Agilent HSDL-3000 # 007/017
IrDA
®
Data Compliant 115.2 kbps
Infrared Transceiver
Data Sheet
Description
The HSDL-3000 is a small form
factor infrared (IR) transceiver
module that provides interface
between logic and IR signals for
through-air, serial, half-duplex IR
data link. The module is compliant
to IrDA Physical Layer Specifica-
tions 1.3 and is IEC 825-Class 1
eye safe.
The HSDL-3000 can be shut down
completely to achieve very low
power consumption. In the shut-
down mode, the PIN diode will be
inactive and thus producing very
little photocurrent even under very
bright ambient light. Such features
are ideal for battery-operated
handheld products.
The HSDL-3000 has two front
packaging type options (HSDL-
3000#007/017). Both options have
an integrated shield that helps to
ensure low EMI emission and high
immunity to EMI field, thus
enhancing reliable performance.
HSDL-3000 Ordering Information
Part Number
HSDL-3000#007
HSDL-3000#017
Application Support Information
The Application Engineering
group is available to assist you
with the technical understanding
associated with HSDL-3000
infrared transceiver module. You
can contact them through your
local sales representatives for
additional details.
Applications
• Data communication
– PDAs
– Notebooks
– Printers
• Mobile telecom
– Cellular phones
– Pagers
– Smart phones
• Digital imaging
– Digital cameras
– Photo-imaging printers
• Electronic wallet
• Medical and industry data
collection
Features
• Fully compliant to IrDA 1.3
specifications:
– 2.4 kbps to 115.2 kbps
– Excellent nose-to-nose operation
– Typical link distance > 1.5 m
• Guaranteed temperature
performance, –20 to 70
°C
– Critical parameters are
guaranteed over temperature and
supply voltages
• Low power consumption
– Low shutdown current
(10 nA typical)
– Complete shutdown for
TXD, RXD, and PIN diode
• Small module size
– 2.70 x 9.10 x 3.65 mm (HxWxD)
• Withstands >100 mV
p-p
power supply
ripple typically
• V
CC
supply 2.7 to 5.5 volts
• LED stuck-high protection
• IEC 825-Class 1 eye safe
• Designed to accommodate light loss
with cosmetic windows
Packaging Type
Tape/Reel
Strip
Package
Front View
Front View
Quantity
2500
10
Functional Block Diagram
V
CC
(5)
CX2
Pinout
REAR VIEW
CX1
GND (6)
6
5
4
3
2
1
RXD (3)
HSDL-3xxx
SD (4)
SHIELD
TXD (2)
TRANSMITTER
LEDA (1)
R1
V
CC
I/O Pins Configuration Table
Pin Symbol
1
2
3
4
5
6
–
LED A
TXD
RXD
SD
V
CC
GND
SHIELD
Description
LED Anode
Notes
Tied through external resistor, R1, to regulated V
CC
from 2.7 to 5.5 volts.
Transmitter Data Input. Logic High turns on the LED. If held high longer than ~ 50
µs,
the LED is turned
Active High.
off. TXD must be either driven high or low. Do NOT float the pin.
Receiver Data Output.
Active Low.
Shutdown.
Active High.
Supply Voltage
Ground
EMI Shield
Output is a low pulse response when a light pulse is seen.
Complete shutdown TXD, RXD, and PIN diode.
Regulated, 2.7 to 5.5 volts.
Connect to system ground.
Connect to system ground via a low inductance trace. For best performance,
do not connect to GND directly at the part.
Recommended Application Circuit Components
Component
R1
Recommended Value
2.2
Ω ±
5%, 0.25 Watt, for 2.7
≤
V
CC
≤
3.3 V operation
2.7
Ω ±
5%, 0.25 Watt, for 3.0
≤
V
CC
≤
3.6 V operation
6.8
Ω ±
5%, 0.25 Watt, for 4.5
≤
V
CC
≤
5.5 V operation
0.47
µF ±
20%, X7R Ceramic
6.8
µF ±
20%, Tantalum
Marking Information
The HSDL-3000#007/017 is
marked with a number “0” and
“YWWLL” on the shield where ‘Y’
indicates the unit’s manufacturing
year, ‘WW’ refers to the work week
and ‘LL’ is the lot information.
CX1
[1]
CX2
[2]
Notes:
1. CX1 must be placed within 0.7 cm of HSDL-3000 to obtain optimum noise immunity.
2. In environments with noisy power supplies, supply rejection can be enhanced by including
CX2 as shown in ”HSDL-3000 Functional Block Diagram“on page 2.
Caution:
The BiCMOS inherent to the design of this component increases the component’s susceptibility to damage
from electrostatic discharge (ESD). It is advised that normal static precautions be taken during handling and
assembly of this component to prevent damage and/or degradation, which may be induced by ESD.
2
RECEIVER
Absolute Maximum Ratings
For implementations where case to ambient thermal resistance is
≤
50°C/W.
Parameter
Storage Temperature
Operating Temperature
LED Supply Voltage
Supply Voltage
Output Voltage: RXD
LED Current Pulse Amplitude
Symbol
T
S
T
A
V
LED
V
CC
V
O
ILED
Min.
–40
–20
0
0
–0.5
Max.
