’s analog product development boards help to easily evaluate NXP products. These tools support analog mixed signal and power
solutions including monolithic ICs using proven high-volume SMARTMOS mixed signal technology, and system-in-package devices
utilizing power, SMARTMOS and MCU dies. NXP products enable longer battery life, smaller form factor, component count reduction, ease
of design, lower system cost and improved performance in powering state of the art systems.
• Go to
www.nxp.com/FRDM-HB2000-EVM
• Review the tool summary page
• Look for
Jump Start Your Design
• Download documents, software and other information
Once the files are downloaded, review the user guide in the bundle. The user guide includes setup instructions, BOM and schematics.
Jump start bundles are available on each tool summary page with the most relevant and current information. The information includes
everything needed for design.
2.3
Required equipment and software
To use this kit, you need:
• 3/16” blade screwdriver for connecting the cables
• DC Power supply: 5.0 V to 40 V with up to 20 A current handling capability, depending on motor requirements
• USB Standard A (male) to mini-B (male) cable
• Typical loads (brushed DC motor, power resistors or inductive load with up to 5.0 A and 28 V operation)
• Function generator (optional)
• FRDM-KL25Z Freedom Development Platform for SPI communication (included in KIT)
• SPIGen software from
www.nxp.com
(For using FRDM-KL25Z based SPI Dongle)
2.4
System requirements
The kit requires the following to function properly with the software:
• USB enabled computer with Windows XP or newer
FRDM-HB2000-EVM evaluation board,
Rev. 1.0
4
NXP Semiconductors
Getting to know the hardware
3
3.1
Getting to know the hardware
Board overview
The FRDM-HB2000-EVM evaluation kit exercises all the functions of the MC33HB2000 H-Bridge device. The parallel input can be easily
controlled by lab equipment or any MCU with GPIOs. The board can be used in conjunction with a FRDM-KL25Z board connected to a
PC’s USB port. Configure, control, and monitor the status of MC33HB2000 by using the board’s SPI communication capabilities.
3.2
Board features
The FRDM-HB2000-EVM board evaluates the NXP part MC33HB2000, including all functions. The board features the following:
• Built-in reverse battery protection
• Test points allows probing its signals
• Built-in voltage regulator to supply logic level circuitry
• LEDs to indicate the supply status and the direction of the motor
• Low equivalent series resistance (ESR) capacitor to reduce ripple in the power supply
• Transient voltage suppressor to handle system level transients
3.3
Block diagram
The hardware block diagram is shown in
Figure 2.
5V Voltage
Reverse
Power Supply
Battery and
Transient
Protection
VPWR
LED
Regulator
Optional 5.0 V Supply to FRDM
Charge Pump Capacitor
VDD LED
Optional 3.3 V Supply from FRDM
VPWR
VDDQ
CCP
FS_B
From
MCU
GPIO
IN1
IN2
ENBL
DIS
MOSI
MCU
SPI
MISO
SCLK
CSB
OUT1
FWD LED
FS_B LED
To MCU
GPIO
MC33HB2000
OUT2
REV LED
Load
CFB
Shunt
Resistor
To MCU
ADC input
All Grounds
Figure 2. Block diagram
FRDM-HB2000-EVM evaluation board,
Rev. 1.0
NXP Semiconductors
5
Embedded System
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