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3SMBJ5933B-TP

Description
Accuracy: ±5% Voltage regulation value (typical value): 22V Reverse leakage current: 1uA @ 16.7V Maximum power: 3W 22V, 3W
CategoryDiscrete semiconductor    Zener diode   
File Size269KB,4 Pages
ManufacturerMCC
Websitehttp://www.mccsemi.com
Download Datasheet Parametric View All

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3SMBJ5933B-TP Overview

Accuracy: ±5% Voltage regulation value (typical value): 22V Reverse leakage current: 1uA @ 16.7V Maximum power: 3W 22V, 3W

3SMBJ5933B-TP Parametric

Parameter NameAttribute value
Accuracy±5%
Stable voltage value (typical value)22V
Reverse leakage current1uA @ 16.7V
Maximum power3W
MCC
Micro Commercial Components
R
  omponents
20736 Marilla Street Chatsworth

  !"#
$ %    !"#
3SMBJ5913B
THRU
3SMBJ5956B
3.0 Watt
Surface Mount
Silicon
Zener Diodes
DO-214AA
(SMB) (LEAD FRAME)
Features
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
3.3thru 200 Volt Voltage Range
Low Inductance, Low Profile Mounting
Glasss Passivated Junction
Available On Tape and Reel
Halogen
free available upon request by adding suffix "-HF"
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Mechanical Data
Terminals solderable per MIL-STD-750, Method 2026
Polarity is indicated by cathode band.
Packaging: Standard 12mm Tape (see EIA 481)
A
Maximum temperature for soldering: 260
0
C for 10 seconds.
Maximum Ratings @ 25
o
C Unless Otherwise Specified
C
B
Maximum
Forward
Voltage
Steady State
Power
Dissipation
Operation and
Storage
Temperature
V
F
P
d
T
J
, T
STG
1.5V
3.0W
-65
o
C
o
to
+150 C
(Note:
2)
(Note:
3)
E
D
F
H
G
DIMENSIONS
INCHES
MIN
.160
.130
.006
.030
.200
.079
.075
.002
MM
MIN
4.06
3.30
0.15
0.76
5.08
2.00
1.91
0.05
Thermal Resistance
R
thJA
Junction to
Ambient
Note:
42
o
C
/W
DIM
A
B
C
D
E
F
G
H
MAX
.185
.155
.012
.060
.220
.096
.087
.008
MAX
4.70
3.94
0.31
1
..52
5.59
2.44
2.21
0.203
NOTE
1.
High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
2.
3.
Forward Current @ 200mA.
Mounted on 5.0mm (1oz thick) Iand areas.
Lead temperature at T
L
=75 C
o
2
SUGGESTED SOLDER
PAD LAYOUT
0.106"
0.083”
0.050”
www.mccsemi.com
Revision:
D
1 of 4
2017/09/15
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