MLX90340
Datasheet
1. Features and Benefits
Triaxis Hall Technology
On Chip Signal Processing for Robust
Absolute Position Sensing
ASIL-A capable, Safety Element out of
Context (SEooC)
Programmable Measurement Range
Programmable Linear Transfer
Characteristic (Multi-points 4 or Piece-
Wise-Linear 17)
Selectable Analog (Ratiometric) or PWM
Output
12 bit Resolution - 10 bit Thermal Accuracy
48 bit ID Number option
Single Die – SOIC-8 Package RoHS
Compliant
Dual Die (Full Redundant) – TSSOP-16
Package RoHS Compliant
rotary position from 0 to 360 Degrees or linear
displacement, stroke - Figure 2). It enables the
design of novel generation of non-contacting
position sensors that are frequently required for
both heavy-duty and industrial applications.
The MLX90340 reports a programmable
ratiometric analog output signal compatible with
a programmable linear Hall sensor. Through
programming, the MLX90340 provides also a
digital PWM (Pulse Width Modulation) output
characteristic.
V
DD
V
DIG
Prot.
Reg
DSP
V
X
V
Y
V
Z
RAM
EEPROM
MUX
Tria xis
®
Output Stage
12 bit Analog
G
ADC
µC
12 bit PWM
OUT
ROM - Firmware
V
SS
2. Application Examples
Absolute Rotary Position Sensor
Absolute Linear Position Sensor
Non-Contacting Potentiometer
3. Description
The MLX90340 is a monolithic sensor IC sensitive
to the flux density applied orthogonally and
parallel to the IC surface.
The MLX90340 is sensitive to the three
components of the flux density applied to the IC
(i.e. Bx, By and Bz). This allows the MLX90340 with
the correct magnetic circuit to decode the
absolute position of any moving magnet (e.g.
REVISION 001 - AUGUST 10, 2018
[3901090340]
MLX90340
Datasheet
Contents
1. Features and Benefits ........................................................................................................................ 1
2. Application Examples......................................................................................................................... 1
3. Description........................................................................................................................................ 1
4. Ordering Information ........................................................................................................................ 4
5. Functional Diagram ........................................................................................................................... 6
6. Glossary of Terms .............................................................................................................................. 7
7. Pin Definitions and Descriptions......................................................................................................... 8
7.1. Pin Definition for SOIC-8 ..................................................................................................................... 8
7.2. Pin Definition for TSSOP-16 ................................................................................................................ 9
8. Absolute Maximum Ratings ............................................................................................................. 10
9. Detailed General Description ........................................................................................................... 10
10. General Electrical Specifications ..................................................................................................... 11
11. Isolation Specification .................................................................................................................... 13
12. Timing Specification....................................................................................................................... 14
12.1. Latency time Definition .................................................................................................................. 14
12.2. Step Response Definition ............................................................................................................... 15
13. Accuracy ....................................................................................................................................... 16
14. Magnetic Specification................................................................................................................... 17
15. CPU & Memory Specification ......................................................................................................... 18
16. End-User Programmable Items ...................................................................................................... 18
17. Description of End-User Programmable Items ................................................................................ 20
Output Mode ........................................................................................................................................... 20
17.1. .......................................................................................................................................................... 20
17.1.1. Analog Output mode ................................................................................................................ 20
17.1.2. PWM Output mode .................................................................................................................. 20
17.2. Output Transfer Characteristic ...................................................................................................... 20
17.2.1. Enable Scaling Parameter......................................................................................................... 21
17.2.2. Clockwise parameter ................................................................................................................ 21
17.2.3. Discontinuity point (or Zero degree point) ............................................................................. 22
17.2.4. 4-Pts LNR Parameters ............................................................................................................... 22
17.2.5. 17-Pts LNR Parameters............................................................................................................. 23
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Datasheet
