Quad-Core Intel® Xeon® Processor
5400 Series
Datasheet
August 2008
318589-005
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Quad-Core Intel® Xeon® Processor 5400 Series Datasheet
Contents
1
Introduction
.............................................................................................................. 9
1.1
Terminology ..................................................................................................... 10
1.2
State of Data .................................................................................................... 13
1.3
References ....................................................................................................... 13
Quad-Core Intel® Xeon® Processor 5400 Series Electrical Specifications................
15
2.1
Front Side Bus and GTLREF ................................................................................ 15
2.2
Power and Ground Lands.................................................................................... 16
2.3
Decoupling Guidelines ........................................................................................ 16
2.3.1 VCC Decoupling...................................................................................... 16
2.3.2 VTT Decoupling ...................................................................................... 16
2.3.3 Front Side Bus AGTL+ Decoupling ............................................................ 16
2.4
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ....................................... 17
2.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0]) .................................. 17
2.4.2 PLL Power Supply ................................................................................... 18
2.5
Voltage Identification (VID) ................................................................................ 18
2.6
Reserved, Unused, and Test Signals..................................................................... 21
2.7
Front Side Bus Signal Groups .............................................................................. 22
2.8
CMOS Asynchronous and Open Drain Asynchronous Signals .................................... 24
2.9
Test Access Port (TAP) Connection....................................................................... 24
2.10 Platform Environmental Control Interface (PECI) DC Specifications........................... 24
2.10.1 DC Characteristics .................................................................................. 24
2.10.2 Input Device Hysteresis .......................................................................... 25
2.11 Mixing Processors.............................................................................................. 26
2.12 Absolute Maximum and Minimum Ratings ............................................................. 26
2.13 Processor DC Specifications ................................................................................ 27
2.13.1 Flexible Motherboard Guidelines (FMB) ...................................................... 27
2.13.2 VCC Overshoot Specification .................................................................... 38
2.13.3 Die Voltage Validation ............................................................................. 39
2.14 AGTL+ FSB Specifications................................................................................... 39
Mechanical Specifications
........................................................................................ 43
3.1
Package Mechanical Drawings ............................................................................. 43
3.2
Processor Component Keepout Zones................................................................... 47
3.3
Package Loading Specifications ........................................................................... 47
3.4
Package Handling Guidelines............................................................................... 48
3.5
Package Insertion Specifications.......................................................................... 48
3.6
Processor Mass Specifications ............................................................................. 48
3.7
Processor Materials............................................................................................ 48
3.8
Processor Markings............................................................................................ 48
3.9
Processor Land Coordinates ................................................................................ 49
Land Listing.............................................................................................................
51
4.1
Quad-Core Intel® Xeon® Processor 5400 Series Pin Assignments ........................... 51
4.1.1 Land Listing by Land Name ...................................................................... 51
4.1.2 Land Listing by Land Number ................................................................... 61
Signal Definitions
.................................................................................................... 71
5.1
Signal Definitions .............................................................................................. 71
Thermal Specifications
............................................................................................ 79
6.1
Package Thermal Specifications ........................................................................... 79
6.1.1 Thermal Specifications ............................................................................ 79
6.1.2 Thermal Metrology ................................................................................. 90
6.2
Processor Thermal Features ................................................................................ 90
2
3
4
5
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Quad-Core Intel® Xeon® Processor 5400 Series Datasheet
3
6.3
6.2.1 Intel
®
Thermal Monitor Features...............................................................90
6.2.2 On-Demand Mode ...................................................................................92
6.2.3 PROCHOT# Signal ..................................................................................93
6.2.4 FORCEPR# Signal ...................................................................................93
6.2.5 THERMTRIP# Signal ................................................................................94
Platform Environment Control Interface (PECI) ......................................................94
6.3.1 Introduction ...........................................................................................94
6.3.2 PECI Specifications .................................................................................96
7
Features
..................................................................................................................97
7.1
Power-On Configuration Options ..........................................................................97
7.2
Clock Control and Low Power States .....................................................................97
7.2.1 Normal State .........................................................................................98
7.2.2 HALT or Extended HALT State...................................................................98
7.2.3 Stop-Grant State .................................................................................. 100
7.2.4 Extended HALT Snoop or HALT Snoop State,
Stop Grant Snoop State......................................................................... 101
7.3
Enhanced Intel SpeedStep® Technology ............................................................. 101
Boxed Processor Specifications..............................................................................
