Reference Spec.No.JENF243A-0029F-01
Reference Only
P1/8
High-GHz Noise Suppression Chip Ferrite Bead
BLM15G□□□□SN1□ Reference Specification
1.Scope
This reference specification applies to Chip Ferrite Bead BLM15G_SN series.
2.Part Numbering
(ex.)
BL
M
15
GG
221
S
N
1
D
(1)
(2)
(3)
(4)
(5)
(6) (7) (8)
(9)
(1)Product ID (2)Type (3)Dimension(L×Ｗ) (4)Characteristics (5)Typical Impedance at 100MHz
(6)Performance (7)Category (8)Numbers of Circuit (9)Packaging(D:Taping / B:Bulk)
Impedance (Ω)
(Under Standard
Testing Condition)
at 100MHz
BLM15GG221SN1D
BLM15GG221SN1B
BLM15GG471SN1D
BLM15GG471SN1B
BLM15GA750SN1D
BLM15GA750SN1B
220±25%
470±25%
75±25%
at 1GHz
600±40%
1200±40%
1000±40%
DC Resistance
(Ω max.)
Values
Initial
After
Values
Testing
0.7 max
1.3 max
1.3 max
0.8 max
1.4 max
1.4 max
3.Rating
Customer
Part Number
MURATA
Part Number
Rated
Current
(mA)
300
200
200
■Operating
Temperature : -55°C to +125°C
4
.Style and Dimensions
1.0±0.05
0.5±0.05
0.5±0.05
■Storage
Temperature : -55°C to +125°C
■
Equivalent Circuit
0.25±0.1
(
: Electrode
(in mm)
Resistance element becomes
dominant at high frequencies.
)
■
Unit Mass (Typical value)
0.001g
5.Marking
No marking.
6.Standard Testing Conditions
<
Unless otherwise specified
>
Temperature : Ordinary Temp. (15 °C to 35 °C )
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
<
In case of doubt
>
Temperature : 20°C±2 °C
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
7.Specifications
7-1.Electrical Performance
No.
Item
7-1-1 Impedance
Specification
Meet item 3.
Test Method
Measuring Frequency : 100MHz±1MHz , 1GHz±1MHz
Measuring Equipment :
KEYSIGHT4291A
or the equivalent
Test Fixture :
KEYSIGHT16192A
or the equivalent
Measuring Equipment : Digital multi meter
*Except resistance of the Substrate and Wire
7-1-2 DC Resistance
Meet item 3.
MURATA MFG.CO.,LTD.
Reference Spec.No.JENF243A-0029F-01
Reference Only
Test Method
Visual Inspection and measured with Slide Calipers.
It shall be soldered on the substrate.
Applying Force(F) : 5N
Applying Time : 5s±1s
Applying Direction: Parallel to the substrate.
Ｆ
Side view
Ｆ
R0.5
P2/8
7-2.Mechanical Performance
No.
Item
7-2-1 Appearance and
Dimensions
7-2-2 Bonding
Strength
Specification
Meet item 4.
Meet Table 1.
Table 1
Appearance
Impedance
Change
(at 100MHz)
DC
Resistance
No damage
Within ±30%
Meet item 3.
Substrate
7-2-3 Bending
Strength
It shall be soldered on the substrate.
Substrate: Glass-epoxy 100mm×40mm×0.8mm
Deflection : 2.0mm
Speed of Applying Force : 0.5mm/s
Keeping Time : 30s
Pressure jig
F
Deflection
45mm
45mm
R340
Product
7-2-4
Vibration
7-2-5 Resistance
to Soldering
Heat
7-2-6
Drop
Products shall be no failure
after tested.
7½2-7 Solderability
The electrodes shall be at
least 95% covered with new
solder coating.
It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 2000Hz to 10Hz
for 20 min
Total Amplitude 1.5mm or Acceleration 196m/s
2
whichever is smaller
Testing Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 h)
Pre-Heating : 150°C±10°C, 60s½90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270°C±5°C
Immersion Time : 10s±0.5s
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room condition
for 48h±4h.
It shall be dropped on concrete or steel board.
Method : free fall
Height : 75cm
Attitude from which the product is dropped: 3 direction
The number of times : 3 times for each direction
(Total 9 times)
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C±10°C, 60s½90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240°C±5°C
Immersion Time : 3s±1s
Immersion and emersion rates : 25mm/s
MURATA MFG.CO.,LTD.
Reference Spec.No.JENF243A-0029F-01
7-3.Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
7-3-1 Temperature Meet Table 1.
