MR0A08BCYS35 datasheet, PDF - EEWORLD Datasheet

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MR0A08BCYS35: DescriptionMemory interface type: Parallel Memory capacity: 1Mb (128K x 8) Operating voltage: 3V ~ 3.6V Memory type: Non-Volatile; Categorystorage SRAM memory; File Size1MB，23 Pages; ManufacturerEverspin

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MR0A08BCYS35 Overview

Memory interface type: Parallel Memory capacity: 1Mb (128K x 8) Operating voltage: 3V ~ 3.6V Memory type: Non-Volatile

MR0A08BCYS35 Parametric

Parameter Name	Attribute value
Memory architecture (format)	RAM
Memory interface type	Parallel
memory capacity	1Mb (128K x 8)
Operating Voltage	3V ~ 3.6V
memory type	Non-Volatile

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MR0A08B

FEATURES

•

3.3 Volt power supply

Fast 35 ns read/write cycle

SRAM compatible timing

Native non-volatility

Unlimited read & write endurance

Data always non-volatile for >20 years at temperature

Commercial and industrial temperatures

All products meet MSL-3 moisture sensitivity level

RoHS-Compliant TSOP2 and BGA packages

128K x 8 MRAM

48-ball FBGA

BENEFITS

• One memory replaces FLASH, SRAM, EEPROM and

MRAM in system for simpler, more efficient design

• Improves reliability by replacing battery-backed

SRAM

INTRODUCTION

44-pin TSOP2

The

MR0A08B

is a 1,048,576-bit magnetoresistive random access

memory (MRAM) device organized as 131,072 words of 8 bits. The

MR0A08B offers SRAM compatible 35 ns read/write timing with unlim-

ited endurance.

Data is always non-volatile for greater than 20-years. Data is automatically protected on

power loss by low-voltage inhibit circuitry to prevent writes with voltage out of specification.

The MR0A08B is the ideal memory solution for applications that must permanently store and

retrieve critical data and programs quickly.

The

MR0A08B

is available in small footprint 400-mil, 44-lead plastic small-outline TSOP

type-2 package, 8 mm x 8 mm, or a 48-pin ball grid array (BGA) package with 0.75 mm ball

centers. (The 32-SOIC package options is obsolete and no longer available for new orders.)

These packages are compatible with similar low-power SRAM products and other non-vola-

tile RAM products.

The

MR0A08B

provides highly reliable data storage over a wide range of temperatures. The

product is offered with commercial temperature range (0 to +70 °C) and industrial tempera-

ture range (-40 to +85 °C).

RoHS

MR0A08B Rev. 8.6, 3/2018

MR0A08B

TABLE OF CONTENTS

FEATURES .............................................................................................................................................1

BENEFITS...............................................................................................................................................1

INTRODUCTION ...................................................................................................................................1

BLOCK DIAGRAM AND PIN ASSIGNMENTS .......................................................................................4

Figure 1 – MR0A08B Block Diagram ...................................................................................................................... 4

Table 1 – Pin Functions ............................................................................................................................................... 4

Figure 2 – Pin Diagrams for Available Packages (Top View) 1 ...................................................................... 5

OPERATING MODES .............................................................................................................................5

Table 2 – Operating Modes ....................................................................................................................................... 5

ELECTRICAL SPECIFICATIONS ............................................................................................................6

Table 3 – Absolute Maximum Ratings................................................................................................................... 6

OPERATING CONDITIONS ...................................................................................................................7

Table 4 – Operating Conditions............................................................................................................................... 7

Power Up and Power Down Sequencing .......................................................................................8

Figure 3 – Power Up and Power Down Diagram ............................................................................................... 8

DC CHARACTERISTICS .........................................................................................................................9

Table 5 – DC Characteristics...................................................................................................................................... 9

Table 6 – Power Supply Characteristics ................................................................................................................ 9

TIMING SPECIFICATIONS ................................................................................................................. 10

Table 7 – Capacitance ...............................................................................................................................................10

Table 8 – AC Measurement Conditions ..............................................................................................................10

Figure 4 – Output Load Test Low and High .......................................................................................................10

Figure 5 – Output Load Test All Others ...............................................................................................................10

MR0A08B Rev. 8.6, 3/2018

MR0A08B

TABLE OF CONTENTS (CONT’D)

Read Mode .................................................................................................................................... 11

Table 9 – Read Cycle Timing ...................................................................................................................................11

Figure 6 – Read Cycle 1 .............................................................................................................................................12

Figure 7 – Read Cycle 2 .............................................................................................................................................12

Write Mode.................................................................................................................................... 13

Table 10 – Write Cycle Timing 1 (

Controlled ).............................................................................................13

Figure 8 – Write Cycle Timing 1 (W Controlled) ...............................................................................................14

Table 11 – Write Cycle Timing 2 (

Controlled) ................................................................................................15

Figure 9 – Write Cycle Timing 2 (

Controlled) ................................................................................................16

Table 12 – Write Cycle Timing 3 (Shortened t

WHAX

and

Controlled) .............................................17

Figure 10 – Write Cycle Timing 3 (Shortened t

WHAX

and

Controlled) ...........................................17

ORDERING INFORMATION ............................................................................................................... 18

Table 13 – Ordering Part Number System for Parallel I/O MRAM..............................................................18

Table 14 – MR0A08B Ordering Part Numbers 1 ...............................................................................................18

PACKAGE OUTLINE DRAWINGS ....................................................................................................... 19

Figure 11 – 44-TSOP2 Package Outline...............................................................................................................19

Figure 12 – 48-BGA Package Outline ...................................................................................................................20

Figure 13 – 32-SOIC Package Outline 1 ..............................................................................................................21

REVISION HISTORY ........................................................................................................................... 22

HOW TO CONTACT US ....................................................................................................................... 23

MR0A08B Rev. 8.6, 3/2018

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