BAS21HT1G, BAS21HT3G,
NSVBAS21HT1G,
NSVBAS21HT3G
High Voltage
Switching Diode
www.onsemi.com
Features
•
NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
•
These are Pb−Free Devices
MAXIMUM RATINGS
Rating
Continuous Reverse Voltage
Repetitive Peak Reverse Voltage
Peak Forward Current
Repetitive Peak Forward Current
Non−Repetitive Peak Forward Surge
Current, 60 Hz
Non−Repetitive Peak Forward Current
(Square Wave, T
J
= 25°C prior to
surge)
t = 1
ms
t = 10
ms
t = 100
ms
t = 1 ms
t=1s
Symbol
V
R
V
RRM
I
F
I
FRM
I
FSM(surge)
I
FSM
20
20
10
4
1
Value
250
250
200
500
625
Unit
Vdc
Vdc
mAdc
mA
mAdc
A
1
HIGH VOLTAGE
SWITCHING DIODE
1
CATHODE
2
ANODE
2
MARKING
DIAGRAM
SOD−323
CASE 477
STYLE 1
JS M
G
G
JS
M
G
= Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending up-
on manufacturing location.
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR−5 Board,
(Note 1) T
A
= 25°C
Derate above 25°C
Thermal Resistance,
Junction−to−Ambient
Junction and Storage Temperature
Range
Symbol
P
D
Max
200
1.57
R
qJA
T
J
, T
stg
635
−55 to
+150
Unit
mW
mW/°C
°C/W
°C
ORDERING INFORMATION
Device
BAS21HT1G,
NSVBAS21HT1G
BAS21HT3G,
NSVBAS21HT3G
Package
SOD−323
(Pb−Free)
SOD−323
(Pb−Free)
Shipping
†
3000 / Tape & Reel
10000 / Tape &
Reel
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−5 Minimum Pad
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2016
1
June, 2016 − Rev. 11
Publication Order Number:
BAS21HT1/D
BAS21HT1G, BAS21HT3G, NSVBAS21HT1G, NSVBAS21HT3G
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C unless otherwise noted)
Characteristic
OFF CHARACTERISTICS
Reverse Voltage Leakage Current
(V
R
= 200 Vdc)
(V
R
= 200 Vdc, T
J
= 150°C)
Reverse Breakdown Voltage
(I
BR
= 100
mAdc)
Forward Voltage
(I
F
= 100 mAdc)
(I
F
= 200 mAdc)
Diode Capacitance
(V
R
= 0, f = 1.0 MHz)
Reverse Recovery Time
(I
F
= I
R
= 30 mAdc, R
L
= 100
W)
I
R
−
−
V
(BR)
V
F
−
−
C
D
t
rr
−
−
1000
1250
5.0
50
pF
ns
250
0.1
100
−
Vdc
mV
mAdc
Symbol
Min
Max
Unit
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
820
W
+10 V
2.0 k
100
mH
0.1
mF
D.U.T.
50
W
OUTPUT
PULSE
GENERATOR
50
W
INPUT
SAMPLING
OSCILLOSCOPE
V
R
INPUT SIGNAL
90%
I
R
i
R(REC)
= 3.0 mA
OUTPUT PULSE
(I
F
= I
R
= 30 mA; MEASURED
at i
R(REC)
= 3.0 mA)
I
F
0.1
mF
t
r
10%
t
p
t
I
F
t
rr
t
Notes: 1. A 2.0 kW variable resistor adjusted for a Forward Current (I
F
) of 30 mA.
Notes:
2. Input pulse is adjusted so I
R(peak)
is equal to 30 mA.
Notes:
3. t
p
» t
rr
Figure 1. Recovery Time Equivalent Test Circuit
www.onsemi.com
2
BAS21HT1G, BAS21HT3G, NSVBAS21HT1G, NSVBAS21HT3G
PACKAGE DIMENSIONS
SOD−323
CASE 477−02
ISSUE H
H
E
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING
WITH SOLDER PLATING.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
5. DIMENSION L IS MEASURED FROM END OF RADIUS.
MILLIMETERS
DIM MIN
NOM MAX
A
0.80
0.90
1.00
A1
0.00
0.05
0.10
A3
0.15 REF
b
0.25
0.32
0.4
C
0.089
0.12 0.177
D
1.60
1.70
1.80
E
1.15
1.25
1.35
L
0.08
H
E
2.30
2.50
2.70
STYLE 1:
PIN 1. CATHODE
2. ANODE
MIN
0.031
0.000
INCHES
NOM MAX
0.035 0.040
0.002 0.004
0.006 REF
0.010 0.012 0.016
0.003 0.005 0.007
0.062 0.066 0.070
0.045 0.049 0.053
0.003
0.090 0.098 0.105
b
1
2
E
A3
A
L
NOTE 5
C
NOTE 3
A1
SOLDERING FOOTPRINT*
0.63
0.025
0.83
0.033
1.60
0.063
2.85
0.112
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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4
BAS21HT1/D
DSP and ARM Processors
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