17.2.6. CLAMPING Parameters............................................................................................................. 24
17.3. Identification ................................................................................................................................... 24
17.4. Sensor Front-End ............................................................................................................................ 25
17.4.1. MAPXYZ ..................................................................................................................................... 25
17.4.2. K parameter .............................................................................................................................. 25
17.4.3. GAINMIN and GAINMAX Parameters ...................................................................................... 26
17.5. Filter................................................................................................................................................. 26
17.6. Programmable Diagnostic Settings ................................................................................................ 27
17.6.1. Fixed-level diagnostic reporting ............................................................................................... 27
17.6.2. HAMHOLE Parameter ............................................................................................................... 28
17.7. Lock .................................................................................................................................................. 28
17.8. EEPROM endurance ........................................................................................................................ 29
18. Self Diagnostic ............................................................................................................................... 29
19. Recommended Application Diagrams ............................................................................................. 32
19.1. MLX90340 in SOIC-8 Package ........................................................................................................ 32
19.2. MLX90340 in TSSOP-16 Package.................................................................................................... 33
20. Standard information regarding manufacturability of Melexis products with different soldering
processes ....................................................................................................................................... 34
21. ESD Precautions ............................................................................................................................ 35
22. Package Information...................................................................................................................... 35
22.1. SOIC-8 - Package Dimensions ......................................................................................................... 35
22.2. SOIC-8 - Pinout and Marking .......................................................................................................... 36
22.3. SOIC-8 - Sensitive spot Positioning ................................................................................................ 36
22.4. TSSOP16 - Package Dimensions ..................................................................................................... 38
22.5. TSSOP16 - Pinout and Marking ...................................................................................................... 39
22.6. TSSOP16 - Sensitive spot Positioning ............................................................................................. 39
23. Disclaimer ..................................................................................................................................... 41
24. Contacts........................................................................................................................................ 42
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MLX90340
Datasheet
4. Ordering Information
Product
MLX90340
MLX90340
MLX90340
MLX90340
Temperature
L (-40°C to 150°C)
L (-40°C to 150°C)
E (-40°C to 85°C)
E (-40°C to 85°C)
Package Option Code
DC
GO
DC
DC
AAA-000
AAA-000
AAA-000
AAA-200
Packing Form Definition
RE
RE
RE
RE
Standard version – Heavy-duty
Standard version – Heavy-duty
Standard version - Industrial
360deg Pre-programmed analog
Industrial
MLX90340
MLX90340
S (-20°C to 85°C)
S (-20°C to 85°C)
DC
DC
AAA-000
AAA-000
RE
RE
Standard version - Consumer
360deg Pre-programmed analog
- Consumer
90deg Pre-programmed analog
Industrial
MLX90340
E (-40°C to 85°C)
DC
AAA-100
RE
MLX90340
E (-40°C to 85°C)
DC
AAA-300
RE
180deg Pre-programmed analog
Industrial
MLX90340
E (-40°C to 85°C)
DC
AAA-400
RE
270deg Pre-programmed analog
Industrial
MLX90340
MLX90340
S (-20°C to 85°C)
S (-20°C to 85°C)
DC
DC
AAA-000
AAA-200
RE
RE
Standard version - Consumer
360deg Pre-programmed analog
- Consumer
90deg Pre-programmed analog -
Consumer
180deg Pre-programmed analog
- Consumer
270deg Pre-programmed analog
- Consumer
MLX90340
S (-20°C to 85°C)
DC
AAA-100
RE
MLX90340
S (-20°C to 85°C)
DC
AAA-300
RE
MLX90340
S (-20°C to 85°C)
DC
AAA-400
RE
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MLX90340
Datasheet
Legend:
Temperature Code:
L: from -40°C to 150°C
E: from -40°C to 85°C
S: from -20°C to 85°C
Package Code:
“DC” for SOIC-8 package
“GO” for TSSOP-16 package (dual die)
Option Code:
AAA-xxx: die Version
xxx-
123
1:
Application
2:
N/A
3:
N/A
Packing Form:
Ordering Example:
RE “for Reel”, TU “for Tube”,
“MLX90340EDC-AAA-000-RE”
For a Standard version from -40 to 85degC in SOIC-8 package, delivered in Reel.
Table 1: Ordering information Legend
0: Standard version
1: Pre-programmed version in Analog output mode – Transfer function
of 80%Vdd/90deg
2: Pre-programmed version in Analog output mode – Transfer function
of 80%Vdd/360deg
3: Pre-programmed version in Analog output mode – Transfer function
of 80%Vdd/180deg
4: Pre-programmed version in Analog output mode – Transfer function
of 80%Vdd/270deg
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