AM29F017D-120ED datasheet, PDF

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AM29F017D-120ED: DescriptionFlash, 2MX8, 120ns, PDSO48, LEAD FREE, MO-142DD, TSOP-48; Categorystorage; File Size805KB，41 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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AM29F017D-120ED Overview

Flash, 2MX8, 120ns, PDSO48, LEAD FREE, MO-142DD, TSOP-48

AM29F017D-120ED Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	TSOP1
package instruction	LEAD FREE, MO-142DD, TSOP-48
Contacts	48
Reach Compliance Code	unknown
ECCN code	EAR99
Is Samacsys	N
Maximum access time	120 ns
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PDSO-G48
JESD-609 code	e3
length	18.4 mm
memory density	16777216 bit
Memory IC Type	FLASH
memory width	8
Humidity sensitivity level	3
Number of functions	1
Number of departments/size	32
Number of terminals	48
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2MX8
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Encapsulate equivalent code	TSSOP48,.8,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	5 V
Programming voltage	5 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.2 mm
Department size	64K
Maximum standby current	0.000005 A
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
switch bit	YES
type	NOR TYPE
width	12 mm
Base Number Matches	1

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Am29F017D

Data Sheet

RETIRED

PRODUCT

This product has been retired and is not recommended for designs. Please contact your Spansion

representative for alternates. Availability of this document is retained for reference and historical

purposes only.

The following document contains information on Spansion memory products.

Continuity of Specifications

There is no change to this data sheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal data sheet improvement and are noted in the

document revision summary.

For More Information

Please contact your local sales office for additional information about Spansion memory solutions.

Publication Number

21195

Revision

Amendment

Issue Date

September 12, 2006

D A T A

S H E E T

TABLE OF CONTENTS

Product Selector Guide . . . . . . . . . . . . . . . . . . . . .

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . .

Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . .

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Ordering Information . . . . . . . . . . . . . . . . . . . . . . .

Device Bus Operations . . . . . . . . . . . . . . . . . . . . .

Requirements for Reading Array Data .....................................

Writing Commands/Command Sequences ..............................

Program and Erase Operation Status ......................................

Standby Mode ..........................................................................

RESET#: Hardware Reset Pin .................................................

Output Disable Mode................................................................

DQ6: Toggle Bit I ....................................................................

DQ2: Toggle Bit II ...................................................................

Reading Toggle Bits DQ6/DQ2...............................................

DQ5: Exceeded Timing Limits ................................................

DQ3: Sector Erase Timer .......................................................

Figure 5. Toggle Bit Algorithm........................................................ 21

Table 10. Write Operation Status................................................... 22

Table 1. Am29F017D Device Bus Operations .................................. 7

Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 23

Figure 6. Maximum Negative Overshoot Waveform ...................... 23

Figure 7. Maximum Positive Overshoot Waveform........................ 23

Table 2. Sector Address Table.......................................................... 9

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 23

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 24

TTL/NMOS Compatible .......................................................... 24

CMOS Compatible.................................................................. 24

Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Figure 8. Test Setup...................................................................... 25

Table 11. Test Specifications ......................................................... 25

Autoselect Mode..................................................................... 10

Table 3. Am29F017D Autoselect Codes (High Voltage Method).... 10

Sector Group Protection/Unprotection.................................... 10

Table 4. Sector Group Addresses................................................... 10

Temporary Sector Group Unprotect ....................................... 10

Figure 1. Temporary Sector Group Unprotect Operation................ 11

Key to Switching Waveforms. . . . . . . . . . . . . . . . 25

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 26

Read-only Operations............................................................. 26

Figure 9. Read Operation Timings ................................................. 26

Hardware Data Protection ...................................................... 11

Common Flash Memory Interface (CFI) . . . . . . . 12

Table 5. CFI Query Identification String .......................................... 12

Table 6. System Interface String..................................................... 12

Table 7. Device Geometry Definition .............................................. 13

Table 8. Primary Vendor-Specific Extended Query ........................ 13

Hardware Reset (RESET#) .................................................... 27

Figure 10. RESET# Timings .......................................................... 27

Erase/Program Operations..................................................... 28

Figure 11. Program Operation Timings..........................................

Figure 12. Chip/Sector Erase Operation Timings ..........................

Figure 13. Data# Polling Timings (During Embedded Algorithms).

Figure 14. Toggle Bit Timings (During Embedded Algorithms)......

Figure 15. DQ2 vs. DQ6.................................................................

Command Definitions . . . . . . . . . . . . . . . . . . . . . 14

Reading Array Data ................................................................ 14

Reset Command..................................................................... 14

Autoselect Command Sequence ............................................ 14

Byte Program Command Sequence....................................... 14

Figure 2. Program Operation .......................................................... 15

Temporary Sector Unprotect .................................................. 32

Figure 16. Temporary Sector Group Unprotect Timing Diagram ... 32

Erase and Program Operations.............................................. 33

Figure 17. Alternate CE# Controlled Write Operation Timings ...... 34

Chip Erase Command Sequence ........................................... 15

Sector Erase Command Sequence ........................................ 16

Erase Suspend/Erase Resume Commands........................... 16

Figure 3. Erase Operation............................................................... 17

Command Definitions ............................................................. 18

Table 9. Am29F017D Command Definitions................................... 18

Write Operation Status . . . . . . . . . . . . . . . . . . . . 19

DQ7: Data# Polling................................................................. 19

Figure 4. Data# Polling Algorithm ................................................... 19

Erase and Programming Performance . . . . . . . . 35

Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 35

TSOP Pin Capacitance . . . . . . . . . . . . . . . . . . . . . 35

Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 36

TS 040—40-Pin Standard Thin Small Outline Package ......... 36

TS 048—48-Pin Standard Thin Small Outline Package ......... 37

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 38

RY/BY#: Ready/Busy# ........................................................... 20

September 12, 2006 21195E5

Am29F017D

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