Thick Film Chip Resistors
Description:
The resistors are constructed in a high grade ceramic body (aluminum oxide).
Internal metal electrodes are added at each end and connected by a resistive paste
that is applied to the top surface of the substrate. The composition of the paste is
adjusted to give the approximate resistance required and the value is trimmed to
within tolerance by laser cutting of this resistive layer.
The resistive layer is covered with a protective coat. Finally, the two external
end terminations are added. For ease of soldering the outer layer of these end
terminations is a Tin (lead free) alloy.
Features:
•
•
•
•
High reliability and stability
Reduced size of final equipment
Lower assembly costs
Higher component and equipment reliability
Application:
Quick Reference Data
Item
Series No.
Size code
Resistance Range
Resistance Tolerance
TCR (ppm/°C)
10MΩ ≥R >10
R≤10Ω
Max. dissipation
@ T
amb
=70°C
Max. Operation
Voltage (DC or RMS)
Max. Overload
Voltage (DC or RMS)
Climatic category
1/4 W
200V
400V
1/8 W
150V
300V
55/155/56
MCWR12
1206(3216)
•
•
•
Consumer electrical equipment
EDP, Computer application
Telecom application
General Specification
MCWR08
0805(2012)
MCWR06
0603(1608)
MCWR04
0402(1005)
1Ω to10MΩ 1% tolerance
1%
E96/E24
≤ ± 100
-200 to +400
1/10 W
75V
150V
1/16 W
50V
100V
Note :
1. Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined by
RCWV = Rated Power × Resistance Value or Max. RCWV listed above, whichever is lower.
2. The resistance of Jumper is defined <0.05Ω.
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V1.1
Thick Film Chip Resistors
MCWR12
L
W
T
Tb
Tt
3.1 ± 0.1
1.6 ± 0.1
0.6 ± 0.15
0.45 ± 0.2
0.5 ± 0.2
MCWR08
2 ± 0.1
1.25 ± 0.1
0.5 ± 0.15
0.4 ± 0.2
0.4 ± 0.2
MCWR06
1.6 ± 0.1
0.8 ± 0.1
0.45 ± 0.15
0.3 ± 0.15
0.3 ± 0.1
MCWR04
1 ± 0.05
0.50 ± 0.05
0.35 ± 0.05
0.25 ± 0.1
0.2 ± 0.1
Dimensions : Millimetres
Functional Description:
Product characterization
Standard values of nominal resistance is E96 series for resistors with a tolerance of ±1%.
Derating
The power that the resistor can dissipate depends on the operating temperature; see Fig.2
Figure 2
Maximum dissipation in percentage of rated power as
a function of the ambient temperature for MCWR12,
MCWR08, MCWR06, MCWR04
Mounting
Due to their rectangular shapes and small tolerances, Surface Mountable Resistors are suitable for handling by automatic
placement systems.
Chip placement can be on ceramic substrates and printed-circuit boards (PCBs).
Electrical connection to the circuit is by individual soldering condition.
The end terminations guarantee a reliable contact.
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V1.1
Thick Film Chip Resistors
Soldering Condition:
The robust construction of chip resistors allows them to be completely immersed in a solder bath of 260°C for 10 seconds.
Therefore, it is possible to mount Surface Mount Resistors on one side of a PCB and other discrete components on the
reverse (mixed PCBs).
Surface Mount Resistors are tested for solderability at 235°C during 2 seconds. The test condition for no leaching is 260°C for
30 seconds. Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 3.
260
245
217
Temp. (DegC)
200
max. ramp up rate = 3°C/s
max. ramp down rate = 6°C/s
150
For SnAgCu series solder pase
25
60–120 Sec
480 Sec max to Peak
Time
30 sec min
60–150 Sec
Fig 3. Infrared soldering profile for Chip Resistors
Catalogue Numbers:
The resistors have a catalogue number starting with
MCWR12
Size code
MCWR12 : 1206
MCWR08 : 0805
MCWR06 : 0603
MCWR04: 0402
X
:
±1%, 10Ω to 1MΩ
W
:
±1%, < 10Ω; >1MΩ
X
Type code
4.7Ω
10Ω
220Ω
Jumper
472_
Resistance code
=4R7_
=100_
=221_
=000_
J
Tolerance
F : ±1%
P : Jumper
T
Packaging code
T : 7" Reeled taping
Q : 10" Reeled taping
G : 13" Reeled taping
H : 13" reel 50Kpcs
only for 0402
B : Bulk
D : 7" reel 20Kpcs
only for 0402
A : 7" reel 15Kpcs
only for 0402
L
Termination
code
L
=
Sn base
(lead free)
("_" means a blank)
±1%, E24+E96: 3 significant
digits followed by no. of
zeros
102Ω
37.4KΩ
=1020
=3742
MCWR12, MCWR08, MCWR06:
1. Reeled tape packaging : 8mm width paper taping 5,000pcs per 7" reel, 10kpcs per 10" reel, 20kpcs per 13" reel.
2. Bulk packaging
: 5,000pcs per poly-bag
MCWR04:
1. Reeled tape packaging : 8mm width paper taping 10,000pcs per 7" reel, 20,000pcs per 10" reel. 70,000pcs per 13" reel.
2. Bulk packaging
: 10,000pcs per poly-bag
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V1.1
Thick Film Chip Resistors
Test and Requirements:
Essentially all tests are carried out according to the schedule of IEC publication 115-8, category LCT/UCT/56 (rated
temperature range : Lower Category Temperature, Upper Category Temperature; damp heat, long term, 56 days). The testing
also meets the requirements specified by EIA, EIAJ and JIS.
