2017/6/19
SPEF Series - Basic information
1.5mm-travel Vertical Type SPEF Series
Part number
Changeover timing
Travel
Total travel
Operating force
Mounting method
Poles-Positions
Operation
Terminal type
Operating temperature range
Rating (max.)/(min.) (Resistive load)
Electrical
performance
Contact resistance (Initial
performance/After lifetime)
Insulation resistance
Voltage proof
Mechanical
performance
Actuator strength
Operating direction
Pulling direction
Durability
Operating life with load (at max. rated
load)
Cold
Dry heat
Damp heat
SPEF210101
Non shorting
1.5mm
2.7mm
3N
PC board
1-pole, 2-position
Latching
Reflow
-40℃ to +85℃
1A 14.5V DC/50μA 3V DC
100mΩ max./100mΩ max.
3MΩ min. 100V DC
100V AC for 1 minute
90N
30N
30,000 cycles
100mΩ max.
-40℃ 96h
85℃ 96h
40℃, 90 to 95%RH 96h
Environmental
performance
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2017/6/19
SPEF Series - Basic information
Minimum order unit (pcs.)
Japan
Export
660
1,320
Dimensions
Land Dimensions
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SPEF Series - Basic information
Circuit Diagram
Viewed from direction A in the dimensions.
Packing Specifications
Taping
Number of packages 1 reel
(pcs.)
1 case / Japan
1 case / export
packing
Tape width (mm)
Export package measurements (mm)
165
660
1,320
32
403×403×360
Soldering Conditions
Example of Reflow Soldering Condition
1. Heating method
Double heating method with infrared heater.
2. Temperature measurement
Thermocouple 0.1 to 0.2 Φ CA (K) or CC (T) at soldering portion (copper foil surface). A heat resisting tape
should be used for fixed measurement.
3. Temperature profile
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2017/6/19
SPEF Series - Basic information
A(℃)
3s max.
260
B(℃)
C(s)
D(℃)
E(℃)
F(s)
230
40
180
150
120
(1) The condition mentioned above is the temperature on the mounting surface of a PC board. There are
cases where the PC board's temperature greatly differs from that of the switch, depending on the PC
board's material, size, thickness, etc. The above-stated conditions shall also apply to switch surface
temperatures.
(2) Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering
condition is highly recommended.
Reference for Hand Soldering
Soldering temperature
Soldering time
350±10℃
3s max.
Notes are common to this series/models.
1. This site catalog shows only outline specifications. When using the products, please obtain formal
specifications for supply.
2. Please place purchase orders per minimum order unit (integer).
3. This products can be used in vehicles.
Although these products are designed to perform over a wide operating temperature range, please
ensure that you receive and read the formal delivery specifications before use.
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