1N4148-1
Glass Axial Switching Diode
Qualified per MIL-PRF-19500/116
Qualified Levels:
JAN, JANTX, and
JANTXV
Available on
commercial
versions
DESCRIPTION
This popular 1N4148-1 JEDEC registered switching/signal diode features internal
metallurgical bonded construction for military grade products per MIL-PRF-19500/116. This
small low capacitance diode, with very fast switching speeds, is hermetically sealed and
bonded into a double-plug DO-35 package. It may be used in a variety of very high speed
applications including switchers, detectors, transient OR'ing, logic arrays, blocking, as well as
low-capacitance steering diodes, etc. Microsemi also offers a variety of other switching/signal
diodes.
Important:
For the latest information, visit our website
http://www.microsemi.com.
FEATURES
•
•
•
•
•
•
•
•
•
Popular JEDEC registered 1N4148 number.
Hermetically sealed glass construction.
Metallurgically bonded.
Double plug construction.
Very low capacitance.
Very fast switching speeds with minimal reverse recovery times.
JAN, JANTX, and JANTXV qualifications are available per MIL-PRF-19500/116.
MSP screening is also available in reference to MIL-PRF-19500 (JANS).
(See
part nomenclature
for all available options.)
RoHS compliant version available (commercial grade only).
DO-35
(DO-204AH)
Package
Also available in:
DO-213AA package
(surface mount)
1N4148UR-1
UB package
(surface mount)
1N4148UB
UB2 package
(2-Pin surface mount)
1N4148UB2
APPLICATIONS / BENEFITS
•
•
•
•
•
•
•
High frequency data lines.
Small size for high density mounting using flexible thru-hole leads (see package illustration).
RS-232 & RS–422 interface networks.
Ethernet 10 base T.
Low capacitance steering or blocking.
LAN.
Computers.
UBC package
(Ceramic Lid surface mount)
1N4148UBC
MAXIMUM RATINGS
@ 25 ºC unless otherwise stated
Parameters/Test Conditions
Junction and Storage Temperature
(1)
Thermal Resistance Junction-to-Lead
(2)
Thermal Resistance Junction-to-Ambient
Maximum Breakdown Voltage
Working Peak Reverse Voltage
(3)
Average Rectified Current @ T
A
= 75 ºC
Non-Repetitive Sinusoidal Surge Current (tp = 8.3 ms)
Symbol
T
J
& T
STG
R
ӨJL
R
ӨJA
V
(
BR)
V
RWM
I
O
I
FSM
Value
-65 to +175
250
325
100
75
200
2
Unit
o
C
o
C/W
o
C/W
V
V
mA
A (pk)
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
NOTES:
1. Lead length = .375 inch (9.35 mm). See
Figure 2
for thermal impedance curves.
2. T
A
= +75°C on printed circuit board (PCB), PCB = FR4 - .0625 inch (1.59 mm) 1-layer 1-Oz Cu,
horizontal, in still air; pads for axial = .092 inch (2.34 mm) diameter, strip = .030 inch (0.76 mm) x 1 inch
(25.4 mm) long, lead length L ≤ 0.187 inch (≤ 4.75 mm); R
ӨJA
with a defined PCB thermal resistance
condition included, is measured at I
O
= 200 mA.
3. See
Figure 1
for derating.
T4-LDS-0281, Rev. 1 (121567)
©2012 Microsemi Corporation
Page 1 of 4
1N4148-1
MECHANICAL and PACKAGING
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CASE: Hermetically sealed glass package.
TERMINALS: Tin/lead plated or RoHS compliant matte-tin (on commercial grade only) over copper clad steel. Solderable per
MIL-STD-750, method 2026.
POLARITY: Cathode indicated by band.
MARKING: Part number.
TAPE & REEL option: Standard per EIA-296. Consult factory for quantities.
WEIGHT: 0.2 grams.
See
Package Dimensions
on last page.
PART NOMENCLATURE
JAN
Reliability Level
JAN = JAN level
JANTX = JANTX level
JANTXV = JANTXV level
MSP (reference JANS)
See 1N6642 for JANS level
1N4148 -1
(e3)
RoHS Compliance
e3 = RoHS compliant (on
commercial grade only)
Blank = non-RoHS compliant
Metallurgically Bonded
Blank = Commercial grade
JEDEC type number
(see
Electrical Characteristics
table)
Symbol
I
R
I
O
t
rr
V
F
V
R
V
RWM
SYMBOLS & DEFINITIONS
Definition
Reverse Current: The maximum reverse (leakage) current that will flow at the specified voltage and temperature.
Average Rectified Forward Current: The output current averaged over a full cycle with a 50 Hz or 60 Hz sine-wave
input and a 180 degree conduction angle.
Reverse Recovery Time: The time interval between the instant the current passes through zero when changing from
the forward direction to the reverse direction and a specified decay point after a peak reverse current occurs.
Forward Voltage: The forward voltage the device will exhibit at a specified current (typically shown as maximum
value).
Reverse Voltage: The reverse voltage dc value, no alternating component.
Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating temperature range
excluding all transient voltages (ref JESD282-B). Also sometimes known as PIV.
ELECTRICAL CHARACTERISTICS
@ 25 ºC unless otherwise noted
FORWARD FORWARD REVERSE FORWARD
VOLTAGE VOLTAGE RECOVERY RECOVERY
V
F2
@
TIME
V
F1
@
TIME
t
rr
t
fr
I
F
=10 mA I
F
=100 mA
(Note 1)
(Note 2)
V
V
ns
ns
REVERSE
CURRENT
I
R1
@ 20 V
REVERSE
CURRENT
I
R2
@ 75 V
µA
REVERSE REVERSE
CURRENT CURRENT
I
R3
I
R4
@ 20 V
@ 75 V
T
A
=150
o
C T
A
=150
o
C
µA
µA
CAPACI-
TANCE
C
(Note 3)
pF
CAPACI-
TANCE
C
(Note 4)
pF
nA
0.8
1.2
5
20
25
0.5
35
75
4.0
2.8
NOTE 1:
I
F
= I
R
= 10 mA, R
L
= 100 Ohms.
NOTE 2:
I
F
= 50 mA.
NOTE 3:
V
R
= 0 V, f = 1 MHz, V
SIG
= 50 mV (pk to pk).
NOTE 4:
V
R
= 1.5V, f = 1 MHz, V
SIG
= 50 mV (pk to pk).
T4-LDS-0281, Rev. 1 (121567)
©2012 Microsemi Corporation
Page 2 of 4
1N4148-1
PACKAGE DIMENSIONS
Ltr
BD
BL
LD
LL
LL
1
Dimensions
Inch
Millimeters
Min
Max
Min
Max
.056
.075
1.42
1.91
.140
.180
3.56
4.57
.018
.022
0.46
0.56
1.000
1.500
25.40
38.10
.050
1.27
Notes
3
3
4
NOTES:
1. Dimensions are in inch.
2. Millimeters are given for general information only.
3. Package contour optional within BD and length BL. Heat slugs, if any, shall be included within this cylinder
but shall not be subject to minimum limit of BD. The BL dimension shall include the entire body including
slugs.
4. Within this zone lead, diameter may vary to allow for lead finishes and irregularities other than heat slugs.
5. In accordance with ASME Y14.5M, diameters are equivalent to
Φx
symbology.
T4-LDS-0281, Rev. 1 (121567)
©2012 Microsemi Corporation
Page 4 of 4
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