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74LVC574APW

Categorylogic    logic   
File Size101KB,10 Pages
ManufacturerNexperia
Websitehttps://www.nexperia.com
Environmental Compliance
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74LVC574APW Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNexperia
package instructionTSSOP-20
Reach Compliance Codecompliant
Other featuresBROADSIDE VERSION OF 374
seriesLVC/LCX/Z
JESD-30 codeR-PDSO-G20
JESD-609 codee4
length6.5 mm
Logic integrated circuit typeBUS DRIVER
Humidity sensitivity level1
Number of digits8
Number of functions1
Number of ports2
Number of terminals20
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)260
propagation delay (tpd)15.1 ns
Maximum seat height1.1 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)1.2 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width4.4 mm
INTEGRATED CIRCUITS
74LVC574A
Octal D-type flip-flop with 5-volt tolerant
inputs/outputs; positive edge-trigger
(3-State)
Product specification
1998 Jul 29
Philips
Semiconductors

74LVC574APW Related Products

74LVC574APW 74LVC574AD,118
Description
Maker Nexperia Nexperia
package instruction TSSOP-20 SOP,
Reach Compliance Code compliant compliant
Other features BROADSIDE VERSION OF 374 BROADSIDE VERSION OF 374
series LVC/LCX/Z LVC/LCX/Z
JESD-30 code R-PDSO-G20 R-PDSO-G20
JESD-609 code e4 e4
length 6.5 mm 12.8 mm
Logic integrated circuit type BUS DRIVER BUS DRIVER
Humidity sensitivity level 1 1
Number of digits 8 8
Number of functions 1 1
Number of ports 2 2
Number of terminals 20 20
Maximum operating temperature 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C
Output characteristics 3-STATE 3-STATE
Output polarity TRUE TRUE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP SOP
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Celsius) 260 260
propagation delay (tpd) 15.1 ns 10 ns
Maximum seat height 1.1 mm 2.65 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V
Minimum supply voltage (Vsup) 1.2 V 1.2 V
Nominal supply voltage (Vsup) 1.8 V 2.7 V
surface mount YES YES
technology CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Terminal form GULL WING GULL WING
Terminal pitch 0.65 mm 1.27 mm
Terminal location DUAL DUAL
Maximum time at peak reflow temperature 30 30
width 4.4 mm 7.5 mm

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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