SmartBond
™
DA14585
Smallest, lowest power and most integrated
Bluetooth 5 SoC
Connected devices are constantly evolving. New generations appear that are smarter, more full
featured and have longer battery lifetimes. To enable this,
SmartBond
has evolved too. The
DA14585 offers designers all the benefits of the industry-leading DA14580 but with even greater
flexibility to create more advanced applications from the smallest footprints and power budgets.
As part of the Dialog SmartBond family, the DA14585 is the smallest, lowest power and most
integrated Bluetooth
®
solution available. This versatile SoC is ideal for adding Bluetooth low
energy to products like remote controls, proximity tags, beacons, connected medical devices and
smart home nodes. It supports all Bluetooth developments up to and including Bluetooth 5 and
Bluetooth low energy Mesh. Plus, with 96 kB of RAM, the DA14585 has double the memory for user
applications of its predecessor to take full advantage of the standard’s features. It also includes an
integrated microphone interface for voice support at low additional cost. The wide supply voltage
range (0.9 –3.6 V) covering a larger choice of energy sources and gives full design flexibility.
Like all SmartBond solutions, the DA14585 is easy to design-in and supports standalone as well
as hosted applications. It is supported by a complete development environment and Dialog’s
SmartSnippets
™
software that helps you optimize your software for power consumption.
DA14585
XTAL16M
Applications
■
■
■
■
■
■
■
■
■
Remote controls
Proximity tags and trackers
Beacons
Connected medical devices
Smart home
Human Interface Devices
VR controllers
Connected sensors
Wireless charging
ARM M0
™
CPU
SWD
UARTx2
SPI
12C
ADC
KEYBOARD
WAKEUP
4-CH DMA
QDEC
TIMERS
SRC
PCM/12S
PDM
RAM 16 kB
RAM 32 kB
RC32KHz
OTP 64 kB
RC16MHz
RCX
BLE 5.0 MAC Ready
RAM 32 kB
RAM 16 kB
Digital PHY
LDOs
DCDC BUCK
ROM
128 kB
GPIO matrix
DCDC BOOST
www.dialog-semiconductor.com/bluetoothlowenergy
RADIO
XTAL32K
SoC Features
•
•
•
•
Complies with Bluetooth 5.0, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47
Part 15 (US) and ARIB STD-T66 (Japan)
Supports up to 8 Bluetooth LE connections
Fast cold boot in less than 50 ms
Processing units
-
-
-
•
16 MHz 32 bit ARM Cortex-M0 with SWD interface
Dedicated Link Layer Processor
AES-128 bit encryption Processor
Memories
- 64 kB One-Time-Programmable (OTP) memory
- 96 kB Data/Retention SRAM
- 128 kB ROM Operating System and protocol stack
Power management
- Integrated Buck/Boost DCDC converter
- P0, P1, P2 and P3 ports with 3.3 V tolerance
- Easy decoupling of only 4 supply pins
- Supports coin (typ. 3.0 V) and alkaline (typ. 1.5 V) battery cells
- 1.8 V cold boot support-buck mode
- 0.9 V cold boot support-boost mode
- 10-bit ADC for battery voltage measurement
Digital controlled oscillators
- 16 MHz crystal (±20 ppm max) and RC oscillator
- 32 kHz crystal (±50 ppm)
- RCX oscillator(±500 ppm max)
Flexible Reset Circuitry
- System & Power On Reset in a single pin
General purpose, Capture and Sleep timers
- Digital interfaces
- Gen. purpose I/Os: 14 (WL-CSP34), 25 (QFN40), 32 (QFN48)
- 2 UARTs with hardware flow control up to 1 MBd
- SPI+™ interface
- I²C bus at 100 kHz, 400 kHz
- 3-axes capable Quadrature Decoder
Analog interfaces
- 4-channel 10-bit ADC
•
•
•
•
•
www.dialog-semiconductor.com/bluetoothlowenergy
•
Radio transceiver
-
-
-
-
-
-
Fully integrated 2.4 GHz CMOS transceiver
Single wire antenna: no RF matching or RX/TX switching required
Current consumption with supply voltage equal 3 V:
▪ TX: 3.4 mA, RX: 3.7 mA (with ideal DC-DC)
+0 dBm transmit output power
-20 dBm output power in ‘Near Field Mode’
-93 dBm receiver sensitivity
•
Packages
-
-
QFN 40 pins, 5 mm x 5 mm x 0.9 mm
WLCSP 34 pins, 2.40 mm x 2.66 mm x 0.39 mm
Bluetooth 5.0
Supporting the Bluetooth 5.0 core specification, DA14585 enables new enhanced Bluetooth low
energy functionality ideal for applications such as remote controls, beacons, connected sensors
and innovative medical devices. Among the new features, DA14585 supports Data Packet Length
Extension, Link Layer Privacy v1.2, Secure Connections, Bluetooth low energy Mesh and Efficient
connectable Advertising.
