†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
2
BCP56T1 Series
TYPICAL ELECTRICAL CHARACTERISTICS
1000
T
J
= 125°C
T
J
= 25°C
100
T
J
= − 55°C
hFE, DC CURRENT GAIN
10
1
10
I
C
, COLLECTOR CURRENT (mA)
100
1000
Figure 1. DC Current Gain
BANDWIDTH PRODUCT (MHz)
1000
80
60
C, CAPACITANCE (pF)
40
C
ibo
T
J
= 25°C
100
20
f T, CURRENT-GAIN
10
8.0
6.0
C
obo
0.2
0.5 1.0 2.0
5.0 10
20
V
R
, REVERSE VOLTAGE (VOLTS)
50
100
10
1.0
100
10
I
C
, COLLECTOR CURRENT (mA)
1000
4.0
0.1
Figure 2. Current-Gain − Bandwidth Product
Figure 3. Capacitance
1.0
0.8
V, VOLTAGE (VOLTS)
0.6
0.4
0.2
V
CE(sat)
@ I
C
/I
B
= 10
0
0.5
1.0
2.0
100
5.0
10
20
50
I
C
, COLLECTOR CURRENT (mA)
200
500
T
J
= 25°C
V
BE(sat)
@ I
C
/I
B
= 10
V
BE(on)
@ V
CE
= 1.0 V
VCE , COLLECTOR-EMITTER VOLTAGE (VOLTS)
1.0
T
J
= 25°C
0.8
0.6
0.4
0.2
0
0.05
I
C
= 10 mA
50
mA
100 mA
250 mA
500 mA
0.1
0.2
0.5
5.0
10
1.0 2.0
I
C
, COLLECTOR CURRENT (mA)
20
50
Figure 4. “On” Voltages
Figure 5. Collector Saturation Region
http://onsemi.com
3
BCP56T1 Series
PACKAGE DIMENSIONS
SOT−223 (TO−261)
CASE 318E−04
ISSUE K
A
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN
MAX
A
0.249
0.263
B
0.130
0.145
C
0.060
0.068
D
0.024
0.035
F
0.115
0.126
G
0.087
0.094
H
0.0008 0.0040
J
0.009
0.014
K
0.060
0.078
L
0.033
0.041
M
0
_
10
_
S
0.264
0.287
STYLE 1:
PIN 1.
2.
3.
4.
BASE
COLLECTOR
EMITTER
COLLECTOR
MILLIMETERS
MIN
MAX
6.30
6.70
3.30
3.70
1.50
1.75
0.60
0.89
2.90
3.20
2.20
2.40
0.020
0.100
0.24
0.35
1.50
2.00
0.85
1.05
0
_
10
_
6.70
7.30
4
S
1
2
3
B
D
L
G
J
C
0.08 (0003)
H
M
K
SOLDERING FOOTPRINT*
3.8
0.15
2.0
0.079
2.3
0.091
2.3
0.091
6.3
0.248
2.0
0.079
mm
1.5
SCALE 6:1
inches
0.059
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
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