MLX90378 - Triaxis® Position Processor
Datasheet
Features and Benefits
Triaxis
Hall Technology
On Chip Signal Processing for Robust
Absolute Position Sensing
ISO26262 ASIL-C capable, Safety Element out
of Context (SEooC)
Input / Gateway Pin for External
Measurement
Programmable Measurement Range
Programmable Linear Transfer Characteristic
(4 Multi-points per axis)
Dual PWM Output
Selectable PWM or (fast) SENT Outputs
SAE J2716 APR2016 SENT
Enhanced serial data communication
48 bit ID Number option
Single Die - SOIC-8 Package RoHS Compliant
Dual Die – TSSOP-16 Package RoHS Compliant
Description
The MLX90378 is a monolithic magnetic position
processor IC designed for 3D motion applications
(e.g. joysticks). It consists of a Triaxis® Hall
magnetic front end, an analog to digital signal
conditioner, a DSP for advanced signal processing
and a dual output stage driver capable of
providing two PWM outputs or a single SENT
output with two channels.
The MLX90378 is sensitive to the three
components of the magnetic flux density applied
to the IC (i.e. Bx, By and Bz). This allows the
MLX90378 with the correct magnetic circuit to
decode the absolute position of any moving
magnet. It enables the design of non-contacting
3D position sensors that are frequently required
for both automotive and industrial applications.
The MLX90378 provides output data according to
the SENT protocol or via two PWM signals. The
SENT frames can be encoded in a variety of
formats (e.g. H.1 format). Additionally, the SENT
protocol allows for external measurements, error
codes, and user defined values. The two PWM
(Pulse Width Modulated) signals correspond to
the joystick angle.
INPUT
V
DD
V
DEC
SOIC-8
TSSOP-16
Application Examples
Ext. Signal
Rev. Pol &
Overvolt Prot.
Analog
Regulator
Digital
Regulator
Automotive Shift Levers
Industrial Joysticks
Transmission Position Sensors
PWM
Meas.
Output Stage 1
Temp Sensor
DSP
12 bit SENT
O
UT
1
MUX
RAM
NVRAM
Tria xis
®
G
V
X
V
Y
V
Z
ADC
µC
12 bit PWM
Output Stage 2
O
UT
2
12 bit PWM
ROM - Firmware
V
SS
REVISION 001 - NOVEMBER 28 2018
3901090378
ML90378 Triaxis® Position Processor
Datasheet
Ordering Information
Product
MLX90378
MLX90378
Temp.
G
G
Package
DC
GO
Option Code
ABJ-300
ABJ-300
Packing
Form
RE
RE
Definition
3D / Joystick position
3D / Joystick position
Table 1 - Ordering Codes
Temperature Code:
Package Code:
Option Code:
G: from -40°C to 160°C
DC: SOIC-8 package (see 18.1)
GO: TSSOP-16 package (redundant dual die, see 18.5)
ABJ-123
1:
Application - Magnetic configuration
3: 3D / Joystick position
2:
SW configuration
For SOIC-8 (code DC) and TSSOP-16 (code GO) packages
0: SENT 3µs mode
Option Code
Packing Form:
3:
N/A
0: Default
-RE : Tape & Reel
DC: 3000 pcs / reel
GO: 4500 pcs / reel
MLX90378GGO-ABJ-300-RE
For a dual die standard version delivered in tape and reel packaging.
Table 2 - Ordering Codes Information
Ordering Example:
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ML90378 Triaxis® Position Processor
Datasheet
Contents
Features and Benefits ..................................................................................................................... 1
Application Examples ...................................................................................................................... 1
Description..................................................................................................................................... 1
Ordering Information ..................................................................................................................... 2
1. Functional Diagram and Application Modes ................................................................................. 6
2. Glossary of Terms ....................................................................................................................... 7
3. Pin Definitions and Descriptions .................................................................................................. 8
3.1. Pin Definition for SOIC-8 package ............................................................................................ 8
3.2. Pin Definition for TSSOP-16 package ....................................................................................... 8
4. Absolute Maximum Ratings ......................................................................................................... 9
5. Isolation Specification ................................................................................................................. 9
6. General Electrical Specifications ................................................................................................ 10
6.1. Supply System Electrical Specifications ................................................................................. 10
6.2. Output Electrical Specifications ............................................................................................. 11
6.3. Input Electrical Specifications ................................................................................................ 11
7. Timing Specification .................................................................................................................. 12
7.1. General Timing Specifications ............................................................................................... 12
7.2. Timing Modes ........................................................................................................................ 12
7.2.1. Continuous Asynchronous Acquisition Mode .................................................................. 12
7.2.2. Continuous Synchronous Acquisition Mode .................................................................... 13
7.3. Timing Definitions .................................................................................................................. 14
7.3.1. Startup Time .................................................................................................................... 14
7.3.2. Latency (average) ............................................................................................................. 15
7.3.3. Step Response (worst case) ............................................................................................. 16
7.4. PWM timing specifications .................................................................................................... 17
7.5. SENT timing specifications ..................................................................................................... 17
8. Magnetic Field Specifications .................................................................................................... 19
8.1. Standard Joystick Mode ......................................................................................................... 19
9. Accuracy Specifications ............................................................................................................. 20
9.1. Definition ............................................................................................................................... 20
9.2. Standard Mode Nominal Performances ................................................................................ 20
9.3. Standard Mode Limited Performances .................................................................................. 21
10. Memory Specifications ............................................................................................................ 22
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Datasheet
11. Digital output protocol ............................................................................................................ 23
11.1. PWM (pulse width modulation) ........................................................................................... 23
11.1.1. Definition ....................................................................................................................... 23
11.1.2. PWM performances ....................................................................................................... 23
11.2. Single Edge Nibble Transmission (SENT) SAE J2716 ............................................................ 24
