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KSZ9692MPBI

Description
SPECIALTY MICROPROCESSOR CIRCUIT, PBGA400
CategoryMicrocontrollers and processors   
File Size924KB,44 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
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KSZ9692MPBI Overview

SPECIALTY MICROPROCESSOR CIRCUIT, PBGA400

KSZ9692MPBI Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicrochip
package instructionLEAD FREE, PLASTIC, BGA-400
Reach Compliance Codecompliant
Is SamacsysN
Other featuresALSO REQUIRES 3.3V I/O SUPPLY
JESD-30 codeS-PBGA-B400
JESD-609 codee1
length27 mm
Humidity sensitivity level3
Number of terminals400
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)250
Certification statusNot Qualified
Maximum seat height2.46 mm
Maximum supply voltage1.365 V
Minimum supply voltage1.235 V
Nominal supply voltage1.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
width27 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR CIRCUIT
Base Number Matches1
KSZ9692MPB/KSZ9692XPB
Integrated Gigabit Networking and
Communications Controller
Rev. 4.0
General Description
The KSZ9692MPB/KSZ9692XPB is a highly-integrated
System-on-Chip (SoC) containing an ARM 922T 32-bit
processor and a rich set of peripherals to address the cost-
sensitive, high-performance needs of a wide variety of
high-bandwidth
networking
and
communications
applications.
SDIO/SD Host Controller (for KSZ9692MPB only)
Meets SD Host Controller Standard Specification
Version 1.0
Meets SDIO card specification Version 1.0
DMA Controllers
Dedicated DMA channels for PCI, USB, SDIO and
Ethernet ports.
Peripherals
Four high-speed UART ports up to 5 Mbps
Two programmable 32-bit timers with watchdog timer
capability
Interrupt Controller
Twenty GPIO ports
One shared SPI/I2C interface
One I2S port
Debugging
ARM9 JTAG debug interface
JTAG Boundary Scan Support
Power Management
CPU and system clock speed step-down options
Ethernet port Wake-on-LAN
DDR and PCI power down
Operating Voltage
1.3V power for core
3.3V power for I/O
2.5V or 2.6V power for DDR memory interface
Reference Hardware and Software Evaluation Kit
Hardware Evaluation Kit
Software Evaluation Kit includes WinCE BSP, Open
WRT BSP, Linux based SOHO Router packages
Features
ARM 922T High-Performance Processor Core
250 MHz ARM 922T RISC processor core
8KB I-cache and 8KB D-cache
Configurable Memory Management Unit (MMU) for
Linux and WinCE
Memory Controller
8/16-bit external bus interface for FLASH, ROM, SRAM,
and external I/O
NAND FLASH controller with boot option
200MHz 32-bit DDR controller
Two JEDEC Specification JESD82-1-compliant
differential clock drivers for a glueless DDR interface
solution
Ethernet Interfaces
Two Gb (10/100/1000 Mbps) MACs
MII or RGMII interface
Fully compliant with IEEE 802.3 Ethernet standards
PCI Interface
Version PCI 2.3
32-bit 33/66 MHz
Integrated PCI Arbiter supports three external masters
for KSZ9692MPB and one external master for
KSZ9692XPB
Configurable as Host bridge or Guest device
Glueless Support for mini-PCI or CardBus devices
Dual High-Speed USB 2.0 Interfaces
Two USB2.0 ports with integrated PHY
Can be configured as 2-port host, or host + device
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (
408
) 944-0800 • fax + 1 (408) 474-1000 •
http://www.micrel.com
March 2010
M9999-031810-4.0

KSZ9692MPBI Related Products

KSZ9692MPBI KSZ9692MPB
Description SPECIALTY MICROPROCESSOR CIRCUIT, PBGA400 SPECIALTY MICROPROCESSOR CIRCUIT, PBGA400
Is it Rohs certified? conform to conform to
Maker Microchip Microchip
package instruction LEAD FREE, PLASTIC, BGA-400 LEAD FREE, PLASTIC, BGA-400
Reach Compliance Code compliant compliant
Other features ALSO REQUIRES 3.3V I/O SUPPLY ALSO REQUIRES 3.3V I/O SUPPLY
JESD-30 code S-PBGA-B400 S-PBGA-B400
JESD-609 code e1 e1
length 27 mm 27 mm
Humidity sensitivity level 3 3
Number of terminals 400 400
Maximum operating temperature 85 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA
Package shape SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 250 250
Certification status Not Qualified Not Qualified
Maximum seat height 2.46 mm 2.46 mm
Maximum supply voltage 1.365 V 1.365 V
Minimum supply voltage 1.235 V 1.235 V
Nominal supply voltage 1.3 V 1.3 V
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL
Terminal surface TIN SILVER COPPER TIN SILVER COPPER
Terminal form BALL BALL
Terminal pitch 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature 40 40
width 27 mm 27 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT
Base Number Matches 1 1

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