Dual-Core Intel
®
Xeon
®
Processor
3000
Δ
Series
Datasheet
on 65 nm Process in the 775-land LGA Package
November 2007
Document Number: 314915-002
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Δ
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Φ
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®
64 requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel 64.
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®
Virtualization Technology requires a computer system with an enabled Intel
®
processor, BIOS, virtual machine monitor (VMM) and, for some
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The Dual-Core Intel
®
Xeon
®
processor 3000 series may contain design defects or errors known as errata which may cause the product to deviate from
published specifications.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
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Copyright © 2006-2007 Intel Corporation.
2
Dual-Core Intel® Xeon® Processor 3000 Series Datasheet
Contents
1
Introduction
............................................................................................................ 11
1.1
Terminology ..................................................................................................... 11
1.1.1 Processor Terminology ............................................................................ 12
1.2
References ....................................................................................................... 13
Electrical Specifications
........................................................................................... 15
2.1
Power and Ground Lands.................................................................................... 15
2.2
Decoupling Guidelines ........................................................................................ 15
2.2.1 VCC Decoupling ..................................................................................... 15
2.2.2 Vtt Decoupling ....................................................................................... 15
2.2.3 FSB Decoupling...................................................................................... 16
2.3
Voltage Identification ......................................................................................... 16
2.4
Market Segment Identification (MSID) ................................................................. 18
2.5
Reserved, Unused, and TESTHI Signals ................................................................ 18
2.6
...................................................................................................................... 19
2.7
Voltage and Current Specification ........................................................................ 19
2.7.1 Absolute Maximum and Minimum Ratings .................................................. 19
2.7.2 DC Voltage and Current Specification ........................................................ 20
2.7.3 V
CC
Overshoot ....................................................................................... 24
2.7.4 Die Voltage Validation ............................................................................. 24
2.8
Signaling Specifications...................................................................................... 25
2.8.1 FSB Signal Groups.................................................................................. 25
2.8.2 CMOS and Open Drain Signals ................................................................. 27
2.8.3 Processor DC Specifications ..................................................................... 27
2.8.3.1 GTL+ Front Side Bus Specifications ............................................. 29
2.8.4 Clock Specifications ................................................................................ 29
2.8.5 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ............................ 29
2.8.6 FSB Frequency Select Signals (BSEL[2:0])................................................. 30
2.8.7 Phase Lock Loop (PLL) and Filter .............................................................. 30
2.8.8 BCLK[1:0] Specifications (CK505 based Platforms) ..................................... 30
2.8.9 BCLK[1:0] Specifications (CK410 based Platforms) ..................................... 32
2.9
PECI DC Specifications ....................................................................................... 33
Package Mechanical Specifications
.......................................................................... 35
3.1
Package Mechanical Drawing............................................................................... 36
3.1.1 Processor Component Keep-Out Zones ...................................................... 40
3.1.2 Package Loading Specifications ................................................................ 40
3.1.3 Package Handling Guidelines.................................................................... 40
3.1.4 Package Insertion Specifications............................................................... 40
3.1.5 Processor Mass Specification .................................................................... 41
3.1.6 Processor Materials................................................................................. 41
3.2
Processor Markings............................................................................................ 41
3.2.1 Processor Land Coordinates ..................................................................... 43
Land Listing and Signal Descriptions
....................................................................... 45
4.1
Processor Land Assignments ............................................................................... 45
4.2
Alphabetical Signals Reference ............................................................................ 68
Thermal Specifications and Design Considerations
.................................................. 75
5.1
Processor Thermal Specifications ......................................................................... 75
5.1.1 Thermal Specifications ............................................................................ 75
5.1.2 Thermal Metrology ................................................................................. 80
5.2
Processor Thermal Features ................................................................................ 80
2
3
4
5
Dual-Core Intel® Xeon® Processor 3000 Series Datasheet
3
5.3
5.2.1 Thermal Monitor .....................................................................................80
5.2.2 Thermal Monitor 2 ..................................................................................81
5.2.3 On-Demand Mode ...................................................................................82
5.2.4 PROCHOT# Signal ..................................................................................83
5.2.5 THERMTRIP# Signal ................................................................................83
Platform Environment Control Interface (PECI) ......................................................84
5.3.1 Introduction ...........................................................................................84
5.3.1.1 Key Difference with Legacy Diode-Based Thermal Management .......84
5.3.2 PECI Specifications .................................................................................86
5.3.2.1 PECI Device Address..................................................................86
5.3.2.2 PECI Command Support .............................................................86
