BX805573050/SLABZ datasheet, PDF

Datasheet> All Categories > Microcontrollers and processors> BX805573050/SLABZ

BX805573050/SLABZ: DescriptionRISC Microprocessor, 64-Bit, 2130MHz, CMOS, PBGA775; CategoryMicrocontrollers and processors; File Size2MB，102 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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BX805573050/SLABZ Overview

RISC Microprocessor, 64-Bit, 2130MHz, CMOS, PBGA775

BX805573050/SLABZ Parametric

Parameter Name	Attribute value
Maker	Intel
package instruction	LGA, LGA775,30X33,46/43
Reach Compliance Code	unknown
Is Samacsys	N
bit size	64
JESD-30 code	R-PBGA-N775
Number of terminals	775
Package body material	PLASTIC/EPOXY
encapsulated code	LGA
Encapsulate equivalent code	LGA775,30X33,46/43
Package shape	RECTANGULAR
Package form	GRID ARRAY
power supply	0.85/1.5 V
Certification status	Not Qualified
speed	2130 MHz
Maximum slew rate	75000 mA
surface mount	YES
technology	CMOS
Terminal form	NO LEAD
Terminal pitch	1.1 mm
Terminal location	BOTTOM
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC
Base Number Matches	1

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Dual-Core Intel

Xeon

Processor

3000

Series

Datasheet

on 65 nm Process in the 775-land LGA Package

November 2007

Document Number: 314915-002

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR

OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS

OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING

TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,

MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT

INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different

processor families. See http://www.intel.com/products/processor_number for details. Over time processor numbers will increment based on changes in

clock, speed, cache, FSB, or other features, and increments are not intended to represent proportional or quantitative increases in any particular

feature. Current roadmap processor number progression is not necessarily representative of future roadmaps. See www.intel.com/products/

processor_number for details.

Intel

64 requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel 64.

Processor will not operate (including 32-bit operation) without an Intel 64-enabled BIOS. Performance will vary depending on your hardware and

software configurations. See http://www.intel.com/info/em64t for more information including details on which processors support Intel 64, or consult

with your system vendor for more information.

No computer system can provide absolute security under all conditions. Intel® Trusted Execution Technology (Intel® TXT) is a security technology under

development by Intel and requires for operation a computer system with Intel® Virtualization Technology, a Intel Trusted Execution Technology-enabled

Intel processor, chipset, BIOS, Authenticated Code Modules, and an Intel or other Intel Trusted Execution Technology compatible measured virtual

machine monitor. In addition, Intel Trusted Execution Technology requires the system to contain a TPMv1.2 as defined by the Trusted Computing Group

and specific software for some uses.

±Intel

Virtualization Technology requires a computer system with an enabled Intel

processor, BIOS, virtual machine monitor (VMM) and, for some

uses, certain platform software enabled for it. Functionality, performance or other benefits will vary depending on hardware and software configurations

and may require a BIOS update. Software applications may not be compatible with all operating systems. Please check with your application vendor.

Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. Check

with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.

The Dual-Core Intel

Xeon

processor 3000 series may contain design defects or errors known as errata which may cause the product to deviate from

published specifications.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Intel, Pentium, Xeon, Intel Inside, Intel Leap ahead, Intel Trusted Execution Technology, Intel SpeedStep, Intel Virtualization Technology, and the Intel

logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

*Other names and brands may be claimed as the property of others.

Dual-Core Intel® Xeon® Processor 3000 Series Datasheet

Contents

Introduction

............................................................................................................ 11

1.1

Terminology ..................................................................................................... 11

1.1.1 Processor Terminology ............................................................................ 12

1.2

References ....................................................................................................... 13

Electrical Specifications

........................................................................................... 15

2.1

Power and Ground Lands.................................................................................... 15

2.2

Decoupling Guidelines ........................................................................................ 15

2.2.1 VCC Decoupling ..................................................................................... 15

2.2.2 Vtt Decoupling ....................................................................................... 15

2.2.3 FSB Decoupling...................................................................................... 16

2.3

Voltage Identification ......................................................................................... 16

2.4

Market Segment Identification (MSID) ................................................................. 18

2.5

Reserved, Unused, and TESTHI Signals ................................................................ 18

