Section I. Cyclone FPGA
Family Data Sheet
This section provides designers with the data sheet specifications for
Cyclone
®
devices. The chapters contain feature definitions of the internal
architecture, configuration and JTAG boundary-scan testing information,
DC operating conditions, AC timing parameters, a reference to power
consumption, and ordering information for Cyclone devices.
This section contains the following chapters:
■
■
■
■
■
Chapter 1. Introduction
Chapter 2. Cyclone Architecture
Chapter 3. Configuration and Testing
Chapter 4. DC and Switching Characteristics
Chapter 5. Reference and Ordering Information
Revision History
Refer to each chapter for its own specific revision history. For information
on when each chapter was updated, refer to the Chapter Revision Dates
section, which appears in the complete handbook.
Altera Corporation
Section I–1
Preliminary
Revision History
Cyclone Device Handbook, Volume 1
Section I–2
Preliminary
Altera Corporation
1. Introduction
C51001-1.5
Introduction
The Cyclone
®
field programmable gate array family is based on a 1.5-V,
0.13-μm, all-layer copper SRAM process, with densities up to
20,060 logic elements (LEs) and up to 288 Kbits of RAM. With features like
phase-locked loops (PLLs) for clocking and a dedicated double data rate
(DDR) interface to meet DDR SDRAM and fast cycle RAM (FCRAM)
memory requirements, Cyclone devices are a cost-effective solution for
data-path applications. Cyclone devices support various I/O standards,
including LVDS at data rates up to 640 megabits per second (Mbps), and
66- and 33-MHz, 64- and 32-bit peripheral component interconnect (PCI),
for interfacing with and supporting ASSP and ASIC devices. Altera also
offers new low-cost serial configuration devices to configure Cyclone
devices.
The Cyclone device family offers the following features:
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■
■
■
■
■
■
■
■
■
■
■
Features
2,910 to 20,060 LEs, see
Table 1–1
Up to 294,912 RAM bits (36,864 bytes)
Supports configuration through low-cost serial configuration device
Support for LVTTL, LVCMOS, SSTL-2, and SSTL-3 I/O standards
Support for 66- and 33-MHz, 64- and 32-bit PCI standard
High-speed (640 Mbps) LVDS I/O support
Low-speed (311 Mbps) LVDS I/O support
311-Mbps RSDS I/O support
Up to two PLLs per device provide clock multiplication and phase
shifting
Up to eight global clock lines with six clock resources available per
logic array block (LAB) row
Support for external memory, including DDR SDRAM (133 MHz),
FCRAM, and single data rate (SDR) SDRAM
Support for multiple intellectual property (IP) cores, including
Altera
®
MegaCore
®
functions and Altera Megafunctions Partners
Program (AMPP
SM
) megafunctions.
Table 1–1. Cyclone Device Features (Part 1 of 2)
Feature
LEs
M4K RAM blocks (128
×
36 bits)
EP1C3
2,910
13
EP1C4
4,000
17
EP1C6
5,980
20
EP1C12
12,060
52
EP1C20
20,060
64
Altera Corporation
May 2008
1–1
Preliminary
Cyclone Device Handbook, Volume 1
Table 1–1. Cyclone Device Features (Part 2 of 2)
Feature
Total RAM bits
PLLs
Maximum user I/O pins
(1)
Note to
Table 1–1:
(1)
This parameter includes global clock pins.
EP1C3
59,904
1
104
EP1C4
78,336
2
301
EP1C6
92,160
2
185
EP1C12
239,616
2
249
EP1C20
294,912
2
301
Cyclone devices are available in quad flat pack (QFP) and space-saving
FineLine
®
BGA packages (see
Tables 1–2
through
1–3).
Table 1–2. Cyclone Package Options and I/O Pin Counts
Device
EP1C3
EP1C4
EP1C6
EP1C12
EP1C20
Notes to
Table 1–2:
(1)
(2)
TQFP: thin quad flat pack.
PQFP: plastic quad flat pack.
Cyclone devices support vertical migration within the same package (i.e., designers can migrate between the
EP1C3 device in the 144-pin TQFP package and the EP1C6 device in the same package).
100-Pin TQFP 144-Pin TQFP 240-Pin PQFP
256-Pin
324-Pin
400-Pin
(1)
(1), (2)
(1)
FineLine BGA FineLine BGA FineLine BGA
65
—
—
—
—
104
—
98
—
—
—
—
185
173
—
—
—
185
185
—
—
249
—
249
233
—
301
—
—
301
Vertical migration means you can migrate a design from one device to
another that has the same dedicated pins, JTAG pins, and power pins, and
are subsets or supersets for a given package across device densities. The
largest density in any package has the highest number of power pins; you
must use the layout for the largest planned density in a package to
provide the necessary power pins for migration.
For I/O pin migration across densities, cross-reference the available I/O
pins using the device pin-outs for all planned densities of a given package
type to identify which I/O pins can be migrated. The Quartus
®
II
software can automatically cross-reference and place all pins for you
when given a device migration list. If one device has power or ground
pins, but these same pins are user I/O on a different device that is in the
migration path,the Quartus II software ensures the pins are not used as
user I/O in the Quartus II software. Ensure that these pins are connected
1–2
Preliminary
Altera Corporation
May 2008
Document Revision History
to the appropriate plane on the board. The Quartus II software reserves
I/O pins as power pins as necessary for layout with the larger densities
in the same package having more power pins.
Table 1–3. Cyclone QFP and FineLine BGA Package Sizes
Dimension
Pitch (mm)
Area (mm
2
)
Length
×
width
(mm
×
mm)
100-Pin
TQFP
0.5
256
16×16
144-Pin
TQFP
0.5
484
22×22
240-Pin
PQFP
0.5
1,024
34.6×34.6
256-Pin
FineLine
BGA
1.0
289
17×17
324-Pin
FineLine
BGA
1.0
361
19×19
400-Pin
FineLine
BGA
1.0
441
21×21
Document
Revision History
Table 1–4
shows the revision history for this document.
Table 1–4. Document Revision History
Date and
Document
Version
May 2008
v1.5
January 2007
v1.4
August 2005
v1.3
October 2003
v1.2
September
2003 v1.1
May 2003 v1.0
Changes Made
Minor textual and style changes.
Added document revision history.
Minor updates.
Added 64-bit PCI support information.
●
●
Summary of Changes
—
—
—
—
—
—
Updated LVDS data rates to 640 Mbps from 311 Mbps.
Updated RSDS feature information.
Added document to Cyclone Device Handbook.
Altera Corporation
May 2008
1–3
Preliminary
PCB Design
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