The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical robustness
testing procedure for electronic components" and under standard atmospheric conditions according to IEC 60068-1,
subclause 5.3. Unless otherwise specified, the following value supplied :
Temperature: 15°C to 35°C.
Relative humidity: 45% to 75%.
Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).
All soldering tests are performed with midly activated flux.
Requirement
Resistor
0Ω
Test
Procedure / Test Method
Electrical
Characteristics
JISC5201-1: 1998
Clause 4.8
-
DC resistance values measurement
-
Temperature Coefficient of Resistance (T.C.R)
Within the specified
tolerance Refer to
t
1
: 20°C+5°C/-1
°C; t
2
: -55°C or +155°C
"QUICK REFERENCE <50mΩ
DATA"
R
1
: Resistance at reference temperature (20°C
+5°C / -1
°C)
R
2
: Resistance at test temperature (-55°C
or +155°C)
Natural resistance change per change in degree centigrade.
±1%: ∆R/Rmax.
±(0.5%+0.05Ω )
no visible damage
<50mΩ
Resistance to
soldering heat(R.S.H) Un-mounted chips completely immersed for 10 ±1second in a
JISC5201-1:1998
SAC solder bath at 260°C ±5°C
Clause 4.18
Solderability
JISC5201-1: 1998
Clause 4.17
Temperature cycling
JISC5201-1: 1998
Clause 4.19
High Temperature
Exposure
MIL-STD-202
method 108
Bending strength
JISC5201-1: 1998
Clause 4.33
Adhesion
JISC5201-1: 1998
Clause 4.32
Short Time Overload
(STOL)
JISC5201-1: 1998
Clause 4.13
Un-mounted chips completely immersed for 10 ±1second in a
SAC
solder bath at 235°C ±5°C
30 minutes at -55°C ±3°C, 2-3 minutes at 20°C
+5°C -1°C,
30 minutes at
+155°C ±3°C, 2-3 minutes at 20°C
+5°C -1°C, total 5 continuous
cycles
1,000 +48/-0 hours; without load in a temperature chamber
controlled 155 ±3° C
Resistors mounted on a 90mm glass epoxy resin PCB(FR4),
bending once 3mm for 10sec, 5mm for MCWR04
Pressurizing force: 5N, Test time:
10
±1sec.
95% coverage min., good
tinning and no visible damage
±1%: ∆R/Rmax.
±(0.5%+0.05Ω)
No visible damage
±1%:∆R/
Rmax.±(1%+0.1Ω)
No visible damage
±1%:∆R/
Rmax.±(1%+0.05Ω)
No visual damaged
<50mΩ
<50mΩ
<50mΩ
No remarkable damage or
removal of the terminations
±1%: ∆R/R max.
±(1%+0.05Ω)
No visible damage
2.5 times RCWV or max. overload voltage, for 5seconds
<50mΩ
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V1.1
Thick Film Chip Resistors
Test
Load life in Humidity
JISC5201-1: 1998
Clause 4.24
Load life (endurance)
JISC5201-1: 1998
Clause 4.25
Procedure / Test Method
1000 +48/-0 hours, loaded with RCWV or Vmax in humidity
chamber controller at 40°C± 2°C and 90 to 95% relative humidity,
1.5hours on and 0.5 hours off
1000 +48/-0 hours, loaded with RCWV or Vmax in chamber
controller 70±2ºC, 1.5 hours on and 0.5 hours off
Requirement
Resistor
±1%: ∆R/R max.
±(1%+0.1Ω)
No visible damage
±1%: ∆R/R max.
±(1%+0.1Ω)
No visible damage
R
10GΩ
0Ω
<50mΩ
<50mΩ
Insulation Resistance
JISC5201-1: 1998
Apply the maximum overload voltage (DC) for 1minute
Clause 4.6
Dielectric Withstand
Voltage
JISC5201-1: 1998
Clause 4.7
Apply the maximum overload voltage (AC) for 1 minute
No breakdown or flashover
Test Condition For Jumper (0
Ω)
Item
Power Rating At 70°C
Resistance
Rated Current
Peak Current
Operating Temperature
2A
5A
1.5A
3.5A
MCWR12
1/4W
MCWR08
1/8W
MCWR06
1/10W
MAX. 50mΩ
1A
3A
1A
2A
MCWR04
1/16W
-55°C to +155° C
Packaging:
Paper Tape specifications
Dimensions : Millimetres
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Page <5>
21/12/16
V1.1
NXP MCU
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