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IS45S16160D-7BLA1

Description
Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 13 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, MS-207, TFBGA-54
Categorystorage   
File Size916KB,64 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
Environmental Compliance  
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IS45S16160D-7BLA1 Overview

Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 13 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, MS-207, TFBGA-54

IS45S16160D-7BLA1 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIntegrated Silicon Solution ( ISSI )
Parts packaging codeDSBGA
package instructionTFBGA, BGA54,9X9,32
Contacts54
Reach Compliance Codecompliant
ECCN codeEAR99
Is SamacsysN
access modeFOUR BANK PAGE BURST
Maximum access time5.4 ns
Other featuresAUTO/SELF REFRESH
Maximum clock frequency (fCLK)143 MHz
I/O typeCOMMON
interleaved burst length1,2,4,8
JESD-30 codeR-PBGA-B54
JESD-609 codee1
length13 mm
memory density268435456 bit
Memory IC TypeSYNCHRONOUS DRAM
memory width16
Humidity sensitivity level3
Number of functions1
Number of ports1
Number of terminals54
word count16777216 words
character code16000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize16MX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Encapsulate equivalent codeBGA54,9X9,32
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Certification statusNot Qualified
refresh cycle8192
Maximum seat height1.2 mm
self refreshYES
Continuous burst length1,2,4,8,FP
Maximum standby current0.003 A
Maximum slew rate0.16 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature10
width8 mm
Base Number Matches1
IS42S83200D, IS42S16160D
IS45S83200D, IS45S16160D
32Meg x 8,  16Meg x16 
256-MBIT SYNCHRONOUS DRAM
FEATURES
• Clock frequency: 166, 143 MHz
• Fully synchronous; all signals referenced to a
positive clock edge
• Internal bank for hiding row access/precharge
• Single Power supply: 3.3V + 0.3V
• LVTTL interface
• Programmable burst length
– (1, 2, 4, 8, full page)
• Programmable burst sequence:
Sequential/Interleave
• Auto Refresh (CBR)
• Self Refresh
• 8K refresh cycles every 16 ms (A2 grade) or
64 ms (commercial, industrial, A1 grade)
• Random column address every clock cycle
• Programmable CAS latency (2, 3 clocks)
• Burst read/write and burst read/single write
operations capability
• Burst termination by burst stop and precharge
command
IS42S83200D
54-pin TSOPII
54-ball BGA
IS42S16160D
54-pin TSOPII
54-ball BGA
8M x 8 x 4 Banks 4M x16x4 Banks
DECEMBER 2011
OVERVIEW
ISSI
's 256Mb Synchronous DRAM achieves high-speed
data transfer using pipeline architecture. All inputs and
outputs signals refer to the rising edge of the clock input.
The 256Mb SDRAM is organized as follows.
KEY TIMING PARAMETERS
Parameter 
Clk Cycle Time
CAS Latency = 3
CAS Latency = 2
Clk Frequency
CAS Latency = 3
CAS Latency = 2
Access Time from Clock
CAS Latency = 3
CAS Latency = 2
-6 
6
10
166
100
5.4
6.5
-7 
7
10
143
100
5.4
6.5
-75E  Unit
ns
7.5
ns
Mhz
133 Mhz
ns
5.5
ns
OPTIONS
• Package:
54-pin TSOP-II
54-ball BGA
• Operating Temperature Range:
Commercial (0
o
C to +70
o
C)
Industrial (-40
o
C to +85
o
C)
Automotive Grade A1 (-40
o
C to +85
o
C)
Automotive Grade A2 (-40
o
C to +105
o
C)
ADDRESS TABLE
Parameter
Configuration
Refresh Count
32M x 8
8M x 8 x 4
banks
Com./Ind. 8K/64ms
A1 8K/64ms
A2 8K/16ms
A0-A12
A0-A9
BA0, BA1
A10/AP
16M x 16
4M x 16 x 4
banks
8K/64ms
8K/64ms
8K/16ms
A0-A12
A0-A8
BA0, BA1
A10/AP
Row Addresses
Column Addresses
Bank Address Pins
Auto Precharge Pins
Copyright © 2010 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time with-
out notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain
the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can
reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such ap-
plications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc. — www.issi.com
Rev.  E
12/01/2011
1