5.3.2.3 PECI Fault Handling Requirements ...............................................86
5.3.2.4 PECI GetTemp0() Error Code Support ..........................................86
6
Features
..................................................................................................................87
6.1
Power-On Configuration Options ..........................................................................87
6.2
Clock Control and Low Power States .....................................................................87
6.2.1 Normal State .........................................................................................88
6.2.2 HALT and Extended HALT Powerdown States ..............................................88
6.2.2.1 HALT Powerdown State ..............................................................88
6.2.2.2 Extended HALT Powerdown State ................................................89
6.2.3 Stop Grant and Extended Stop Grant States ...............................................89
6.2.3.1 Stop Grant State .......................................................................89
6.2.3.2 Extended Stop Grant State .........................................................90
6.2.4 Extended HALT Snoop State, HALT Snoop State, Extended Stop Grant Snoop
State, and Stop Grant Snoop State ...........................................................90
6.2.4.1 HALT Snoop State, Stop Grant Snoop State ..................................90
6.2.4.2 Extended HALT Snoop State, Extended Stop Grant Snoop State.......90
6.3
Enhanced Intel® SpeedStep® Technology ............................................................90
Boxed Processor Specifications................................................................................93
7.1
Mechanical Specifications ....................................................................................94
7.1.1 Boxed Processor Cooling Solution Dimensions.............................................94
7.1.2 Boxed Processor Fan Heatsink Weight .......................................................95
7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly .....95
7.2
Electrical Requirements ......................................................................................95
7.2.1 Fan Heatsink Power Supply ......................................................................95
7.3
Thermal Specifications........................................................................................97
7.3.1 Boxed Processor Cooling Requirements......................................................97
7.3.2 Variable Speed Fan .................................................................................99
Debug Tools Specifications
.................................................................................... 101
8.1
Logic Analyzer Interface (LAI) ........................................................................... 101
8.1.1 Mechanical Considerations ..................................................................... 101
8.1.2 Electrical Considerations ........................................................................ 101
7
8
4
Dual-Core Intel® Xeon® Processor 3000 Series Datasheet
Figures
2-1
2-2
2-3
2-4
2-5
2-6
2-7
3-1
3-2
3-3
3-4
3-5
3-6
3-7
3-8
4-1
4-2
5-1
5-2
5-3
5-4
5-5
5-6
7
8
6-1
7-1
7-2
7-3
7-4
7-5
7-6
7-7
7-8
7-9
V
CC
Static and Transient Tolerance for Processors with 4 MB L2 Cache.......................... 22
V
CC
Static and Transient Tolerance for Processors with 2 MB L2 Cache.......................... 23
V
CC
Overshoot Example Waveform .......................................................................... 24
Differential Clock Waveform.................................................................................... 31
Differential Clock Crosspoint Specification................................................................. 32
Differential Measurements ...................................................................................... 32
Differential Clock Crosspoint Specification................................................................. 33
Processor Package Assembly Sketch ........................................................................ 35
Processor Package Drawing Sheet 1 of 3 .................................................................. 37
Processor Package Drawing Sheet 2 of 3 .................................................................. 38
Processor Package Drawing Sheet 3 of 3 .................................................................. 39
Processor Top-Side Markings Example for the Dual-Core Intel® Xeon®
Processor 3000 Series with 2MB L2 Cache with 1066 MHz FSB .................................... 41
Processor Top-Side Markings Example for the Dual-Core Intel® Xeon®
Processor 3000 Series with 4 MB L2 Cache with 1066 MHz FSB ................................... 42
Processor Top-Side Markings Example for the Dual-Core Intel® Xeon®
Processor 3000 Series with 4 MB L2 Cache with 1333 MHz FSB ................................... 42
Processor Land Coordinates and Quadrants (Top View)............................................... 43
land-out Diagram (Top View – Left Side) .................................................................. 46
land-out Diagram (Top View – Right Side) ................................................................ 47
Thermal Profile (Dual-Core Intel® Xeon® Processor 3000 Series
with 4 MB L2 Cache).............................................................................................. 77
Thermal Profile (Dual-Core Intel® Xeon® 3070/3060 Processor
with 4 MB L2 Cache).............................................................................................. 78
Thermal Profile (Dual-Core Intel® Xeon® Processor 3000 Series
with 2 MB L2 Cache).............................................................................................. 79
Case Temperature (TC) Measurement Location.......................................................... 80
Thermal Monitor 2 Frequency and Voltage Ordering ................................................... 82
Processor PECI Topology ........................................................................................ 86
Conceptual Fan Control on PECI-Based Platforms....................................................... 86
Conceptual Fan Control on Thermal Diode-Based Platforms ......................................... 87
Processor Low Power State Machine......................................................................... 90
Mechanical Representation of the Boxed Processor..................................................... 95
Space Requirements for the Boxed Processor (Side View) ........................................... 96
Space Requirements for the Boxed Processor (Top View) ............................................ 96
Space Requirements for the Boxed Processor (Overall View) ....................................... 97
Boxed Processor Fan Heatsink Power Cable Connector Description ............................... 98
Baseboard Power Header Placement Relative to Processor Socket ................................ 99
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 1 View) .............. 100
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View) .............. 100
Boxed Processor Fan Heatsink Set Points................................................................ 101
Dual-Core Intel® Xeon® Processor 3000 Series Datasheet
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