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M5M5256DFP-70XL-I

Description
Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, 0.450 INCH, SOP-28
Categorystorage   
File Size46KB,7 Pages
ManufacturerMitsubishi
Websitehttp://www.mitsubishielectric.com/semiconductors/
Environmental Compliance  
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M5M5256DFP-70XL-I Overview

Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, 0.450 INCH, SOP-28

M5M5256DFP-70XL-I Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
MakerMitsubishi
Parts packaging codeSOIC
package instructionSOP,
Contacts28
Reach Compliance Codeunknown
ECCN codeEAR99
Is SamacsysN
Maximum access time70 ns
JESD-30 codeR-PDSO-G28
length17.5 mm
memory density262144 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals28
word count32768 words
character code32000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize32KX8
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height2.4 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width8.4 mm
Base Number Matches1
'97.4.7
MITSUBISHI LSIs
M5M5256DP,KP,FP,VP,RV -45LL-I,-55LL-I,-70LL-I,
-45XL-I,-55XL-I,-70XL-I
262144-BIT (32768-WORD BY 8-BIT) CMOS STATIC RAM
DESCRIPTION
The M5M5256DP,KP,FP,VP,RV is 262,144-bit CMOS static RAMs
organized as 32,768-words by 8-bits which is fabricated using
high-performance 3 polysilicon CMOS technology. The use of
resistive load NMOS cells and CMOS periphery results in a high
density and low power static RAM. Stand-by current is small
enough for battery back-up application. It is ideal for the memory
systems which require simple interface.
Especially the M5M5256DVP,RV are packaged in a 28-pin thin
small outline package.Two types of devices are available,
M5M5256DVP(normal lead bend type package),
M5M5256DRV(reverse lead bend type package). Using both types of
devices, it becomes very easy to design a printed circuit board.
PIN CONFIGURATION (TOP VIEW)
A14
A12
1
2
A7
3
A6
4
A5
5
A4
6
7
A3
A2
8
A1
9
A0
10
DQ1 11
DQ2 12
DQ3 13
GND 14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
Vcc
/W
A13
A8
A9
A11
/OE
A10
/S
DQ8
DQ7
DQ6
DQ5
DQ4
M5M5256DP,KP,FP
-I
FEATURE
Type
Access Power supply current
time
Active Stand-by
(max)
(max)
(max)
45ns
55ns
70ns
45ns
55ns
70ns
55mA
(Vcc=5.5V)
M5M5256DP, KP, FP,VP,RV-45LL
M5M5256DP, KP, FP,VP,RV-55LL
M5M5256DP, KP, FP,VP,RV-70LL
M5M5256DP, KP, FP,VP,RV-45XL
M5M5256DP, KP, FP,VP,RV-55XL
M5M5256DP, KP, FP,VP,RV-70XL
Outline 28P4 (DP)
28P4Y (DKP)
28P2W-C (DFP)
22 /OE
23 A11
24 A9
25 A8
26 A13
27 /W
28Vcc
1 A14
2 A12
3 A7
4 A6
5 A5
6 A4
7 A3
A10 21
/S 20
DQ8 19
DQ7 18
DQ6 17
DQ5 16
DQ415
GND 14
DQ3 13
DQ2 12
DQ1 11
A0 10
A1 9
A2 8
40µA
(Vcc=5.5V)
10µA
(Vcc=5.5V)
0.05µA
(Vcc=3.0V,
Typical)
M5M5256DVP
-I
•Single +5V power supply
•No clocks, no refresh
•Data-Hold on +2.0V power supply
•Directly TTL compatible : all inputs and outputs
•Three-state outputs : OR-tie capability
•/OE prevents data contention in the I/O bus
•Common Data I/O
•Battery backup capability
•Low stand-by current··········0.05µA(typ.)
Outline 28P2C-A (DVP)
7 A3
6 A4
5 A5
4 A6
3 A7
2 A12
1 A14
28 Vcc
27 /W
26 A13
25 A8
24 A9
23 A11
22 /OE
A2 8
A1 9
A0 10
DQ1 11
DQ2 12
DQ3 13
GND 14
DQ4 15
DQ5 16
DQ6 17
DQ7 18
DQ8 19
/S 20
A10 21
PACKAGE
M5M256DP
: 28 pin
M5M5256DKP
: 28 pin
M5M5256DFP
: 28 pin
M5M5256DVP,RV : 28pin
600 mil DIP
300 mil DIP
450 mil SOP
2
8 X 13.4 mm
M5M5256DRV
-I
TSOP
APPLICATION
Small capacity memory units
Outline 28P2C-B (DRV)
MITSUBISHI
ELECTRIC
1

M5M5256DFP-70XL-I Related Products

M5M5256DFP-70XL-I M5M5256DRV-45XL-I M5M5256DFP-55XL-I M5M5256DRV-70XL-I M5M5256DVP-55LL-I M5M5256DRV-55LL-I
Description Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, 0.450 INCH, SOP-28 Standard SRAM, 32KX8, 45ns, CMOS, PDSO28, 8 X 13.40 MM, REVERSE, TSOP-28 Standard SRAM, 32KX8, 55ns, CMOS, PDSO28, 0.450 INCH, SOP-28 Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, 8 X 13.40 MM, REVERSE, TSOP-28 Standard SRAM, 32KX8, 55ns, CMOS, PDSO28, 8 X 13.40 MM, TSOP-28 Standard SRAM, 32KX8, 55ns, CMOS, PDSO28, 8 X 13.40 MM, REVERSE, TSOP-28
Parts packaging code SOIC TSOP SOIC TSOP TSOP TSOP
package instruction SOP, TSOP1-R, SOP, TSOP1-R, TSOP1, TSOP1-R,
Contacts 28 28 28 28 28 28
Reach Compliance Code unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 70 ns 45 ns 55 ns 70 ns 55 ns 55 ns
JESD-30 code R-PDSO-G28 R-PDSO-G28 R-PDSO-G28 R-PDSO-G28 R-PDSO-G28 R-PDSO-G28
length 17.5 mm 11.8 mm 17.5 mm 11.8 mm 11.8 mm 11.8 mm
memory density 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
Number of terminals 28 28 28 28 28 28
word count 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words
character code 32000 32000 32000 32000 32000 32000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP TSOP1-R SOP TSOP1-R TSOP1 TSOP1-R
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.4 mm 1.2 mm 2.4 mm 1.2 mm 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 1.27 mm 0.55 mm 1.27 mm 0.55 mm 0.55 mm 0.55 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
width 8.4 mm 8 mm 8.4 mm 8 mm 8 mm 8 mm
Maker Mitsubishi Mitsubishi Mitsubishi - Mitsubishi Mitsubishi
Base Number Matches 1 1 1 1 - -
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