Datasheet
Omnipolar Detection Hall IC
BU52492NUZ
General Description
The omnipolar detection Hall IC is magnetic switch that
can operate both S-and N-pole.
This Hall IC product can be in tablets, smart phones, and
other applications in order to detect open and close of
the cover.
Key Specifications
V
DD
Voltage Range:
1.65 V to 3.60 V
Operate Point:
±2.4 mT(Typ)
Hysteresis:
0.4 mT(Typ)
Period:
50 ms(Typ)
Supply Current(Average):
4.2 µA (Typ)
Output Type:
CMOS
Operating Temperature Range: -40 °C to +85 °C
W(Typ) x D(Typ) x H(Max)
1.10mm x 1.40mm x 0.40mm
Features
Omnipolar Detection
Micro Power Operation (Small Current Using
Intermittent Operation Method)
Ultra-compact Package
Package
VSON04Z1114A
Applications
Tablets, Smart Phones, Notebook Computers,
Digital Video Cameras, Digital Still Cameras, etc.
Typical Application Circuit and Block Diagram
VDD
0.1µF
TIMING
LOGIC
HALL
ELEMENT
DYNAMIC
OFFSET
CANCELLATION
SAMPLE
& HOLD
LATCH
Adjust the bypass capacitor value
as necessary, according to power
supply noise conditions, etc.
×
OUT
GND
Pin Descriptions
Pin No.
1
2
3
4
Pin Name
VDD
GND
NC
OUT
Function
Power supply
(Note 1)
Ground
Non Connect
Pin Configurations
TOP VIEW (pads not visible)
VDD
OUT
1
4
EXP-PAD
Output
The EXP-PAD of the center of
product connect to GND or
floating.
No connection internally.
2
GND
3
NC
-
EXP-PAD
(Note 1)
Dispose a bypass capacitor as close as possible to the IC.
〇Product
structure : Silicon monolithic integrated circuit
.
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〇This
product has no designed protection against radioactive rays
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Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Key Specifications .......................................................................................................................................................................... 1
Package .......................................................................................................................................................................................... 1
Typical Application Circuit and Block Diagram ................................................................................................................................ 1
Pin Descriptions .............................................................................................................................................................................. 1
Pin Configurations .......................................................................................................................................................................... 1
Absolute Maximum Ratings ............................................................................................................................................................ 3
Thermal Resistance ........................................................................................................................................................................ 3
Recommended Operating Conditions ............................................................................................................................................. 4
Magnetic, Electrical Characteristics ................................................................................................................................................ 4
Measurement Circuit ....................................................................................................................................................................... 5
Typical Performance Curves ........................................................................................................................................................... 6
Figure 5. Operate Point, Release Point vs Ambient Temperature ............................................................................................... 6
Figure 6. Operate Point, Release Point vs Supply Voltage ......................................................................................................... 6
Figure 7. Period vs Ambient Temperature ................................................................................................................................... 6
Figure 8. Period vs Supply Voltage ............................................................................................................................................. 6
Figure 9. Supply Current vs Ambient Temperature ...................................................................................................................... 7
Figure 10. Supply Current vs Supply Voltage .............................................................................................................................. 7
Description of Operations ............................................................................................................................................................... 8
Intermittent Operation at Power ON .............................................................................................................................................. 10
Magnet Selection .......................................................................................................................................................................... 10
Position of the Hall Element .......................................................................................................................................................... 10
I/O Equivalence Circuit ................................................................................................................................................................. 10
Operational Notes ......................................................................................................................................................................... 11
Ordering Information ..................................................................................................................................................................... 13
Marking Diagrams ......................................................................................................................................................................... 13
Physical Dimension and Packing Information ............................................................................................................................... 14
Revision History ............................................................................................................................................................................ 15
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Absolute Maximum Ratings (Ta=25°C)
Parameter
Power Supply Voltage
Output Current
Storage Temperature Range
Maximum Junction Temperature
Symbol
V
DD
I
OUT
Tstg
Tjmax
Rating
4.5
±0.5
-40 to +125
125
Unit
V
mA
°C
°C
Caution 1:
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2:
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance
(Note 2)
Parameter
VSON04Z1114A
Junction to Ambient
Junction to Top Characterization Parameter
(Note 3)
θ
JA
Ψ
JT
512.5
281
206.1
101
°C/W
°C/W
Symbol
Thermal Resistance (Typ)
1s
(Note 4)
2s2p
(Note
5)
Unit
(Note 2)
Based on JESD51-2A(Still-Air).
(Note 3)
The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 4)
Using a PCB board based on JESD51-3.
(Note 5)
Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Single
Top
Copper Pattern
Footprints and Traces
Layer Number of
Measurement Board
4 Layers
Top
Copper Pattern
Footprints and Traces
Material
FR-4
Board Size
114.3mm x 76.2mm x 1.57mmt
Thickness
70μm
Material
FR-4
Board Size
114.3mm x 76.2mm x 1.6mmt
2 Internal Layers
Thickness
70μm
Copper Pattern
74.2mm x 74.2mm
Thickness
35μm
Thermal Via
(Note 6)
Pitch
Diameter
1.20mm
Φ0.30mm
Bottom
Copper Pattern
74.2mm x 74.2mm
Thickness
70μm
(Note 6)
This thermal via connects with the copper pattern of all layers.
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Recommended Operating Conditions
Parameter
Power Supply Voltage
Operating Temperature
Symbol
V
DD
Topr
Min
1.65
-40
Typ
1.80
+25
Max
3.60
+85
Unit
V
°C
Magnetic, Electrical Characteristics (Unless otherwise specified V
DD
=1.8 V Ta=25 °C)
Parameter
Symbol
B
OPS
Operate Point
B
OPN
B
RPS
Release Point
B
RPN
B
HYSS
Hysteresis
B
HYSN
Period
Output High Voltage
Output Low Voltage
Supply Current
t
P
V
OH
V
OL
I
DD
-
-
V
DD
-0.2
-
-
0.4
50
-
-
4.2
-
100
-
0.2
8.0
ms
V
V
µA
-
-
-2.0
0.4
-0.7
-
mT
-
-
I
OUT
=-0.5mA
I
OUT
=+0.5mA
Average
-3.7
0.7
-2.4
2.0
-
-
mT
-
-
Min
-
Typ
2.4
Max
3.7
mT
-
-
Unit
-
Conditions
(Note)
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
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Measurement Circuit
B
OP
/B
RP
VDD
V
DD
100µF
OUT
GND
V
t
P
200Ω
VDD
V
DD
Oscilloscope
OUT
GND
B
OP
and B
RP
are measured by applying an external magnetic
field
Figure 1. B
OP
, B
RP
Measurement Circuit
The period is monitored by an oscilloscope
Figure 2. t
P
Measurement Circuit
V
OH
, V
OL
VDD
V
DD
100µF
GND
OUT
V
I
OUT
Figure 3. V
OH
, V
OL
Measurement Circuit
I
DD
A
VDD
V
DD
2200µF
OUT
GND
Figure 4. I
DD
Measurement Circuit
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