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1SMB5923BT3G

Description
Accuracy: ±5% Voltage regulation value (typical value): 8.2V Reverse leakage current: 5uA @ 6.5V Maximum power: 3W 8.2V, 3W
CategoryDiscrete semiconductor    diode   
File Size74KB,6 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
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1SMB5923BT3G Overview

Accuracy: ±5% Voltage regulation value (typical value): 8.2V Reverse leakage current: 5uA @ 6.5V Maximum power: 3W 8.2V, 3W

1SMB5923BT3G Parametric

Parameter NameAttribute value
Brand NameON Semiconductor
Is it lead-free?Lead free
MakerON Semiconductor
Parts packaging codeDO-214
package instructionR-PDSO-L2
Contacts2
Manufacturer packaging code403A-03
Reach Compliance Codenot_compliant
ECCN codeEAR99
Factory Lead Time15 weeks
Samacsys Confidence2
Samacsys StatusReleased
Samacsys PartID410604
Samacsys Pin Count2
Samacsys Part CategoryZener Diode
Samacsys Package CategoryDiodes Moulded
Samacsys Footprint NameSMB CASE 403A-03
Samacsys Released Date2017-05-04 08:31:21
Is SamacsysN
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance3.5 Ω
JEDEC-95 codeDO-214AA
JESD-30 codeR-PDSO-L2
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation0.55 W
Certification statusNot Qualified
Nominal reference voltage8.2 V
surface mountYES
technologyZENER
Terminal surfaceTin (Sn)
Terminal formL BEND
Terminal locationDUAL
Maximum time at peak reflow temperature40
Maximum voltage tolerance5%
Working test current45.7 mA
Base Number Matches1
1SMB59xxBT3G Series,
SZ1SMB59xxT3G Series
3 Watt Plastic
Surface Mount
Zener Voltage Regulators
This complete new line of 3 W Zener diodes offers the following
advantages.
Features
www.onsemi.com
Zener Voltage Range − 3.3 V to 200 V
ESD Rating of Class 3 (> 16 kV) per Human Body Model
Flat Handling Surface for Accurate Placement
Package Design for Top Side or Bottom Circuit Board Mounting
AEC−Q101 Qualified and PPAP Capable − SZ1SMB59xxT3G
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
These are Pb−Free Devices*
Mechanical Characteristics:
CASE:
Void-free, transfer-molded plastic
FINISH:
All external surfaces are corrosion resistant and leads are
PLASTIC SURFACE MOUNT
ZENER VOLTAGE
REGULATOR DIODES
3.3−200 V, 3 W DC POWER
SMB
CASE 403A
PLASTIC
Cathode
Anode
readily solderable
MAXIMUM LEAD TEMPERATURE FOR SOLDERING PURPOSES:
MARKING DIAGRAM
260°C for 10 Seconds
LEADS:
Modified L−Bend providing more contact area to bond pads
POLARITY:
Cathode indicated by polarity band
FLAMMABILITY RATING:
UL 94 V−0
MAXIMUM RATINGS
Rating
Maximum Steady State Power
Dissipation @ T
L
= 75°C
Measured at Zero Lead Length
Derate Above 75°C
Thermal Resistance from Junction−to−Lead
Maximum Steady State Power
Dissipation @ T
A
= 25°C (Note )
Derate Above 25°C
Thermal Resistance from
Junction−to−Ambient
Operating and Storage Temperature Range
Symbol
P
D
R
qJL
P
D
R
qJA
T
J
, T
stg
Value
3.0
40
25
550
4.4
226
−65 to
+150
Unit
W
mW/°C
°C/W
mW
mW/°C
°C/W
°C
A
Y
WW
9xxB
G
AYWW
9xxB
G
G
= Assembly Location
= Year
= Work Week
= Device Code (Refer to page 3)
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
1SMB59xxBT3G
SZ1SMB59xxBT3G
Package
SMB
(Pb−Free)
SMB
(Pb−Free)
Shipping
2,500 /
Tape & Reel
2,500 /
Tape & Reel
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−4 board, using recommended footprint.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
©
Semiconductor Components Industries, LLC, 2016
1
April, 2016 − Rev. 9
Publication Order Number:
1SMB5913BT3/D

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