103
8.1
Introduction .................................................................................................... 103
8.2
Mechanical Specifications .................................................................................. 105
8.2.1 Boxed Processor Heat Sink Dimensions (CEK)........................................... 105
8.2.2 Boxed Processor Heat Sink Weight .......................................................... 113
8.2.3 Boxed Processor Retention Mechanism and Heat Sink
Support (CEK)...................................................................................... 113
8.3
Electrical Requirements .................................................................................... 113
8.3.1 Fan Power Supply (Active CEK)............................................................... 113
8.3.2 Boxed Processor Cooling Requirements.................................................... 114
8.4
Boxed Processor Contents................................................................................. 115
Debug Tools Specifications
.................................................................................... 117
9.1
Debug Port System Requirements ...................................................................... 117
9.2
Target System Implementation.......................................................................... 117
9.2.1 System Implementation......................................................................... 117
9.3
Logic Analyzer Interface (LAI) ........................................................................... 117
9.3.1 Mechanical Considerations ..................................................................... 118
9.3.2 Electrical Considerations ........................................................................ 118
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Quad-Core Intel® Xeon® Processor 5400 Series Datasheet
Figures
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8-2
8-3
8-4
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8-6
8-7
8-8
8-9
8-10
8-11
Input Device Hysteresis ..................................................................................... 25
Quad-Core Intel® Xeon® Processor X5482 Load Current versus Time ...................... 30
Quad-Core Intel® Xeon® Processor X5400 Series Load Current versus Time ............ 31
Quad-Core Intel® Xeon® Processor E5400 Series Load Current versus Time............. 31
Quad-Core Intel® Xeon® Processor L5400 Series Load Current versus Time ............. 32
VCC Static and Transient Tolerance Load Lines ...................................................... 34
Quad-Core Intel® Xeon® Processor X5482 VCC Static and
Transient Tolerance Load Lines ........................................................................... 35
Quad-Core Intel® Xeon® Processor X5400 Series VCC Static and
Transient Tolerance Load Lines ........................................................................... 36
Quad-Core Intel® Xeon® Processor E5400 Series VCC Static and
Transient Tolerance Load Lines ........................................................................... 36
Quad-Core Intel® Xeon® Processor L5400 Series VCC Static and Transient
Tolerance Load Lines ......................................................................................... 37
VCC Overshoot Example Waveform...................................................................... 39
Electrical Test Circuit ......................................................................................... 41
Differential Clock Waveform................................................................................ 41
Differential Clock Crosspoint Specification............................................................. 42
Differential Rising and Falling Edge Rates ............................................................. 42
Processor Package Assembly Sketch .................................................................... 43
Quad-Core Intel® Xeon® Processor 5400 Series Package Drawing (Sheet 1 of 3) ...... 44
Quad-Core Intel® Xeon® Processor 5400 Series Package Drawing (Sheet 2 of 3) ...... 45
Quad-Core Intel® Xeon® Processor 5400 Series Package Drawing (Sheet 3 of 3) ...... 46
Processor Top-side Markings (Example)................................................................ 49
Processor Land Coordinates, Top View.................................................................. 49
Processor Land Coordinates, Bottom View............................................................. 50
Quad-Core Intel® Xeon® Processor X5492 and X5482 (C-step)Thermal Profile ......... 81
Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profiles A and B .............. 83
Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile ........................... 86
Quad-Core Intel® Xeon® Processor L5400 Series Thermal Profile............................ 87
Quad-Core Intel® Xeon® Processor L5408 Thermal Profile ..................................... 89
Case Temperature (TCASE) Measurement Location ................................................ 90
Intel® Thermal Monitor 2 Frequency and Voltage Ordering ..................................... 92
Quad-Core Intel® Xeon® Processor 5400 Series PECI Topology .............................. 94
Conceptual Fan Control Diagram of PECI-based Platforms ....................................... 95
Stop Clock State Machine ................................................................................. 100
Boxed Quad-Core Intel® Xeon® Processor 5400 Series
1U Passive/3U+ Active Combination Heat Sink (With Removable Fan) .................... 104
Boxed Quad-Core Intel® Xeon® Processor 5400 Series 2U Passive Heat Sink ......... 104
2U Passive Quad-Core Intel® Xeon® Processor 5400 Series
Thermal Solution (Exploded View) ..................................................................... 105
Top Side Board Keepout Zones (Part 1) .............................................................. 106
Top Side Board Keepout Zones (Part 2) .............................................................. 107
Bottom Side Board Keepout Zones..................................................................... 108
Board Mounting-Hole Keepout Zones ................................................................. 109
Volumetric Height Keep-Ins .............................................................................. 110
4-Pin Fan Cable Connector (For Active CEK Heat Sink) ......................................... 111
4-Pin Base Board Fan Header (For Active CEK Heat Sink)...................................... 112
Fan Cable Connector Pin Out for 4-Pin Active CEK Thermal Solution ....................... 114
Quad-Core Intel® Xeon® Processor 5400 Series Datasheet
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