(for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
O05E.pdf
Nov.25,2013
Introduction
Murata has various chip inductors for every application such as power
circuits and high frequency circuits.
There are 3 types of structure: wirewound, multilayer, and film.
These variations enable the best selection for every user's needs.
We will support customers using material technologies and highly
developed design technologies.
Explanation of symbols in this catalog
Features of each series
New product
Reflow
Reflow soldering applicable
Flow OK
Flow soldering applicable
OK
XX
Max height xxmm
Low Rdc
Low DC resistance type
Bias
Bias current characteristics
improved
E12 step inductance variation
E24 step inductance variation
Hi Q type
Tight inductance tolerance
available
Features of each item
New product
Design kit available
EU RoHS Compliant
All the products in this catalog comply with EU RoHS.
EU RoHS is "the European Directive 2011/65/EU on the Restriction of the Use of Certain
Hazardous Substances in Electrical and Electronic Equipment."
For more details, please refer to our website 'Murata's Approach for EU RoHS'
(http://www.murata.com/info/rohs.html).
!Note
• Please read rating and
!CAUTION
(for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
(for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
RF Inductors
Inductors for Power Lines
Classification and Structure of Chip Inductors
·········
2
Classification and Structure of Chip Inductors
oLine
Up and Applications for Chip Inductors
Line Up
Wire Wound Type
Ferrite Core
LQH Series
(With some
exceptions.)
Applications
For Power Lines /
For Low Frequency
Circuits
(Under 100MHz)
For Voltage Conversion
For Choke
For Resonance Circuits
For Low Frequency Filter Circuits
Multilayer Type
Ferrite Core
LQM Series
Wire Wound Type
Ferrite Core
for High Frequency
LQW_H Series
LQH_H Series
Wire Wound Type
Non-magnetic Core
LQW_A Series
For Impedance Matching
For High Frequency Filter Circuits
For RF Choke
RF Inductors
(Greater than 100MHz)
Multilayer Type
Non-magnetic Material
LQG Series
Film Type
Non-magnetic Material
LQP Series
oConstruction
and Features of Chip Inductors
Construction
Wire Wound Type
Wire
Some products
are coated with
magnetic resin.
Features
Ferrite core
Wide inductance range
Good DC bias current
characteristics
For Power Lines /
For General Circuits
Electrode
Multilayer Type
Coil pattern
Electrode
Ferrite
Small and lightweight
Low DC resistance
!Note
• Please read rating and
!CAUTION
(for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
O05E.pdf
Nov.25,2013
2
Construction
Wire Wound Type
For Radio Frequency
Wire
Electrode
Resin coating
on the top
Non-magnetic
ceramic core
Features
High Q
Large inductance
Wire Wound Type
For Intermediate
Frequency
Wire
Electrode
Resin coating
on the top
Ferrite core for
high frequency
High Q at intermeditate
frequency
RF Inductors
Multilayer Type
Coil pattern
Industrial standard design
Outer electrode
Non-magnetic
ceramic
Film Type
Inner electrode,
which is produced
using
photolithography
process
Outer electrode
Small size, but high Q
oTechnical
Data
1. Land Area and Q-F Characteristics
LQH32MN680K23
PCB: Ag-Pb printed land formed on 0.6mm-thick
alumina plate
Soldering: Reflow soldering
Solder layer: Sections shown by oblique lines in figure
2. Coupling Coefficient Versus Distance between Parts
14
12
LQH32M Series
Distance between parts
100
80
Coupling Coefficient (%)
10
8
6
4
1μH
330μH
A
60
B
Q
40
20
0
10k
C
2
0
50k
100k
500k
Frequency (Hz)
A : Net characteristics without land pattern
B:
1
1.3
1
5.5
2.5
1
1M
5M
10M
0
1
2
3
4
5
6
Distance between Parts (mm)
Characteristic of chip mounted on land
2
C:
2.5
1
2.5
Characteristic of chip mounted on land
(in mm)
!Note
• Please read rating and
!CAUTION
(for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
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Microcontroller MCU
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