Cycle
Reference Only
Test Method
P3/8
7-3-2 Humidity
7-3-3 Heat Life
7-3-4 Cold
Resistance
1 cycle:
1 step:-55
°C(+0 °C,-3 °C)
/ 30min±3min
2 step:Ordinary temp. / 3min max.
3 step:+125
°C(+3 °C,-0 °C)
/ 30min±3min
4 step: Ordinary temp. / 3min max.
Total of 100 cycles
Then measured after exposure in the room condition for 48h±4h.
Temperature : 70°C±2°C
Humidity : 90%RH to 95%RH
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
Temperature : 125°C±3°C
Applying Current : Rated Current (at Test temperature)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
Temperature : -55±2°C
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
8. Specification of Packaging
8-1.Appearance and Dimensions
(8mm-wide paper tape)
2.0±0.05
2.0±0.05 4.0±0.1
φ
1.5
-0
+0.1
1.75±0.1
3.5±0.05
1.15(Typ.)
0.65(Typ.)
8.0±0.3
0.8max.
Direction of Feed
(in mm)
(1) Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide, 2mm-pitch continuously and sealed
by top tape and bottom tape.
(2) Sprocket hole:Sprocket hole shall be located on the left hand side toward the direction of feed.
(3) Spliced point:The base tape and top tape have no spliced point
(4) Cavity:There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
8-2.Tape Strength
(1)Pull Strength
Top tape
5N min.
Bottom tape
(2)Peeling off force of Cover tape
0.1N to 0.6N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
165 to 180 degree
Top tape
F
Bottom tape
Base tape
MURATA MFG.CO.,LTD.
Reference Spec.No.JENF243A-0029F-01
8-3.Taping Condition
Reference Only
P4/8
(1)Standard quantity per reel
Quantity per 180mm reel
10000 pcs. / reel
(2)There shall be leader-tape(top tape and empty tape) and trailer- tape(empty tape) as follows.
(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape
for more than 5 pitch.
(4)Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity, etc)
∗1)
« Expression of Inspection No. »
(1)
Factory Code
(2)
Date
□□
(1)
OOOO
×××
(2)
(3)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep.
→
1 to 9, Oct. to Dec.
→
O,N,D
Third, Fourth digit : Day
ROHS – Y (△)
(1) (2)
(3)
Serial No.
∗2)
« Expression of RoHS marking »
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
(5) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked on
a label and the label is stuck on the box.
(Customer name, Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS marking(∗2) , Quantity , etc)
(6)Dimensions of reel and taping(leader-tape, trailer-tape)
Trailer
2.0±0.5
160 min.
Leader
Label
190 min.
Empty tape
φ
13.0±0.2
210 min.
Top tape
1
φ
60±
0
9±
1
0
13±1.4
φ
180±
3
0
φ
21.0±0.8
Direction of feed
(in mm)
8-4. Specification of Outer Case
Outer Case Dimensions
Standard Reel Quantity in Outer Case
(mm)
(Reel)
W
D
H
186
186
93
5
∗
Above Outer Case size is typical. It depends on a quantity of an order.
Label
H
D
W
9.
！
Caution
9-1. Surge current
Excessive surge current ( pulse current or rush current) than specified rated current applied to the product may cause
a critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
MURATA MFG.CO.,LTD.
Reference Spec.No.JENF243A-0029F-01
9-2.Limitation of Applications
Reference Only
P5/8
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment
(6)Disaster prevention / crime prevention equipment
(2)Aerospace equipment
(7)Traffic signal equipment
(3)Undersea equipment
(8)Transportation equipment (vehicles, trains, ships, etc.)
(4)Power plant control equipment
(9)Applications of similar complexity and /or reliability requirements
(5)Medical equipment
to the applications listed in the above
10. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1.Land pattern designing
•
Standard land dimensions (Reflow soldering)
Chip Ferrite Bead
0.5
0.4
1.2½1.4
Solder Resist
Pattern
(in mm)
10-2.Soldering Conditions
(1) Flux,Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100
µm
to 200
μm
(2) Soldering conditions
•
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100℃ max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
•
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Temp.
(℃)
260℃
245℃±3℃
220℃
180
150
230℃
Limit Profile
30s½60s
Standard Profile
60s max.
90s±30s
Time.
(s)
Pre-heating
Heating
Peak temperature
Cycle of reflow
Standard Profile
150½180°C
、90s±30s
above 220°C、30s½60s
245±3°C
2 times
Limit Profile
above 230°C、60s max.
260°C,10s
2 times
MURATA MFG.CO.,LTD.
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