Basic information of LH2101AD/883 amplifier:
LH2101AD/883 is an OPERATIONAL AMPLIFIER. Commonly used packaging methods are DIP, DIP16,.3
LH2101AD/883 amplifier core information:
The minimum operating temperature of LH2101AD/883 is -55 °C and the maximum operating temperature is 125 °C.
The power supply range is: +-15/+-20 V. The input offset voltage of LH2101AD/883 is 3000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)
Relevant dimensions of LH2101AD/883:
LH2101AD/883 has 16 terminals. Its terminal position type is: DUAL. Terminal pitch is 2.54 mm. Total pins: 16
LH2101AD/883 amplifier other information:
LH2101AD/883 adopts the VOLTAGE-FEEDBACK architecture. It does not belong to the low offset class of amplifiers. The frequency compensation status of LH2101AD/883 is: NO. Its temperature grade is: MILITARY. LH2101AD/883 does not comply with Rohs certification.
The corresponding JESD-30 code is: R-XDIP-T16. The corresponding JESD-609 code is: e0. The packaging code of LH2101AD/883 is: DIP. LH2101AD/883 packaging materials are mostly CERAMIC. The package shape is RECTANGULAR.
The LH2101AD/883 package pin format is: IN-LINE. Its terminal form is: THROUGH-HOLE.
Basic information of LH2101AD/883 amplifier:
LH2101AD/883 is an OPERATIONAL AMPLIFIER. Commonly used packaging methods are DIP, DIP16,.3
LH2101AD/883 amplifier core information:
The minimum operating temperature of LH2101AD/883 is -55 °C and the maximum operating temperature is 125 °C.
The power supply range is: +-15/+-20 V. The input offset voltage of LH2101AD/883 is 3000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)
Relevant dimensions of LH2101AD/883:
LH2101AD/883 has 16 terminals. Its terminal position type is: DUAL. Terminal pitch is 2.54 mm. Total pins: 16
LH2101AD/883 amplifier other information:
LH2101AD/883 adopts the VOLTAGE-FEEDBACK architecture. It does not belong to the low offset class of amplifiers. The frequency compensation status of LH2101AD/883 is: NO. Its temperature grade is: MILITARY. LH2101AD/883 does not comply with Rohs certification.
The corresponding JESD-30 code is: R-XDIP-T16. The corresponding JESD-609 code is: e0. The packaging code of LH2101AD/883 is: DIP. LH2101AD/883 packaging materials are mostly CERAMIC. The package shape is RECTANGULAR.
The LH2101AD/883 package pin format is: IN-LINE. Its terminal form is: THROUGH-HOLE.
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| Parts packaging code | DIP |
| package instruction | DIP, DIP16,.3 |
| Contacts | 16 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Is Samacsys | N |
| Amplifier type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| frequency compensation | NO |
| Maximum input offset voltage | 3000 µV |
| JESD-30 code | R-XDIP-T16 |
| JESD-609 code | e0 |
| low-dissonance | NO |
| Number of functions | 2 |
| Number of terminals | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | +-15/+-20 V |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class B (Modified) |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| LH2101AD/883 | LH2101AF/883B | LH2101AF/883 | 5962-01-017-8412 | |
|---|---|---|---|---|
| Description | Operational Amplifier, 2 Func, 3000uV Offset-Max, BIPolar, CDIP16 | Operational Amplifier, 2 Func, 3000uV Offset-Max, BIPolar, CDFP16 | Operational Amplifier, 2 Func, 3000uV Offset-Max, BIPolar, CDFP16 | Operational Amplifier, 2 Func, 3000uV Offset-Max, BIPolar, CDFP16 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | AMD | AMD | AMD | AMD |
| Parts packaging code | DIP | DFP | DFP | DFP |
| package instruction | DIP, DIP16,.3 | DFP, FL16,.3 | DFP, FL16,.3 | DFP, FL16,.3 |
| Contacts | 16 | 16 | 16 | 16 |
| Reach Compliance Code | unknown | unknown | unknown | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Amplifier type | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| frequency compensation | NO | NO | NO | NO |
| Maximum input offset voltage | 3000 µV | 3000 µV | 3000 µV | 3000 µV |
| JESD-30 code | R-XDIP-T16 | R-XDFP-F16 | R-XDFP-F16 | R-XDFP-F16 |
| low-dissonance | NO | NO | NO | NO |
| Number of functions | 2 | 2 | 2 | 2 |
| Number of terminals | 16 | 16 | 16 | 16 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 85 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -25 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DFP | DFP | DFP |
| Encapsulate equivalent code | DIP16,.3 | FL16,.3 | FL16,.3 | FL16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | FLATPACK | FLATPACK | FLATPACK |
| power supply | +-15/+-20 V | +-15/+-20 V | +-15/+-20 V | +-15/+-20 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | YES | YES | YES |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | MILITARY | MILITARY | MILITARY | OTHER |
| Terminal form | THROUGH-HOLE | FLAT | FLAT | FLAT |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| JESD-609 code | e0 | e0 | e0 | - |
| Filter level | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
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