100
70
7
7
7
500
Units
°C
°C
V
V
V
mA
≤
90
µs
Pulse Width
≤
20% Duty Cycle
Conditions
Recommended Operating Conditions
Parameter
Operating Temperature
Supply Voltage
Logic Input
Voltage for
TXD
Receiver Input
Irradiance
Logic High
Logic Low
Logic High
Logic Low
TXD Pulse Width (SIR)
Receiver Data Rate
Ambient Light
Symbol
T
A
V
CC
V
IH
V
IL
EI
H
EI
L
t
TPW
(SIR)
1.5
2.4
Min.
–20
2.7
2/3 V
CC
0
0.0036
Max.
70
5.5
V
CC
1/3 V
CC
500
0.3
1.6
115.2
Units
°C
V
V
V
mW/cm
2
µW/cm
2
µs
kbps
For in-band signals
≤
115.2 kbps
[1]
For in-band signals
[1]
t
PW
(TXD) = 1.6
µs
at 115.2 kbps
Conditions
See Test Methods on page 16 for details.
3
Electrical & Optical Specifications
Specifications (Min. and Max. values) hold over the recommended operating conditions unless otherwise noted.
Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25°C with V
CC
set to 3.0 V unless otherwise noted.
Parameter
Receiver
Viewing Angle
Peak Sensitivity
Wavelength
RXD Output Voltage
Logic High
Logic Low
RXD Pulse Width (SIR)
[2]
RXD Rise and Fall Times
Receiver Latency Time
[3]
Receiver Wake Up Time
[4]
Transmitter
Radiant Intensity
Viewing Angle
Peak Wavelength
TXD Logic Levels
High
Low
TXD Input Current
High
Low
LED Current
Shutdown
Wakeup Time
[5]
Maximum Optical
Pulse Width
[6]
TXD Rise and
Fall Time (Optical)
LED Anode on State
Voltage
IE
H
2θ
1/2
λ
p
V
IH
V
IL
I
H
I
L
I
VLED
t
TW
t
PW(Max)
t
r
, t
f
V
ON
(LEDA)
–1
2/3 V
CC
0
0.02
–0.02
20
30
25
44
30
875
V
CC
1/3 V
CC
1
1
1000
100
50
600
2.2
75
60
mW/sr
°
nm
V
V
µA
µA
NA
ns
µs
ns
V
I
LEDA
= 350 mA, V
I
(TXD)
≤
V
IL
V
I
≥
V
IH
0
≤
V
I
≤
V
IL
V
I
(SD)
≥
V
IH
, T
A
= 25°C
I
LEDA
= 350 mA,
θ
1/2
≤
15°,
TXD
≥
V
IH
, T
A
= 25°C
2φ
1/2
λ
p
30
875
°
nm
Symbol
Min.
Typ.
Max.
Units
Conditions
V
OH
V
OL
t
RPW
(SIR)
t
r
, t
f
t
L
t
RW
V
CC
–0.2
0
1
25
25
18
V
CC
0.4
7.5
100
50
100
V
V
µs
ns
µs
µs
I
OH
= –200
µA,
EI
≤
0.3
µW/cm
2
θ
1/2
≤
15°, C
L
= 9 pF
C
L
= 9 pF
EI = 10 mW/cm
2
4
Electrical & Optical Specifications
(Continued)
Parameter
Transceiver
Input Current
High
Low
Supply Current
Shutdown
Idle
Active
I
H
I
L
I
CC1
I
CC2
I
CC3
–1
0.01
-0.02
0.01
290
2
1
1
1
450
8
µA
µA
µA
µA
mA
V
I
≥
V
IH
0
≤
V
I
≤
V
IL
V
SD
≥
V
CC
– 0.5, T
A
= 25°C
V
I
(TXD)
≤
V
IL
, EI = 0
V
I
(TXD)
≥
V
IL
Symbol
Min.
Typ.
Max.
Units
Conditions
Notes:
1. An in-band optical signal is a pulse/sequence where the peak wavelength,
λp,
is defined as 850 nm
≤ λp ≤
900 nm, and the pulse characteristics
are compliant with the IrDA Serial Infrared Physical Layer Link Specification.
2. For in-band signals 2.4 kbps to 115.2 kbps where 3.6
µW/cm
2
≤
EI
≤
500 mW/cm
2
.
3. Latency is defined as the time from the last TXD light output pulse until the receiver has recovered full sensitivity.
4. Receiver wake up time is measured from V
CC
power on to valid RXD output.
5. Transmitter wake up time is measured from V
CC
power on to valid light output in response to a TXD pulse.
6. Maximum optical pulse width is defined as the maximum time that the LED will remain on. This is to prevent the long turn on time for the LED.
500
2.2
Ω
470
2.7
Ω
440
ILED (mA)
ILED (mA)
500
470
440
IE
H
(mW/sr)
110
100
90
80
70
60
50
40
1.80 220 260 300 340 380 420 460 500
ILED (mA)
410
6.8
Ω
380
350
320
290
2.4 2.7 3.0 3.3 3.6 3.9 4.2 4.5 4.8 5.1 5.4 5.7
V
CC
(V)
410
380
350
320
290
1.80 1.85 1.90 1.95 2.00 2.05 2.10 2.15 2.20
V
ON
(LEDA)
ILED vs. V
CC
.
ILED vs. V
ON
(LEDA).
IE
H
vs. ILED.
5
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