EPAPER SPECIFICATIONS
SPEC NO
REV NO
2.7" e-Paper (B)
Display
Specifications
Waveshare Electronics Room 813, Dynamic World Building,
Zhenhua Rd, Futian District, Shenzhen China
Website: www.waveshare.com
2.7" e-Paper (B)
Product Specification
Revision History
Rev.
1.0
1.1
Issued Date
Sep.10.2015
Oct.15.2015
Revised Contents
Preliminary
1.
1.
2.
In part 6: Delete command 70h.
In part 14: Add packing.
In part 5-1): Modify pin out list.
In part 7-5): Modify reference circuit.
In part 8: Modify typical operating sequence.
In part 11: Modify T=+40℃, RH=90% for 1000 hrs to T=+40℃, RH=80% for 240 hrs.
1.2
Nov.03.2015
3.
4.
5.
Ver 1.2
2 / 43
2.7" e-Paper (B)
Product Specification
TECHNICAL SPECIFICATION
CONTENTS
NO.
-
-
-
1
2
3
4
5
6
7
8
9
10
11
12
13
ITEM
Cover
Revision History
Contents
Application
Features
Mechanical Specifications
Mechanical Drawing of EPD module
Input/Output Terminals
Command Table
Electrical Characteristics
Typical Operating Sequence
Optical Characteristics
Handling, Safety and Environment Requirements
Reliability test
Point and line standard
Packing
PAGE
1
2
3
4
4
4
5
6
8
27
33
37
39
40
42
43
Ver 1.2
3 / 43
Product Specification
1. Over View
2.7" e-Paper (B)
The display is a TFT active matrix electrophoretic display, with interface and a reference system design. The 2.7” active area contains
264×176 pixels, and has 1-bit white/black and 1-bit red full display capabilities. An integrated circuit contains gate buffer, source
buffer, interface, timing control logic, oscillator, DC-DC, SRAM, LUT, VCOM and border are supplied with each panel.
2. Features
High contrast
High reflectance
Ultra wide viewing angle
Ultra low power consumption
Pure reflective mode
Bi-stable
Commercial temperature range
Landscape, portrait mode
Antiglare hard-coated front-surface
Low current sleep mode
On chip display RAM
Waveform stored in On-chip OTP
Serial peripheral interface available
On-chip oscillator
On-chip booster and regulator control for generating VCOM, Gate and source driving voltage
I
2
C Signal Master Interface to read external temperature sensor
Available in COG package IC thickness 280um
3. Mechanical Specifications
Parameter
Screen Size
Display Resolution
Active Area
Pixel Pitch
Pixel Configuration
Outline Dimension
Weight
Specifications
2.7
264(H) × 176(V)
57.288(H) × 38.192(V)
0.217 × 0.217
Rectangle
70.42(H) × 45.8(V) × 0.98(D)
6.08±0.5
mm
g
Unit
Inch
Pixel
mm
mm
Dpi: 117
Remark
Ver 1.2
4 / 43
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