2.6

...................................................................................................................... 19

2.7

Voltage and Current Specification ........................................................................ 19

2.7.1 Absolute Maximum and Minimum Ratings .................................................. 19

2.7.2 DC Voltage and Current Specification ........................................................ 20

2.7.3 V

Overshoot ....................................................................................... 24

2.7.4 Die Voltage Validation ............................................................................. 24

2.8

Signaling Specifications...................................................................................... 25

2.8.1 FSB Signal Groups.................................................................................. 25

2.8.2 CMOS and Open Drain Signals ................................................................. 27

2.8.3 Processor DC Specifications ..................................................................... 27

2.8.3.1 GTL+ Front Side Bus Specifications ............................................. 29

2.8.4 Clock Specifications ................................................................................ 29

2.8.5 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ............................ 29

2.8.6 FSB Frequency Select Signals (BSEL[2:0])................................................. 30

2.8.7 Phase Lock Loop (PLL) and Filter .............................................................. 30

2.8.8 BCLK[1:0] Specifications (CK505 based Platforms) ..................................... 30

2.8.9 BCLK[1:0] Specifications (CK410 based Platforms) ..................................... 32

2.9

PECI DC Specifications ....................................................................................... 33

Package Mechanical Specifications

.......................................................................... 35

3.1

Package Mechanical Drawing............................................................................... 36

3.1.1 Processor Component Keep-Out Zones ...................................................... 40

3.1.2 Package Loading Specifications ................................................................ 40

3.1.3 Package Handling Guidelines.................................................................... 40

3.1.4 Package Insertion Specifications............................................................... 40

3.1.5 Processor Mass Specification .................................................................... 41

3.1.6 Processor Materials................................................................................. 41

3.2

Processor Markings............................................................................................ 41

3.2.1 Processor Land Coordinates ..................................................................... 43

Land Listing and Signal Descriptions

....................................................................... 45

4.1

Processor Land Assignments ............................................................................... 45

4.2

Alphabetical Signals Reference ............................................................................ 68

Thermal Specifications and Design Considerations

.................................................. 75

5.1

Processor Thermal Specifications ......................................................................... 75

5.1.1 Thermal Specifications ............................................................................ 75

5.1.2 Thermal Metrology ................................................................................. 80

5.2

Processor Thermal Features ................................................................................ 80

Dual-Core Intel® Xeon® Processor 3000 Series Datasheet

5.3

5.2.1 Thermal Monitor .....................................................................................80

5.2.2 Thermal Monitor 2 ..................................................................................81

5.2.3 On-Demand Mode ...................................................................................82

5.2.4 PROCHOT# Signal ..................................................................................83

5.2.5 THERMTRIP# Signal ................................................................................83

Platform Environment Control Interface (PECI) ......................................................84

5.3.1 Introduction ...........................................................................................84

5.3.1.1 Key Difference with Legacy Diode-Based Thermal Management .......84

5.3.2 PECI Specifications .................................................................................86

5.3.2.1 PECI Device Address..................................................................86

5.3.2.2 PECI Command Support .............................................................86

5.3.2.3 PECI Fault Handling Requirements ...............................................86

5.3.2.4 PECI GetTemp0() Error Code Support ..........................................86

Features

..................................................................................................................87

6.1

Power-On Configuration Options ..........................................................................87

6.2

Clock Control and Low Power States .....................................................................87

6.2.1 Normal State .........................................................................................88

6.2.2 HALT and Extended HALT Powerdown States ..............................................88

6.2.2.1 HALT Powerdown State ..............................................................88

6.2.2.2 Extended HALT Powerdown State ................................................89

6.2.3 Stop Grant and Extended Stop Grant States ...............................................89

6.2.3.1 Stop Grant State .......................................................................89

6.2.3.2 Extended Stop Grant State .........................................................90

6.2.4 Extended HALT Snoop State, HALT Snoop State, Extended Stop Grant Snoop

State, and Stop Grant Snoop State ...........................................................90

6.2.4.1 HALT Snoop State, Stop Grant Snoop State ..................................90

6.2.4.2 Extended HALT Snoop State, Extended Stop Grant Snoop State.......90

6.3

Enhanced Intel® SpeedStep® Technology ............................................................90