IS45S16160D-7BLA1 Related Products

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Description Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 13 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, MS-207, TFBGA-54 Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54 Synchronous DRAM, 16MX16, 5.4ns, CMOS, PDSO54, 0.400 INCH, ROHS COMPLIANT, TSOP2-54 Synchronous DRAM, 16MX16, 5.4ns, CMOS, PDSO54 Synchronous DRAM, 16MX16, 5.4ns, CMOS, PDSO54, 0.400 INCH, ROHS COMPLIANT, TSOP2-54 Synchronous DRAM, 16MX16, 5.4ns, CMOS, PDSO54 Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 13 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, MS-207, TFBGA-54 Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54 Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 13 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, MS-207, TFBGA-54 Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to conform to conform to
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant compliant compliant
Maximum access time 5.4 ns 5.4 ns 5.4 ns 5.4 ns 5.4 ns 5.4 ns 5.4 ns 5.4 ns 5.4 ns 5.4 ns
Maximum clock frequency (fCLK) 143 MHz 143 MHz 143 MHz 143 MHz 143 MHz 143 MHz 143 MHz 143 MHz 166 MHz 166 MHz
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
interleaved burst length 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8
JESD-30 code R-PBGA-B54 S-PBGA-B54 R-PDSO-G54 R-PDSO-G54 R-PDSO-G54 R-PDSO-G54 R-PBGA-B54 S-PBGA-B54 R-PBGA-B54 S-PBGA-B54
memory density 268435456 bit 268435456 bit 268435456 bit 268435456 bit 268435456 bit 268435456 bit 268435456 bit 268435456 bit 268435456 bit 268435456 bit
Memory IC Type SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM
memory width 16 16 16 16 16 16 16 16 16 16
Number of terminals 54 54 54 54 54 54 54 54 54 54
word count 16777216 words 16777216 words 16777216 words 16777216 words 16777216 words 16777216 words 16777216 words 16777216 words 16777216 words 16777216 words
character code 16000000 16000000 16000000 16000000 16000000 16000000 16000000 16000000 16000000 16000000
Maximum operating temperature 85 °C 85 °C 105 °C 105 °C 85 °C 85 °C 105 °C 105 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 16MX16 16MX16 16MX16 16MX16 16MX16 16MX16 16MX16 16MX16 16MX16 16MX16
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TFBGA FBGA TSOP2 TSOP TSOP2 TSOP TFBGA FBGA TFBGA FBGA
Encapsulate equivalent code BGA54,9X9,32 BGA54,9X9,32 TSOP54,.46,32 TSOP54,.46,32 TSOP54,.46,32 TSOP54,.46,32 BGA54,9X9,32 BGA54,9X9,32 BGA54,9X9,32 BGA54,9X9,32
Package shape RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR SQUARE
Package form GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 8192 8192 8192 8192 8192 8192 8192 8192 8192 8192
Continuous burst length 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP
Maximum standby current 0.003 A 0.003 A 0.003 A 0.003 A 0.003 A 0.003 A 0.003 A 0.003 A 0.003 A 0.003 A
Maximum slew rate 0.16 mA 0.16 mA 0.16 mA 0.16 mA 0.16 mA 0.16 mA 0.16 mA 0.16 mA 0.18 mA 0.18 mA
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL GULL WING GULL WING GULL WING GULL WING BALL BALL BALL BALL
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM DUAL DUAL DUAL DUAL BOTTOM BOTTOM BOTTOM BOTTOM
Maker Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) - - Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )
Base Number Matches 1 1 1 1 1 1 - - - -
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