Audio Unit
The integrated Audio Unit (AU) is equipped with a Pulse-Density Modulation (PDM) interface that
can be connected to up to 2 input devices (e.g. MEMS microphones) or output devices, a Pulse-
Code modulation (PCM) controller which provides an up to 192 kHz synchronous interface to
external audio devices, ISDN circuits and serial data interfaces (I2S) and a 24-bit Sample Rate
Converting unit (SRC) used to convert the sampling rate of audio samples between the various
interfaces. PDM and PCM functionality can be mapped to any GPIO through the user programmable
pin logic. An integrated DMA controller handles all data transfers between the AU and the RAM
providing the CPU with the freedom to cope with other tasks.
Enhanced Memory
The DA14585 has a large memory capacity for user applications: 96 kB of Data RAM with retention
capability, 128 kB of ROM and 64 kB of One-Time-Programmable (OTP) memory. The granularity of
the RAM cells (32 kB/16 kB/16 kB/32 kB) allows retaining only the RAM needed and achieves the
minimum power consumption during sleep time.
www.dialog-semiconductor.com/bluetoothlowenergy
Wide Input Voltage
The DA14585 can be configured in buck or boost mode to support a multitude of power sources
from zinc-air batteries to alkaline or coin cells. Furthermore, in order to maximize the available
power from zinc air or coin cell and build products with long battery lifetimes, the DA14585 is able to
cold boot at 0.9 or 1.8 V respectively exploiting the full capacity of the connected battery.
Compatibility
As part of the SmartBond family and successor of the DA1458x product family, DA14585 is fully
pin-compatible with DA14580, DA14581 and DA14583 existing designs may be quickly upgraded.
DA14585 is suitable for fully hosted applications without an external MCU.
Software and Tools
The DA14585 is also supported by Dialog SmartSnippets Studio, a royalty-free software
development platform for all SmartBond devices, which contains:
■
SmartSnippets Toolbox: A tool suite covering all software developer needs, including power
profiling, FLASH or OTP programming and testing
■
SmartSnippets DA1458x Software Development Kit and documentation
Ordering Information
Part number
DA14585-00000AT2
DA14585-00000VV2
Package
QFN40
WL-CSP34
Pitch(mm)
0.4
0.4
Size (mm)
5 x 5 x 0.9
2.40 x 2.66 x 0.39
Shipment
Reel
Reel
Pack Quantity
100/1000/5000
100/1000/7500
Dialog Semiconductor Worldwide Sales Offices
-
www.dialog-semiconductor.com
United Kingdom
Phone: +44 1793 757700
Germany
Phone: +49 7021 805-0
The Netherlands
Phone: +31 73 640 88 22
North America
Phone: +1 408 845 8500
Japan
Phone: +81 3 5425 4567
Taiwan
Phone: +886 281 786 222
email: info@diasemi.com
Korea
Phone: +82 2 3469 8200
China
(Shenzhen)
Phone: +86 755 2981 3669
China (Shanghai)
Phone: +86 21 5424 9058
Singapore
Phone: +65 648 499 29
Hong Kong
Phone: +852 3769 5200
This publication is issued to provide outline information only, which unless agreed by Dialog Semiconductor may not be used,
applied, or reproduced for any purpose or be regarded as a representation relating to products. All use of Dialog Semiconductor
products, software and applications referred to in this document are subject to Dialog Semiconductor’s
Standard Terms and
Conditions of Sale,
available on the company website (www.dialog-semiconductor.com) unless otherwise stated.
Dialog and the Dialog logo are trademarks of Dialog Semiconductor plc or its subsidiaries. All other product or service names
are the property of their respective owners.
© Copyright 2016 Dialog Semiconductor. All rights reserved. 1216CREA
Suggestions & Announcements
京公网安备 11010802033920号
EEWORLD