Boxed Processor Specifications................................................................................93

7.1

Mechanical Specifications ....................................................................................94

7.1.1 Boxed Processor Cooling Solution Dimensions.............................................94

7.1.2 Boxed Processor Fan Heatsink Weight .......................................................95

7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly .....95

7.2

Electrical Requirements ......................................................................................95

7.2.1 Fan Heatsink Power Supply ......................................................................95

7.3

Thermal Specifications........................................................................................97

7.3.1 Boxed Processor Cooling Requirements......................................................97

7.3.2 Variable Speed Fan .................................................................................99

Debug Tools Specifications

.................................................................................... 101

8.1

Logic Analyzer Interface (LAI) ........................................................................... 101

8.1.1 Mechanical Considerations ..................................................................... 101

8.1.2 Electrical Considerations ........................................................................ 101

Dual-Core Intel® Xeon® Processor 3000 Series Datasheet

Figures

2-1

2-2

2-3

2-4

2-5

2-6

2-7

3-1

3-2

3-3

3-4

3-5

3-6

3-7

3-8

4-1

4-2

5-1

5-2

5-3

5-4

5-5

5-6

6-1

7-1

7-2

7-3

7-4

7-5

7-6

7-7

7-8

7-9

Static and Transient Tolerance for Processors with 4 MB L2 Cache.......................... 22

Static and Transient Tolerance for Processors with 2 MB L2 Cache.......................... 23

Overshoot Example Waveform .......................................................................... 24

Differential Clock Waveform.................................................................................... 31

Differential Clock Crosspoint Specification................................................................. 32

Differential Measurements ...................................................................................... 32

Differential Clock Crosspoint Specification................................................................. 33

Processor Package Assembly Sketch ........................................................................ 35

Processor Package Drawing Sheet 1 of 3 .................................................................. 37

Processor Package Drawing Sheet 2 of 3 .................................................................. 38

Processor Package Drawing Sheet 3 of 3 .................................................................. 39

Processor Top-Side Markings Example for the Dual-Core Intel® Xeon®

Processor 3000 Series with 2MB L2 Cache with 1066 MHz FSB .................................... 41

Processor Top-Side Markings Example for the Dual-Core Intel® Xeon®

Processor 3000 Series with 4 MB L2 Cache with 1066 MHz FSB ................................... 42

Processor Top-Side Markings Example for the Dual-Core Intel® Xeon®

Processor 3000 Series with 4 MB L2 Cache with 1333 MHz FSB ................................... 42

Processor Land Coordinates and Quadrants (Top View)............................................... 43

land-out Diagram (Top View – Left Side) .................................................................. 46

land-out Diagram (Top View – Right Side) ................................................................ 47

Thermal Profile (Dual-Core Intel® Xeon® Processor 3000 Series

with 4 MB L2 Cache).............................................................................................. 77

Thermal Profile (Dual-Core Intel® Xeon® 3070/3060 Processor

with 4 MB L2 Cache).............................................................................................. 78

Thermal Profile (Dual-Core Intel® Xeon® Processor 3000 Series

with 2 MB L2 Cache).............................................................................................. 79

Case Temperature (TC) Measurement Location.......................................................... 80

Thermal Monitor 2 Frequency and Voltage Ordering ................................................... 82

Processor PECI Topology ........................................................................................ 86

Conceptual Fan Control on PECI-Based Platforms....................................................... 86

Conceptual Fan Control on Thermal Diode-Based Platforms ......................................... 87

Processor Low Power State Machine......................................................................... 90

Mechanical Representation of the Boxed Processor..................................................... 95

Space Requirements for the Boxed Processor (Side View) ........................................... 96

Space Requirements for the Boxed Processor (Top View) ............................................ 96

Space Requirements for the Boxed Processor (Overall View) ....................................... 97

Boxed Processor Fan Heatsink Power Cable Connector Description ............................... 98

Baseboard Power Header Placement Relative to Processor Socket ................................ 99

Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 1 View) .............. 100

Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View) .............. 100

Boxed Processor Fan Heatsink Set Points................................................................ 101

Dual-Core Intel® Xeon® Processor 3000 Series Datasheet

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