11.2.1. Sensor message definition ............................................................................................. 24
11.2.2. Sensor message frame contents .................................................................................... 25
11.2.3. SENT message format for dual angle output (standard Joystick mode) ........................ 25
11.2.4. SENT message format for XYZ output (magnetometer mode) ...................................... 25
11.2.5. SENT message format for angle and input/gateway measurement .............................. 27
11.2.6. Start-up behaviour ......................................................................................................... 27
11.2.7. SENT Timing configuration ............................................................................................. 28
11.2.8. Serial message channel (slow channel).......................................................................... 29
11.2.9. Serial Message Error Code ............................................................................................. 31
11.2.10. SENT configuration shorthand definition .................................................................... 32
12. End-User Programmable Items ................................................................................................ 33
12.1. End User Identification Items .............................................................................................. 38
13. Description of End-User Programmable Items ......................................................................... 39
13.1. Output Configuration .......................................................................................................... 39
13.1.1. Channel Selection .......................................................................................................... 39
13.1.2. OUT mode (ABE_OUT_MODE) ....................................................................................... 39
13.1.3. Digital OUT protocol (PROTOCOL) ................................................................................. 40
13.1.4. Serial Channel Configuration - Status and Communication Nibble................................ 40
13.1.5. Pushbutton Output ........................................................................................................ 40
13.1.6. PWM Output Mode ....................................................................................................... 41
13.2. Angular Calculation Formula ............................................................................................... 41
13.2.1. Standard Formula (NV_ENHFORM)................................................................................ 41
13.2.2. Enhanced Formula ......................................................................................................... 41
13.3. Output Transfer Characteristic ............................................................................................ 42
13.3.1. CW (Clockwise) Parameter ............................................................................................ 43
13.3.2. Discontinuity Point (or Zero Degree Point) .................................................................... 43
13.3.3. 4-Pts LNR Parameters .................................................................................................... 43
13.3.4. CLAMPING Parameters .................................................................................................. 44
13.4. Sensor Front-End ................................................................................................................. 45
13.4.1. SENSING MODE (NV_DSP_CHANNEL_MAPXYZ) ............................................................. 45
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Datasheet
13.4.2. GAINMIN and GAINMAX Parameters ............................................................................. 45
13.5. External input and switch .................................................................................................... 46
13.6. Filter .................................................................................................................................... 48
13.6.1. Exponential Moving Average (IIR) Filter ........................................................................ 48
13.6.2. FIR Filters ....................................................................................................................... 48
13.7. Programmable Diagnostics Settings .................................................................................... 49
13.7.1. Diagnostics Global Enable .............................................................................................. 49
13.7.2. Diagnostic Debouncer .................................................................................................... 49
13.7.3. Over/Under Temperature Diagnostic ............................................................................ 50
13.7.4. Field Strength Diagnostic ............................................................................................... 51
13.7.5. PWM Diagnostic ............................................................................................................. 51
14. Functional Safety .................................................................................................................... 52
14.1. Safety Manual ...................................................................................................................... 52
14.2. Safety Mechanisms .............................................................................................................. 52
15. Recommended Application Diagrams ...................................................................................... 56
15.1. Wiring with the MLX90378 in SOIC-8 Package .................................................................... 56
15.2. Wiring with the MLX90378 in TSSOP-16 Package ................................................................ 57
15.3. Wiring for Switch Button function ....................................................................................... 58
16. Standard information regarding manufacturability of Melexis products with different
soldering processes .................................................................................................................. 59
17. ESD Precautions ...................................................................................................................... 59
18. Package Information ............................................................................................................... 60
18.1. SOIC-8 - Package Dimensions .............................................................................................. 60
18.2. SOIC-8 - Pinout and Marking ............................................................................................... 61
18.3. SOIC-8 – Sensitive spot positioning ..................................................................................... 61
18.4. SOIC-8 – Angle detection ..................................................................................................... 62
18.5. TSSOP-16 - Package Dimensions .......................................................................................... 63
18.6. TSSOP-16 - Pinout and Marking ........................................................................................... 64
18.7. TSSOP-16 – Sensitive spot positioning................................................................................. 64
18.8. TSSOP-16 - Angle Detection................................................................................................. 65
18.9. Packages Thermal Performances ......................................................................................... 65
19. Contact .................................................................................................................................. 66
20. Disclaimer .............................................................................................................................. 66
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Embedded System
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