T-1
3
/
4
(5mm) White LED Lamp
LTL2H3TWK
LTL2R7TWK
Feature
Low power consumption.
High efficiency.
Versatile mounting on P.C. Board or panel.
I.C. compatible/low current requirements.
T-1
3
/
4
type package.
Package Dimensions
LTL2R7TWK / LTL2H3TWK
Description
The source color devices are made with Gallium Nitride Light
Emitting Diode.
The devices are made with water clear epoxy package, and
with 15 and 50 degrees of viewing angle
Notes:
1. All dimensions are in millimeters (inches).
0.25mm (.010") unless otherwise noted.
2. Tolerance is
3. Protruded resin under flange is 1.0mm (.04 ) Max.
4. Lead spacing is measured where the leads emerge from
the package.
5. Specifications are subject to change without notice.
Devices
Part No.
LTL
2H3TWK
2R7TWK
Y
R
A
IN
IM
L
E
R
P
Lens
Source
Color
Water Clear
Water Clear
GaN White
GaN White
Absolute Maximum Ratings at Ta=25
Parameter
Power Dissipation
Peak Forward Current(1/10 Duty Cycle, 0.1ms Pulse Width)
Continuous Forward Current
Reverse Voltage
Operating Temperature Range
Storage Temperature Range
Lead Soldering Temperature[1.6mm(.063") From Body]
White
120
100
30
5
-25
-30
260
to + 80
to + 100
for 5 Seconds
Unit
mW
mA
mA
V
4-5
353twk.p65
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Adobe PageMaker 6.5C/Win
WHITE COLOR
PRODUCTS
Electrical / Optical Characteristics and Curves at Ta= 25
Parameter
Luminous
Intensity
Viewing Angle
Chromaticity
Coordinate
Forward Voltage
Reverse
Notes:
1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve.
2. The Iv guarantee should be added
15% tolerance.
3. Iv classification code is marked on each packing bag.
is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
4.
5. The chromaticity coordinates (x,y) is derived from the 1931 CIE chromaticity diagram.
6. Precautions in handling:
When soldering, leave 2mm of minimum clearance from the resin to the soldering point.
Dipping the resin to solder must be avoided.
Correcting the soldered position after soldering must be avoided.
In soldering, do not apply any stress to the lead frame particularly when heated.
When forming a lead, make sure not to apply any stress inside the resin.
Lead forming must be done before soldering.
It is necessary to cut the lead frame at normal temperature.
7. Caution in ESD
Static electricity and surge damages the LED. It is recommend to use a wrist band or anti-electrostatic glove when handling
the LED. All devices, equipment and machinry must be properly grounded.
Y
R
A
IN
IM
L
E
R
P
Symbol
Part No.
LTL
2H3TWK
2R7TWK
2H3TWK
2R7TWK
Min.
Typ.
2000
500
20
50
Max.
Unit
Test
Condition
I
F
=20mA
Note 1,2,3
I
V
mcd
2
deg
-
-
Note 4
X
0.29
0.29
3.5
Y
I
F
=20mA
Note 5
V
F
I
R
V
I
F
=20mA
V
R
=5V
100
A
4-6
353twk.p65
Page 6
2000/7/10, ¤U¤È 10:34
Adobe PageMaker 6.5C/Win
DSP and ARM Processors
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