Revision of November 2018
TF-FUSE
®
Thin Film Surface Mount Fuses
HI Series (High Inrush), 0603 Size
Features:
•
•
•
•
•
Applications:
•
•
•
•
•
•
Consumer Electronics
Notebook Computers and Tablets
Telecom Devices
Mobile Phone
Battery Pack
Digital Camera
Low DCR
High inrush current withstanding capability
Fiberglass enforced epoxy fuse body
Copper termination with nickel and tin plating
Halogen free, RoHS compliance and lead-free
Shape and Dimensions:
Unit
Length (L)
Width (W)
Thickness (T)
Termination bandwidth (b)
Inch
0.063 ± 0.004
0.032 ± 0.004
0.014 ± 0.004
0.014 ± 0.004
mm
1.60 ± 0.10
0.81 ± 0.10
0.36 ± 0.10
0.36 ± 0.10
Clearing Time Characteristics:
% of Current
Rating
100%
200%
1000%
Opening Time at 25
o
C
4 hours min.
1 second min.
0.0002 second min.
60 seconds max.
0.02 second max.
Agency Approval:
Recognized Under the Components Program of UL.
File Number: E232989.
Typical Ratings and Characteristics:
Operating temperature:
-55
to +90°C
Part Number
T0603HI0500TM
T0603HI0750TM
T0603HI1000TM
T0603HI1500TM
T0603HI2000TM
T0603HI2500TM
T0603HI3000TM
T0603HI3500TM
T0603HI4000TM
1
2
Current
Rating (A)
0.50
0.75
1.00
1.50
2.00
2.50
3.00
3.50
4.00
Voltage
Rating (VDC)
65
65
65
65
35
35
35
35
35
Interrupting Rating
Nominal Cold
DCR
(Ω)
1
0.1550
Nominal I
2
t
(A
2
s)
2
0.019
0.036
0.052
0.110
0.310
0.400
0.600
0.800
1.200
Marking
C
D
E
T
F
J
L
N
P
50A@35V DC/AC
13A@65V DC
0.0830
0.0500
0.0290
0.0200
0.0165
35A@35V DC/AC
50A@24V DC/AC
0.0140
0.0120
0.0095
Measured at
≤
10% of rated current and 25˚C ambient .
Melting I
2
t at 0.001 sec.
Website:
www.aemchina.com & www.aemcomponents.com
Revision of November 2018
TF-FUSE
®
Thin Film Surface Mount Fuses
HI Series (High Inrush), 0603 Size
Average Pre-arcing Time Curves:
1.50 A
0.50 A
0.75 A
1.00 A
2.00 A
2.50 A
3.00 A
3.50 A
4.00 A
10
100
10
1
Pre-arcing Time (Sec)
0.1
0.01
0.001
0.0001
0.1
1
Current (A)
100
Website:
www.aemchina.com & www.aemcomponents.com
Revision of November 2018
TF-FUSE
®
Thin Film Surface Mount Fuses
HI Series (High Inrush), 0603 Size
Average I
2
t vs. t Curves:
1000
4.00 A
3.50 A
3.00 A
2.50 A
2.00 A
1.50 A
1.00 A
0.75 A
0.50 A
100
10
1
I
2
t (A
2
S)
0.1
0.01
0.001
0.0001
0.0001
0.001
0.01
0.1
1
10
100
Time (Sec)
Website:
www.aemchina.com & www.aemcomponents.com
Revision of November 2018
TF-FUSE
®
Thin Film Surface Mount Fuses
Product Identification:
T 0603 FF 1000 T M
(1) (2)
(3)
(4) (5) (6)
(1) Product Code:
T-Thin Film
(2) Size Code:
Standard EIA chip sizes
(3) Series Code:
FF—Very Fast Acting, HI—High Inrush
(4) Current Rating Code:
0500—0.5A, 1000—1.0A
(5) Package Code:
T—Tape & Reel; B—Bulk
Environmental Tests:
No.
1
Test item
Bending
Requirement
≤1A:
10% DCR change max.
>1A: 20% DCR change max.
95% coverage min.
DCR change within ±10%
No mechanical damage
DCR change within ±10%
No excessive corrosion
DCR change within
≤
±10%
No excessive corrosion
DCR change within
≤
±10%
No mechanical damage
DCR change within
≤
±10%
No mechanical damage
Change of voltage drop
within ±10%, no open circuit
2mm
Test condition
Reference
Refer to AEM QIQ034
MIL-STD-202
Method 208
MIL-STD-202
Method 107
MIL-STD-202
Method 106
MIL-STD-202
Method 101
MIL-STD-202
Method 204
MIL-STD-202
Method 213
Refer to AEM QIQ106
2
3
4
5
6
7
Solderability
Thermal shock
Moisture
resistance
Salt spray
Mechanical
vibration
Mechanical shock
One dip at 255℃ for 5 seconds
100 cycles between
-55°C
and +125°C
10 cycles
5% salt solution, 48 hour exposure
0.4” D.A. or 30G between 5 and 3000 Hz
1500G, 0.5 ms, half sine shocks
75% rated current, 2000 hours, ambient
temperature +20°C to 30°C
8
Life
Packaging:
Chip Size
0603(1608)
0402(1005)
Parts on 7 inch (178mm) Reel
8,000
20,000
Website:
www.aemchina.com & www.aemcomponents.com
Revision of November 2018
TF-FUSE
®
Thin Film Surface Mount Fuses
Temperature Effect on Current Rating:
Recommended Reflow Soldering Profile:
Profile Feature
Preheat/Soak
Temperature Min (T
smin
)
Temperature Max(T
smax
)
Time(t
s
) from (T
smin
to T
smax
)
Ramp-uprate (T
L
to T
p
)
Liquidous temperature(T
L
)
Time(t
L
) maintained above T
L
Peak package body temperature (T
p
)
Time (t
p
)*within 5°C of the specified
classification temperature (T
c
)
Ramp-down rate (T
p
to T
L
)
Time 25°C to peak temperature
Pb-Free
Assembly
150°C
200°C
60~120 seconds
3°C/second
max.
217°C
60~150 seconds
260°C
30 seconds *
6°C/second
max.
8 minutes max.
* Tolerance for peak profile temperature (T
p
) is defined as
a supplier minimum and a user maximum
Thermal Shock When Making Correction with a Soldering Iron:
The temperature of solder iron tip should be controlled under 350°C and soldering time should be less than 3 sec.
The soldering iron tip should not directly touch the top side termination of the component.
Fig 3 Correct handling method of soldering iron
Website:
www.aemchina.com & www.aemcomponents.com
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